• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.4
• /
• pp.1347-1355
• /
• 1996

The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.1
• /
• pp.27-34
• /
• 2015

The correlation between crack propagation and localized recrystallization are compared in a series of cross section analyses on thermal cycled edgebond and underfilm material applied wafer level chip scale package (WLCSP) components with a baseline of no-material applied WLCSP components. The results show that the crack propagation distribution and recrystallization region correlation can explain potential degradation mechanisms and support the damage accumulation history in a more efficient way. Edgebond material applied components show a shift of damage accumulation to a more localized region, thus potentially accelerated the degradation during thermal cycling. Underfilm material applied components triggered more solder joints for a more wider distribution of damage accumulation resulting in a slightly improved thermal cycling performance compared to no-material applied components. Using an analysis on localized distribution of recrystallized areas inside the solder joint showed potential value as a new analytical approach.

• Journal of Welding and Joining
• /
• v.17 no.3
• /
• pp.90-95
• /
• 1999

The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

• Journal of Welding and Joining
• /
• v.16 no.4
• /
• pp.92-97
• /
• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Journal of Radiation Protection and Research
• /
• v.34 no.3
• /
• pp.144-150
• /
• 2009

This study examines how much the radiation dose rate around it varies if a crack occurs on the spent nuclear fuel rod. The spent nuclear fuel rod to be examined is that of Kori unit 3&4. The source terms are evaluated using the ORIGEN-ARP that is part of the version 5.1 of the SCALE package. The radiation dose rate is assessed using the TORT. To check if the structure of a fuel rod is appropriately modeled in the TORT calculation, the calculation results by the TORT are compared with those by the ANISN for the same case. From the code simulation, it is known that if a crack occurs on the spent nuclear fuel rod, the neutron dose rate varies depending on what material is the crack filled with, but the gamma dose rate varies irrespective of type of the material that the crack is filled with.

• Proceedings of the Korean Reliability Society Conference
• /
• 2001.06a
• /
• pp.239-244
• /
• 2001

Today, Ultrasonic is used as an important non-destructive test tool of semiconductor reliability evaluation and failure analysis. The semiconductor packaging trend goes to develop thin package, this trend makes difficult to inspect to defect in semiconductor package. One of the important problem in all semiconductor is moisture absorption in the atmosphere. This moisture causes crack or delamination to package when the semiconductor package is soldered on PCB. Reliability evaluation of semiconductor's object is investigating the effect of this moisture. For that reason, this study is investigating the effect of this moisture and reliability evaluation of semiconductor after preconditioning test and scanning acoustic microscope.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.18 no.8
• /
• pp.2139-2157
• /
• 1994

In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

• Smart Structures and Systems
• /
• v.31 no.4
• /
• pp.383-392
• /
• 2023

Post-earthquake building condition assessment is crucial for subsequent rescue and remediation and can be automated by emerging computer vision and deep learning technologies. This study is based on an endeavour for the 2nd International Competition of Structural Health Monitoring (IC-SHM 2021). The task package includes five image segmentation objectives - defects (crack/spall/rebar exposure), structural component, and damage state. The structural component and damage state tasks are identified as the priority that can form actionable decisions. A multi-task Convolutional Neural Network (CNN) is proposed to conduct the two major tasks simultaneously. The rest 3 sub-tasks (spall/crack/rebar exposure) were incorporated as auxiliary tasks. By synchronously learning defect information (spall/crack/rebar exposure), the multi-task CNN model outperforms the counterpart single-task models in recognizing structural components and estimating damage states. Particularly, the pixel-level damage state estimation witnesses a mIoU (mean intersection over union) improvement from 0.5855 to 0.6374. For the defect detection tasks, rebar exposure is omitted due to the extremely biased sample distribution. The segmentations of crack and spall are automated by single-task U-Net but with extra efforts to resample the provided data. The segmentation of small objects (spall and crack) benefits from the resampling method, with a substantial IoU increment of nearly 10%.

• Journal of Welding and Joining
• /
• v.13 no.2
• /
• pp.82-95
• /
• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Journal of the Microelectronics and Packaging Society
• /
• v.27 no.1
• /
• pp.55-65
• /
• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.