• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.35-40
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• 2007

The pull strength and fracture mechanism were investigated to evaluate the reliability and compatibility of Sn-8Zn-3Bi joints, the solder paste on lead and lead-free plating under thermal shock conditions. At the Sn-8Zn-3Bi solder joint, no crack initiation was observed during thermal shock test. After 1000 cycles, the strength of the solder joint decreased not sharply but reduced gradually compared with initial conditions. The decrement of strength was affected by ${\gamma}-Cu_5Zn_8$ IMC growth which caused the IMC fracture on the fracture surface and a change in fracture mode and initial crack point. Clearly, the Sn-8Zn-3Bi solder shows good reliability properties and compatibility with lead-free plated Cu LF under thermal shock temperatures between 248K and 423K.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.393-396
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• 1995

In this syudy, the researches classifying the artificial and natural flaws in welding parts are performed using the smart pattern recognition technology. For this purpose the smart signal pattern recognition package including the user defined function was developed and the total procedure including the digital signal processing,feature extraction , feature selection and classifier selection is treated by bulk. Specially it is composed with and discussed using the statistical classifier such as the linear disciminant function classifier, the empirical Bayesian classifier. Also, the smart pattern recognition technology is applied to classification problem of natural flaw(i.e multiple classification problem-crack,lack of penetration,lack of fusion,porosity,and slag inclusion, the planar and volumetric flaw classification problem). According to this results, if appropriately learned the neural network classifier is better than ststistical classifier in the classification problem of natural flaw. And it is possible to acquire the recognition rate of 80% above through it is different a little according to domain extracting the feature and the classifier.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.69-73
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• 2008

This article shows that the susceptibility of the device pattern to thermal stress-induced damage has a strong dependence on its proximity to the device comer in semiconductor devices utilizing lead-on-chip (LOC) die attach technique. The result, as explained based on numerical calculation and experiment, indicateds that the stress-driven damage potential of the passivation layer is the highest at the device comer. Thus, the bonding pads, which are very susceptible to passivation damage, should be designed to be located along the central region rather than the peripheral region of the device.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.5
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• pp.526-531
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• 2001

The flow of remote field eddy current energy is studied at nonmagnetic coaxial tubes by using both experiments and finite element calculations based on commercial software package. The results showed that remote field eddy current energy at coaxial tubes flow along over the outer surface of external tube, not through the gap between internal and external tubes. This means that the through wall transmission characteristic of remote field eddy current testing (RFECT) is still valid at tube in tube configurations and the RFECT could be potential nondestructive technique for crack detection, spacer location and gap sizing at the coaxial CANDU fuel channel tubes.

• Korean Journal of Materials Research
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• v.4 no.3
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• pp.334-338
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• 1994

This report details the microscopic aspects of grain boundary cracking in Pb-Sn eutecticduring displacement-controlled mechanical tests performed over a range of low frequency ($10^{-3}-10^{-5}$/s)and moderate strain range (0.2 - 1 %) where is the most technologically relevant to solder jointssubjected to thermal cycling. It is shown that intergranular cracking begins with the appearance ofcrack-like features (CLF's), which can be seen due in part because they are associated with grainboundary sliding, and is able to be described by certain stages of isolated crack growth. In the initialstages CLF's are not ture cracks but instead what I shall call "proto-cracks" where grain boundarysliding begins to damage the gram boundary at the surface. At some point during the initiation stagesonce proto-cracks become ture cracks, they develop into isolated cracks and the growth of isolatedcracks is eventually accomplished by coalescence, resulting in 5 stages of cracking.ing in 5 stages of cracking.

• Journal of Applied Reliability
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• v.13 no.2
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• pp.109-116
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• 2013

The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.31-36
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• 2002

The 2nd level solder joint reliability of 153 FC-BGA for high-speed SRAM (Static Random Access Memory) with the large chip on laminate substrate comparing to PBGA(Plastic Ball Grid Array) was studied in this paper. This work has been done to understand an influence as the mounting with single side or double sides, structure of package, properties of underfill, properties and thickness of substrate and size of solder ball on the thermal cycling test. It was confirmed that thickness of BT(bismaleimide tiazine) substrate increased from 0.95 mm to 1.20 mm and solder joint fatigue life improved about 30% in the underfill with the low young's modulus. And resistance against the solder ball crack became twice with an increase of the solder ball size from 0.76 mm to 0.89 mm in solder joints.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Structural Engineering and Mechanics
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• v.57 no.5
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• pp.937-949
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• 2016

Fiber reinforced polymer (FRP) applications in the structural engineering field include concrete-FRP composite systems, where FRP components are either attached to or embedded into concrete structures to improve their structural performance. This paper presents the results of an analytical study conducted using finite element model (FEM) to simulate the behavior of three-points load beam reinforced with GFRP and/or steel bars. To calibrate the FEM, a small-scale experimental program was carried out using six reinforced concrete beams with $200{\times}200mm$ cross section and 1000 mm length cast and tested under three point bending load. The six beams were divided into three groups, each group contained two beams. The first group was a reference beams which was cast without any reinforcement, the second group concrete beams was reinforced using GFRP, and the third group concrete beams was reinforced with steel bars. Nonlinear finite element simulations were executed using ANSYS software package. The difference between the theoretical and experimental results of beams vertical deflection and beams crack shapes were within acceptable degree of accuracy. Parametric study using the calibrated model was carried out to evaluate two parameters (1) effect of number and position of longitudinal main bars on beam behavior; (2) performance of concrete beam with composite longitudinal reinforcement steel and GFRP bars.