• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.10
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• pp.687-698
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• 2001

This paper presents a three dimensional stacked pad area away (PAA) package configuration as an implementation method of radio frequency (RF) circuits. 224MHz RF circuits of intelligence traffic system(ITS) were constructed with the stacked PAA RF pakage configuration. In the process of manufacturing the stacked PAA RF pakage, RF circuits were partitioned to subareas following their function and operating frequency. Each area of circuits separated to each subunits. The operating characteristics of RF PAA package module and the electrical properties of each subunits were examined. The measurement of electrical parameters for solder balls which were interconnects for stacked PAA RF packages showed that the parasitic capacitance and inductance were 30fF and 120pH, respectively, which might be negligible in PAA RF packaging system. HP 4396B network/spectrum analyzer revealed that the amplification gain of a receiver and transmitter at 224 MHz was 22dB and 27dB, respectively. The gain was 3dB lower than designed values. The difference was probably generated from fabrication process of the circuits by employing commercial standard

• Journal of the Korean Society of Food Science and Nutrition
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• v.41 no.3
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• pp.418-429
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• 2012

In this study we surveyed the packaging preferences of consumers for Korean rice cakes as current commercial products in Korea. The questionnaire was developed from a preliminary investigation of typical rice cake packaging patterns and sent to 2332 residents in Korea by random sampling mail. The questionnaire contained questions on the preferences of interior design in packaging, opening methods, individually separated types, printing position, packaging methods, and packaging materials such as paper and plastic. There were responses from 304 residents. The collected data was analyzed by an SPSS package program. Most of the packaging used for Korean rice cakes was plastic (58.9%) which was used for packaging materials and stretch wrap (42.9%) as packing methods. The results showed the preference was the perforated line type used by hand for opening a packaging and interior packaging design with 2~3 partitions. Most respondents expressed an interest in using individual packaging and having printing directly on the packaging. Also, the respondents preferred the packaging design that let them see the contents of a package. Based on the results of the questionnaire, this paper suggested that most consumers would prefer to choose a packaging system with a partition design in a plastic container, individually separated products, and a transparent container for Korean rice cakes. The results of packaging preferences could provide important information for suitable packaging development for Korean rice cakes. Further research should be conducted to improve the shelf life of Korean rice cakes with functional packaging systems such as modified atmosphere packaging or anti-microbial packaging.

• Journal of Information Technology Applications and Management
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• v.21 no.4_spc
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• pp.381-401
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• 2014

This study proposes the accurate economic effect (employment inducement coefficient, hiring inducement coefficient, index of the sensitivity of dispersion, index of the power of dispersion, and ratio of value added) of Korea software industry by analyzing the inter-industry relation using the modified inter-industry table. Some previous studies related to the inter-industry analysis were reviewed and the key problems were identified. First, in the current inter-industry table publishedby the Bank of Korea, the output of software industry includes not only the output of pure software industry (package software and IT services) but also the output of non-software industry due to the misclassification of the industry. This causes the output to become bigger than the actual output of the software industry. Second, during rewriting the inter-industry table, the output is changing. The inter-industry table is the table in the form of rows and columns, which records the transactions of goods and services among industries which are required to continue the activities of each industry. Accordingly, if only an output of a specific industry is changed, the reliability of the table would be degraded because the table is prepared based on the relations with other industries. This possibly causes the economic effect coefficient to degrade reliability, over or under estimated. This study tries to correct these problems to get the more accurate economic effect of the software industry. First, to get the output of the pure software section only, the data from the Korea Electronics Association(KEA) was used in the inter-industry table. Second, to prevent the difference in the outputs during rewriting the inter-industry table, the difference between the output in the current inter-industry table and the output from KEA data was identified and then it was defined as the non-software section output for the analysis. The following results were obtained: The pure software section's economic effect coefficient was lower than the coefficient of non-software section. It comes from differenceof data to Bank of Korea and KEA. This study hasa signification from accurate economic effect of Korea software industry.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.37-42
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• 2016

While datacenter operation cost increases with electricity price rise, many researchers study low-power processor based supercomputers to reduce power consumption of datacenters. Reliability of low-power processors for supercomputers can be of concern since the reliability of many low-power processors are assessed based on mobile use conditions. This paper assessed the reliability of low-power processor packages based on supercomputer use conditions. Temperature cycling was determined as a critical failure cause of low-power processor packages through literature surveys and failure mode, effect and criticality analysis. The package temperature was measured at multiple processor load conditions to examine the relationship between processor load and package temperature. A physics-of-failure reliability model associated with temperature cycling predicted the expected lifetime of low-power processors to be less than 3 years. Recommendations to improve the lifetime of low-power processors were presented based on the experimental results.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.9 s.351
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• pp.64-68
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• 2006

Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.45-52
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• 2011

It is known that test methods to evaluate solder joint reliability are die shock test, die shear test, 3points bending test, and thermal shock test. The present study investigated the effects of failure mode on 3 types (as-reflowed, $85^{\circ}C$/85%RH treatment, and $150^{\circ}C$/10hr aging) of solder joints for flip-chip BGA package by using various test methods. The test methods and configurations are reported in detail, i.e. die shock, die shear, 3points bending, and thermal shock test. We focus on the failure mode of solder joints under various tests. The test results indicate that die shock and die shear test method can reveal brittle fracture in flip-chip ball grid array (FCBGA) packages with higher sensitivity.

• Journal of KIISE
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• v.44 no.9
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• pp.878-886
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• 2017

This paper discusses performance bottlenecks that may occur when executing high-performance computing MPI applications in the Intel's next generation many-core processor called Knights Landing(KNL), as well as effective resource allocation techniques to solve this problem. KNL is composed of a host processor to enable self-booting in addition to an existing accelerator consisting of a many-core processor, and it was released with a new type of on-package memory with improved bandwidth on top of existing DDR4 based memory. We empirically verified an improvement of the execution performance of multiple MPI applications and the overall system utilization ratio by studying a resource allocation method optimized for such new many-core processor architectures.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.5
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• pp.347-356
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• 2001

The issues that influence the packaging of high-speed LiNbO$_{3}$ modulators are discussed, and packaging approaches that result in only minor degradation of the modulator's RF performance are described. The primary problems dealt in this paper, associated with high-speed device packaging, are fallen into the following five categories: die features, pigtailing, suppression of RF package resonance, RF launcher approach, termination approach. By considering factors to influence the modulator performance in packaging, a LiNbO$_{3}$ intensity modulator was fabricated and packaged to have S21 better than -3㏈ upto 10㎓ and S11 below -l5㏈ upto 18㎓.

• Publications of The Korean Astronomical Society
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• v.15 no.spc2
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• pp.45-52
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• 2000

Four plasma instruments are currently under development for KAISTSAT-4 (K-4) which is scheduled for launch in 2002. They are the Solid-State Telescope, Electro-Static Analyzer, Langmuir Probe, and the Scientific Magnetometer, that will respectively allow in-situ detection of high energy and low energy components of auroral particles, ionospheric thermal electrons, and magnetic field disturbances. These instruments, together with the Far-ultraviolet IMaging Spectrograph, will provide micro-scale physics of Earth's polar ionosphere with detailed spectral information that has not been previously achieved with other space missions. In this paper, we review the concept of the four space plasma instruments as well as the anticipated results from the instruments.

• Journal of Environmental Science International
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• v.18 no.5
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• pp.489-499
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• 2009

In an effort to examine the Regional Atmospheric Modeling System (RAMS ver. 4.3) to the initial meteorological input data, detailed observational data of NOAA satellite SST (Sea Surface Temperature) was employed. The NOAA satellite SST which is currently provided daily as a seven-day mean value with resolution of 0.1 $^{\circ}$ grid spacing was used instead of the climatologically derived monthly mean SST using in RAMS. In addition, the RAMS SST data must be changed new one because it was constructed in 1993. For more realistic initial meteorological fields, the NOAA satellite SST was incorporated into the RAMS-preprocess package named ISentropic Analysis package (ISAN). When the NOAA SST data was imposed to the initial condition of prognostic RAMS model, the resultant performance of near surface atmospheric fields was discussed and compared with that of default option of SST. We got the good results that the new SST data was made in a standard RAMS format and showed the detailed variation of SST. As the modeling grid became smaller, the SST differences of the NOAA SST run and the RAMS SST43 (default) run in diurnal variation were very minor but this research can apply to further study for the realistic SST situation and the development in predicting regional atmospheric field which imply the regional circulation due to differential surface heating between sea and land or climatological phenomenon.