• Title/Summary/Keyword: package information

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Hotel Reservation Service, Customer Expectations, Brand Attachment, and Brand Loyalty: Effects of Package Product Reservation

  • Chang, Jae-Hyup;Yoon, Ki-Chang;Park, Chang-Soo
    • Journal of Distribution Science
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    • v.12 no.12
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    • pp.27-41
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    • 2014
  • Purpose - This study examines various reservation service components that would increase customers' brand attachment and loyalty, while discussing how reservation service components would affect the customer behaviors. Research design, data, and methodology - This study theoretically analyzed the hotel package product reservation system, the customer expectations, the brand attachment, and the brand loyalty, while reviewing previous studies. Results - This study analyzed the distribution channels of the hotel package products from various angles and, as for more extensive research, the study explained the different results caused by each different reservation system type that may be preferred by each individual customer. Conclusions - It was confirmed that, of the hotel reservation service components, the convenience factors, the reliability factors, the information factors, and the other factors other than the human factors, have a significant influence on the customer expectations. Further, the study also revealed that the customer expectation has an important effect on the brand attachment. In addition, the study improved the prevailing understanding on the relation between the brand attachment and the brand loyalty.

SPDX Parser and Validator for Software Compliance (소프트웨어 컴플라이언스를 위한 SPDX Parser 및 Validator)

  • Yun, Ho-Yeong;Joe, Yong-Joon;Jung, Byung-Ok;Shin, Dong-Myung
    • Journal of Software Assessment and Valuation
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    • v.13 no.1
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    • pp.15-21
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    • 2017
  • Analyzing a software package which is consisted of big numbers of files takes enormous costs and time. Therefore, SPDX (Software Package Data Exchange) working group collaborate with Linux Foundation published a software information(metadata) specification: SPDX. On the first half of 2017, the specification contains seven chapters and 66 items, according to Ver 2.1 of SPDX spec. It prefers Tag/Value or RDF forms but also supports spreadsheet form. In this paper, we introduce SPDX parsing & validation tools to check the validity of SPDX document. We'll develop SPDX document generator to manage software package more efficiently for our next target.

A Study on Improving the Efficiency of Logistics Networks in Express Package Deliveries

  • Ko, Chang-Seong;Chung, Ki-Ho;Ko, Hyun-Jeung
    • Journal of Navigation and Port Research
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    • v.36 no.4
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    • pp.305-311
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    • 2012
  • The market competition of express package deliveries in Korea is severe because a large number of companies have entered into the market. This study thus suggests an approach to the reconfiguration of express service networks with respect to the strategy partnership of closing/keeping service centers among companies involved and the adjustments of their cutoff times. For this we propose an integer programming model and a genetic algorithm based solution procedure for allowing companies involved to maximize their incremental profit. An illustrative numerical example is presented to demonstrate the practicality and efficiency of the proposed model.

A Simplified Circuit Model and Switching Noise Characterization of the Complicated Multi-Layer IC Package (복잡한다 층구조 IC 패키지의 회로 모델링 및 스위칭 노이즈 분석)

  • 유한종;어영선
    • Proceedings of the IEEK Conference
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    • 1998.10a
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    • pp.1049-1052
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    • 1998
  • A new simplified circuit model for the switching noise analysis of the complicated multi-layer IC package is developed. The current flowing mechanism on the ground and power planes of the package is simplified by using the dependent current soures and partial plane circuit model. The methodology is very cost-efficient as well as accurate. It is demonstrated that the nosie based on the simplified circuit model has an excellent agreement with that of the complicated full circuit model. However, the simplified model takes only 5 minutes for the switching noise simulation, while the full circuit model takes more than 4 hours.

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Wafer Map Image Analysis Methods in Semiconductor Manufacturing System (반도체 공정에서의 Wafer Map Image 분석 방법론)

  • Yoo, Youngji;An, Daewoong;Park, Seung Hwan;Baek, Jun-Geol
    • Journal of Korean Institute of Industrial Engineers
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    • v.41 no.3
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    • pp.267-274
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    • 2015
  • In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in the wafer testing phase is a key element to ensure the competitiveness of companies. The prediction of package test can reduce unnecessary inspection time and expense. However, an analysing method is not sufficient to analyze data collected at wafer testing phase. Therefore, many companies have been using a summary information such as a mean, weighted sum and variance, and the summarized data reduces a prediction accuracy. In the paper, we propose an analysis method for Wafer Map Image collected at wafer testing process and conduct an experiment using real data.

Development of a New Software Package for Processing and Analyzing DNA Microarray Images

  • Choi, Jin-Ho;Choi, Hee-Jun
    • Journal of Computing Science and Engineering
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    • v.4 no.4
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    • pp.350-367
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    • 2010
  • Microarray technology is an interdisciplinary technique that promises a revolutionary progress toward better health and improved quality of life. The paper focuses on the development of an efficient software package, equipped with already well-known methods; also some new methods are proposed that will allow the processing and analysis of thousands of genes on microarray images. The microarray analysis software package (called SmartArray), newly proposed in this paper verifies, through microarray analysis, dramatic changes in the mRNA, protein, and activity level in the rat retina during light deprivation, which have been demonstrated in previous biological experiments. The analysis results demonstrate that SmartArray can successfully find many changes in gene expression levels in each subarray and classify them according to their significance.

Inductance modeling of intel i486 microprocessor 168 pin PGA package usning RAPHAEL program (PAPHAEL 프로그램을 이용한 인텔 i486 마이크로 프로세서의 168 pin PGA 페키지 인덕턴스 모델링)

  • 박종훈;박홍준
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.10
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    • pp.94-100
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    • 1994
  • By using the RAPHAEL 3D inductance calculation program RI3, the PGA package inductance values of INTEL i486 microprocessor have been extracted. The lead frame layouts are drawn using the mentor Boardstation and the output files are converted into the RI3 program input format of RAPHAEL. The power and ground planes of the PGA package are modeled y grid-line structures of single bars. The capacitance valuse of signal lines have been clalculated by using the RAPHAEL 2D/3D capacitance extraction program. The extraced L, C, R values have been converted into the SPICE netlist formats with lumped circuit model for future use in the signal ingegrity analysis.

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A Study on Wafer-Level Package of RF MEMS Devices Using Dry Film Resist (Dry Film Resist를 이용한 RF MEMS 소자의 기판단위 실장에 대한 연구)

  • Kang, Sung-Chan;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.379-380
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    • 2008
  • This paper presents a wafer-level package using a Dry Film Resist(DFR) for RF MEMS devices. Vertical interconnection is made through the hole formed on the glass cap. Bonding using the DFR has not only less effects on the surface roughness but also low process temperature. We used DFR as adhesive polymer and made the vertical interconnection through Au electroplating. Therefore, we developed a wafer-level package that is able to be used in RF MEMS devices and vertical interconnection.

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Shelf Life Prediction for Packaged Produce Sensitive to Moisture Damage (수분손상에 민감한 포장된 제품의 저장수명 예측)

  • Lee, Chong-Hyun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.4 no.1
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    • pp.23-32
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    • 1997
  • The change in moisture content of moisture sensitive products in moisture-semipermeable packages was investigated for the purpose of predicting the shelf life of a product-package combination. A mathematical model, and a computer program based on the physiochemical properties of the product and the moisture permeability of the package was developed. The moisture content for products in moisture-semipermeable packages was determined under various environmental conditions and the results were compared with the predicted values by means of the simulation model. These experimental studies demonstrated that the prediction of the change in moisture content of packaged products over time by the simulation model is accurate, within a practical range of temperature and relative humidity values. The developed semi-empirical model is considered to have applications in industry, since it provides product shelf life information for a range of temperature and relative humidity conditions, with a limited number of experimentally obtained data points.

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Implementation of Authoring and Consuming System for IPTV Package Contents (IPTV 융합콘텐츠 저작 및 소비 시스템 구현)

  • Ryu, Jee-Woong;Shin, Geuk-Jae;Jung, Hoe-Kyung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.14 no.5
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    • pp.1164-1170
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    • 2010
  • IPTV hasn't fulfilled the expectations that it will substitute existing digital broadcasting service and serve new type of services such as interactive and multi-channels. Today's IPTV service just seems to change existing service platform to new one. In this situation, Open IPTV service has been on the rise, which make it possible for consumers to choice contents regardless of contents providers. However, the integration of variety service platforms such as rights protection solution is essential to provide Open IPTV service. In this paper, authoring and consuming system for package contents based on MPEG-21 Multimedia Framework which is developed for distributing media resources.