• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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• pp.37-47
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• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• 한국산학기술학회논문지
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• 제15권4호
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• pp.2093-2103
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• 2014

본 연구는 국내의 중소업체를 대상으로 하여 ERP 도입요인과 도입성과 간에 공급사 적합성 요인이 미치는 영향에 대한 연구로, 대부분의 국내 기업에서 ERP 패키지를 도입할 경우 외부전문 업체에서 이미 개발한 패키지를 도입하는 경우가 많기 때문에 ERP 패키지의 공급사와의 적합성 요인이 ERP 도입 성과에 조절적인 역할을 하는지를 검증하고자 하였다. 연구 결과, 공급사 적합성 요인은 ERP 도입 요인과 성과 간에 조절적 역할을 하고 있는 것으로 분석되었다. 즉, 공급사 적합성 요인은 최고경영자 지원, 교육/훈련, 사용자 IT 역량, 업무 표준화/공식화 등으로 설정된 4개의 변수들과 내부성과 간에 조절적인 역할을 하는 것으로 분석되었다. 그러나 정보기술 기반구조와 내부성과 간에는 조절적인 역할을 하지 않는 것으로 분석되었다.

• 디지털산업정보학회논문지
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• 제6권1호
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• pp.159-167
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• 2010

We research a competitive advantage of telecom bundling package of three mobile telecom company by figuring out utility that consumers perceived and focused on mobile telecom and high speed internet in one bundled package. As a method, conjoint analysis was applied. And in conclusion, consumers considered retaining mobile telecom company as the most important factor to them and branding as the following important one when one bundled package of telecom service is provided in total market. When the market is divided into two submarkets and the second largest submarket is analyzed personal bundled package was most important and three year agreement with a stipulated discount has the highest utility. As a result of this analysis, mobile telecom company managers need to organize bundled package after consideration of their current position and brand power in the market, and then devise proper market strategy

• 한국신뢰성학회지:신뢰성응용연구
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• 제3권2호
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• pp.103-116
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• 2003

We carry out reliability tests and investigate the failure mechanisms. of the wafer level vacuum packaged MEMS gyroscope sensor using an accelerated degradation test. The accelerated degradation test (ADT) is used to evaluate reliability (and/or life) of the MEMS vacuum package and to select the accelerated test conditions, which reduce the reliability testing time. Using the failure distribution model and stress-life model, we are able to estimate the average life time of the vacuum package, which is well agreed with the measured data. After improving several package reliability issues such as prevention of gas diffusion through package, we carry out another set of accelerated tests at the chosen acceleration level. The results show that reliability of the vacuum packaged gyroscope has been greatly improved and can survive without degradation of performance, which is the Q-factor in gyroscope sensor, during environmental stress reliability tests.

• 한국병원경영학회지
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• 제24권4호
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• pp.33-42
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• 2019

Purpose: many domestic welfare programs use the amount of health insurance premiums as a way of measuring individuals' income levels for administrative convenience. As health insurance reform has been made, we examines the income level is still appropriately measured by the health insurance premiums for the employment success package as one of domestic welfare program. Methodology/Approach: we investigate whether the upper limit of the premiums of the self-employed health insured is appropriate or not after healthcare reform, which currently calculated by multiplying the insurance premium of the employee based insured by the adjustment factor (1.2). Findings: we examined appropriateness of the adjustment factors by comparing the premiums before and after the healthcare reform by utilizing the national health insurance data as well as Korea Welfare panel data. We found that the new value of adjustment factor (1.0~1.1) is smaller than the current one (1.2). Practical Implications: to improve the equity between the employee and the self-employed insured after the health insurance reform, the adjustment factor should be lower.

• 동아시아식생활학회지
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• 제16권3호
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• pp.242-250
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• 2006

The purpose of this study was to identify tourist product factor combinations which confer the highest utility to tourists and to establish the relative importance of factors in terms of their contribution to total utility across gender. Among 250 questionnaires, 230 questionnaires were utilized for the analysis. $X^2$ analysis, Conjoint model, Max. Utility model, BTL model, Logit model, K-means cluster analysis, and one-way anova analysis were used for this study. The findings from this study were as follows. First, the Pearson's R and Kendall's tau statistics showed that the model fitted the data well across gender. Second, it was found that total respondents and three clusters regarded taste price as the very important factor across gender. Third, it was found that the male and female tourists most preferred product with light red color, shaped package, and highly pungent taste sold at a cheap price in factory. Fourth, it was found that the male tourists most preferred simulation product with light red color, shaped package, and highly pungent taste sold at a cheap price in factory. The female tourists most preferred simulation product with light red color, shaped package, and mild taste sold at a cheap price in factory. Finally, the results of the study provide some insights into the types of effective product designs that can be successfully developed by marketers.

• 동력기계공학회지
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• 제18권1호
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• pp.32-37
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• 2014

In this study, the optimum design process of an indoor package air-conditioner (PAC) was implemented by Taguchi method. The goal of this study is to obtain the best set condition of each control factor composing of an indoor PAC. The number of revolution of a double inlet sirocco fan installed in an indoor PAC was measured by the orthogonal array of $L_{18}(2^3{\times}3^4)$ and analysed by using the-smaller- the-better characteristic among the static characteristic analyses. As a result, the optimum condition of an indoor PAC was found as a set of when the cost of production, assembling and working conditions were considered. Moreover, the number of revolution of a double-inlet sirocco fan used for an optimum condition was reduced about 8.5% more than that of a standard condition for the target flowrate of $18.5m^3/min$.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.668-671
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• 2009

This study seeks to develop a map of the domestic small hydropower(SHP) resources to further improve SHP resources, developed through package tool which can accurately evaluate a wide range of SHP basin in a short period of time. GIS-based package tool for SHP resources analysis was calculated using 840 standard basin classified by drainage area and facility capacity, etc., and to assume a 40% annual load factor, expected annual electricity production was calculated. SHP resources potential for the development of SHP will be utilized as basic data.