• Title/Summary/Keyword: p-n 접합

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Tensile-Shear Fatigue Strength of Self-Piercing Rivets Joining Dissimilar Metal Sheets (이종재료 Self-Piercing Rivets 접합부의 인장-전단 피로강도)

  • Kang, Se Hyung;Kim, Taek Young;Oh, Man Jin;Kim, Ho Kyung
    • Journal of the Korean Society of Safety
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    • v.30 no.4
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    • pp.1-7
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    • 2015
  • Self-piercing riveting (SPR) process is gaining popularity due to its many advantages. The SPR does not require a pre-drilled hole and has capability to join a wide range of similar or dissimilar materials and combinations of materials. This study investigated the fatigue strength of self-piercing rivet joint with aluminum alloy (Al-5052) and steel (SPCC) sheets. Static and fatigue tests on tensile-shear specimens were conducted. From the static strength aspect, the optimal punching force for the specimen with upper SPCC (U.S) sheet and lower aluminum alloy(L.A) sheets was 34 kN. During static test the specimens fractured in pull-out fracture mode due to influence of plastic deformation of joining area. There was a relationship between applied load amplitude $P_{amp}$ and number of cycles N ; $P_{amp}=19588N_f^{-0.211}$ and $P_{amp}=4885N_f^{-0.083}$ for U.S-L.A and U.A-L.S specimens, respectively. U.A-L.S fatigue specimens failed due to fretting crack initiation around the rivet neck between upper and lower sheets.

Optical and Electrical Properties of InAs Sub-Monolayer Quantum Dot Solar Cell

  • Han, Im-Sik;Park, Dong-U;No, Sam-Gyu;Kim, Jong-Su;Kim, Jin-Su;Kim, Jun-O
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.196.2-196.2
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    • 2013
  • 본 연구에서는 분자선 에피택시 (MBE)법으로 성장된 InAs submonolayer quantum dot (SML-QD)을 태양전지에 응용하여 광학 및 전기적 특성을 평가하였다. 본 연구에서 사용된 양자점 태양전지(quantum dot solar cell, QDSC)의 구조는 n+-GaAs 기판 위에 n+-GaAs buffer와 n-GaAs base layer를 차례로 성장 한 후, 활성영역에 InAs/InGaAs SML-QD와 n-GaAs spacer layer를 8주기 형성하였다. 그 위에 p+-GaAs emitter, p+-AlGaAs window layer를 성장하고 ohmic contact을 위하여 p+-GaAs 를 성장하였다. SML-QD 구조의 두께는 0.3 ML 이며, 이때 SML-QD의 적층수를 4 stacks 으로 고정하였다. SML-QD 와의 비교를 위하여 2.0 ML크기의 InAs자발 형성 양자점 태양전지(SK-QDSC)과 GaAs 단일 접합 태양전지 (reference-SC)를 동일한 성장조건에서 제작하였다. PL 측정 결과, 300 K에서 SML-QD의 발광 피크는 SK-QD 보다 고에너지에서 나타나는데(1.349 eV), 이것은 SML-QD가 SK-QD보다 작은 크기를 가지기 때문으로 사료된다. SML-QD는 single peak를 보이는 반면, SK-QD는 dual peaks (1.112 / 1.056 eV)을 확인하였다. SML-QD의 반치폭(full width at half maximum, FWHM)이 SK-QD에 비하여 작은 것으로 보아 SML-QD가 SK-QD보다 양자점 크기 분포의 균일도가 높은 것으로 해석된다. Illumination I-V 측정 결과, SML-QDSC의 개방 전압(VOC) 과 단락전류밀도(JSC)는 SK-QDSC의 값과 비교해 보면, 각각 47 mV와 0.88 mA/cm2만큼 증가하였다. 이는 SK-QD보다 상대적으로 작은 크기를 가진 SML-QD로 인해 VOC가 증가되었으며, SML-QD가 SK-QD 보다 태양광을 흡수할 수 있는 영역이 비교적 적지만, QD내에 존재하는 energy level에서 탈출 할 수 있는 확률이 더 높음으로써 JSC가 증가한 것으로 분석 된다.

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Electrical Properties of Ultra-shallow$p^+-n$ Junctions using $B_{10}H_{14}$ ion Implantation ($B_{10}H_{14}$ 이온 주입을 통한 ultra-shallow $p^+-n$ junction 형성 및 전기적 특성)

  • 송재훈;김지수;임성일;전기영;최덕균;최원국
    • Journal of the Korean Vacuum Society
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    • v.11 no.3
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    • pp.151-158
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    • 2002
  • Fabricated were ultra-shallow $p^+-n$ junctions on n-type Si(100) substrates using decaborane $(B_{10}H_{14})$ ion implantation. Decaborane ions were implanted at the acceleration voltages of 5 kV to 10 kV and at the dosages of $1\times10^{12}\textrm{cm}^2$.The implanted specimens were annealed at $800^{\circ}C$, $900^{\circ}C$ and $1000^{\circ}C$ for 10 s in $N_2$ atmosphere through a rapid thermal process. From the measurement of the implantation-induced damages through $2MeV^4 He^{2+}$ channeling spectra, the implanted specimen at the acceleration voltage of 15 kV showed higher backscattering yield than those of the bare n-type Si wafer and the implanted specimens at 5 kV and 10 kV. From the channeling spectra, the calculated thicknesses of amorphous layers induced by the ioin implantation at the acceleration voltages of 5 kV, 10 kV and 15 kV were 1.9 nm, 2.5 nm and 4.3 nm, respectively. After annealing at $800^{\circ}C$ for 10 s in $N_2$ atmosphere, most implantation-induced damages of the specimens implanted at the acceleration voltage of 10 kV were recovered and they exhibited the same channeling yield as the bare Si wafer. In this case, the calculated thickness of the amorphous layer was 0.98 nm. Hall measurements and sheet resistance measurements showed that the dopant activation increased with implantation energy, ion dosage and annealing temperature. From the current-voltage measurement, it is observed that leakage current density is decreased with the increase of annealing temperature and implantation energy.

Genetic Variation of Pinus densiflora Populations in South Korea Based on ESTP Markers (ESTP 표지를 이용한 국내 소나무 집단의 유전변이)

  • Ahn, Ji Young;Hong, Kyung Nak;Lee, Jei Wan;Hong, Yong Pyo;Kang, Hoduck
    • Korean Journal of Plant Resources
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    • v.28 no.2
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    • pp.279-289
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    • 2015
  • Genetic diversity and genetic differentiation of thirteen Pinus densiflora populations in South Korea were estimated using nine ESTP (Expressed Sequence Tag Polymorphism) markers. The numbers of allele and the effective allele were 2.2 and 1.8, respectively. The percentage of polymorphic loci (P) was 98.8%. The observed and the expected heterozygosity were 0.391 and 0.402, respectively, and the eleven populations except for Ahngang and Gangneung population were under Hardy-Weinberg equilibrium state. The level of genetic differentiation (Wright’s FST = 0.057) was higher than those of isozyme or nSSR markers. We could not find out any relationship between the genetic distance and geographic distribution among populations from cluster analysis. Also, the genetic differentiation between populations was not correlated with the geographic distance (r = 0.017 and P = 0.344 from Mantel test). From the result of FST-outlier analysis to identify a locus under selection, six loci were detected at confidence interval of 99% by the frequentist’s method. However, only three loci (sams2+AluⅠ, sams2+RsaⅠ, PtNCS_p14A9+HaeⅢ) were presumed as outliers by Bayesian method. The sams2+AluⅠ and sams2+RsaⅠlocus were originated from the sams2 gene and seemed to be the loci under balancing selection.

InAs/GaAs 양자점 태양전지에서 AlGaAs Potential Barrier 두께에 따른 Photoreflectance 특성 및 내부 전기장 변화

  • Son, Chang-Won;Ha, Jae-Du;Han, Im-Sik;Kim, Jong-Su;Lee, Sang-Jo;Smith, Ryan;Kim, Yeong-Ho;Kim, Seong-Jun;Lee, Sang-Jun;No, Sam-Gyu;Park, Dong-U;Kim, Jin-Su;Im, Jae-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.306-307
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    • 2011
  • Franz Keldysh Oscillation (FKO)은 p-n 접합 구조의 공핍층(depletion zone)에서 전기장(electric field)에 의해 발생되며, Photoreflectance (PR) spectroscopy를 통하여 관측된다. InAs/GaAs 양자점 태양전지(Quantum Dot Solar Cells, QDSCs)에서 PR 신호에 대한 Fast Fourier Transform (FFT)을 통하여 FKO 주파수들을 관측할 수 있고, 각각의 FKO 주파수들은 태양전지 구조에 대응하는 표면 및 내부전기장(internal electric field) 들로 분류할 수 있다. InAs/GaAs 양자점 태양전지에서 AlGaAs potential barrier의 두께에 따른 내부전기장의 변화를 조사하기 위해, GaAs-matrix에 8주기의 InAs 양자점 층이 삽입된 태양전지를 molecular beam epitaxy (MBE) 방법으로 성장하였다. 양자점의 크기는 2.0 monolayer (ML)이며, 각 양자점 층은 1.6 nm에서 6.0 nm의 AlGaAs potential barrier들로 분리되어 있다. 또한 양자점 층의 위치에 따라 내부전기장 변화를 조사하기 위해, p-i-n 구조에서 양자점 층이 공핍층 내에 위치한 경우와 p+-n-n+ 구조에서 양자점 층이 공핍 층으로부터 멀리 떨어진 n-base 영역에 삽입하여 실험결과를 비교분석하였다. PR 실험결과로부터, p-i-n 구조에서 InAs 양자점 태양전지의 내부전기장 변화는 potential barrier 두께에 따라 다소 복잡한 변화를 보였으며, 이는 양자점 층이 공핍층 내에 위치함으로써 격자 불일치(lattice mismatch)로 발생된 응력(strain)의 영향으로 설명할 수 있다. 이러한 결과들을 각각의 태양전지 구조에서 표면 및 내부전기장에 대해 계산된 값들에 근거하여, p+-n-n+ 구조에서 양자점 층이 공핍 층으로부터 멀리 떨어진 영역에 삽입된 경우의 결과와 비교해 보면 내부전기장의 변화는 더욱 분명해진다. 즉, 양자점 층의 potential barrier의 두께를 조절하거나, 양자점 층의 위치를 변화시킴으로써 양자점 태양전지의 내부전기장을 조작할 수 있으며, 이는 PR 실험을 통해 FKO를 관측함으로써 확인할 수 있다.

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Copper Ohmic Contact on n-type SiC Semiconductor (탄화규소 반도체의 구리 오옴성 접촉)

  • 조남인;정경화
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.4
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    • pp.29-33
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    • 2003
  • Material and electrical properties of copper-based ohmic contacts on n-type 4H-SiC were investigated for the effects of the post-annealing and the metal covering conditions. The ohmic contacts were prepared by sequential sputtering of Cu and Si layers on SiC substrate. The post-annealing treatment was performed using RTP (rapid thermal process) in vacuum and reduction ambient. The specific contact resistivity ($p_{c}$), sheet resistance ($R_{s}$), contact resistance ($R_{c}$), transfer length ($L_{T}$), were calculated from resistance (RT) versus contact spacing (d) measurements obtained from TLM (transmission line method) structure. The best result of the specific contact resistivity was obtained for the sample annealed in the reduction ambient as $p_{c}= 1.0 \times 10^{-6}\Omega \textrm{cm}^2$. The material properties of the copper contacts were also examined by using XRD. The results showed that copper silicide was formed on SiC as a result of intermixing Cu and Si layer.

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The Effects of Lithium-Incorporated on N-ZTO/P-SiC Heterojunction Diodes by Using a Solution Process (용액공정으로 제작한 리튬 도핑된 N-ZTO/P-SiC 이종접합 구조의 전기적 특성)

  • Lee, Hyun-Soo;Park, Sung-Joon;An, Jae-In;Cho, Seulki;Koo, Sang-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.4
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    • pp.203-207
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    • 2018
  • In this work, we investigate the effects of lithium doping on the electric performance of solution-processed n-type zinc tin oxide (ZTO)/p-type silicon carbide (SiC) heterojunction diode structures. The proper amount of lithium doping not only affects the carrier concentration and interface quality but also influences the temperature sensitivity of the series resistance and activation energy. We confirmed that the device characteristics vary with lithium doping at concentrations of 0, 10, and 20 wt%. In particular, the highest rectification ratio of $1.89{\times}107$ and the lowest trap density of $4.829{\times}1,022cm^{-2}$ were observed at 20 wt% of lithium doping. Devices at this doping level showed the best characteristics. As the temperature was increased, the series resistance value decreased. Additionally, the activation energy was observed to change with respect to the component acting on the trap. We have demonstrated that lithium doping is an effective way to obtain a higher performance ZTO-based diode.

Dependence of the Heterojunction Diode Characteristics of ZnO/ZnO/p-Si(111) on the Buffer Layer Thickness (버퍼막 두께에 따른 ZnO/ZnO/p-Si(111) 이종접합 다이오드 특성 평가)

  • Heo, Joo-Hoe;Ryu, Hyuk-Hyun;Lee, Jong-Hoon
    • Korean Journal of Materials Research
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    • v.21 no.1
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    • pp.34-38
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    • 2011
  • In this study, the effects of an annealed buffer layer with different thickness on heterojunction diodes based on the ZnO/ZnO/p-Si(111) systems were reported. The effects of an annealed buffer layer with different thickness on the structural, optical, and electrical properties of zinc oxide (ZnO) films on p-Si(111) were also studied. Before zinc oxide (ZnO) deposition, different thicknesses of ZnO buffer layer, 10 nm, 30 nm, 50 nm and 70 nm, were grown on p-Si(111) substrates using a radio-frequency sputtering system; samples were subsequently annealed at $700^{\circ}C$ for 10 minutes in $N_2$ in a horizontal thermal furnace. Zinc oxide (ZnO) films with a width of 280nm were also deposited using a radio-frequency sputtering system on the annealed ZnO/p-Si (111) substrates at room temperature; samples were subsequently annealed at $700^{\circ}C$ for 30 minutes in $N_2$. In this experiment, the structural and optical properties of ZnO thin films were studied by XRD (X-ray diffraction), and room temperature PL (photoluminescence) measurements, respectively. Current-voltage (I-V) characteristics were measured with a semiconductor parameter analyzer. The thermal tensile stress was found to decrease with increasing buffer layer thickness. Among the ZnO/ZnO/p-Si(111) diodes fabricated in this study, the sample that was formed with the condition of a 50 nm thick ZnO buffer layer showed a strong c-axis preferred orientation and I-V characteristics suitable for a heterojunction diode.

A Study on Friction Welding of A2024-T6 and SM45C using Insert Metals (삽입재를 사용한 A2024-T6와 SM45C의 마찰용접에 관한 연구)

  • 강성보;윤병수;민택기
    • Journal of Welding and Joining
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    • v.16 no.5
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    • pp.48-55
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    • 1998
  • This study was undertaken to investigate the friction welding of A2024-T6 aluminum alloy and SM45C carbon steel using insert metals. The relationships among the friction welding conditions, the tensile strength of joints, the hardness distribution of welds, the microstructure of welds and the tensile fracture surfaces were mainly investigated through this experiment. When the A6063-T5 aluminum alloy of insert metal was used, the maximum tensile strengh of joint was obtained. In this case, the maximum joint efficiency was 75.3 percent and in the case of unusing the insert metals, it was 37.7 percent. Optimal welding conditions were N=2000rpm, P$_1$=40MPa, P$_2$=140MPa, t$_1$=1.0sec and t$_2$=5sec.

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Detection of luminol chemiluminescence using photodiode (화학 발광 검출을 위한 포토다이오드 제작)

  • Kim, Hyung-Il;Kang, Chul-Goo;Kang, Moon-Sik;Park, Jung-Ho;Min, Nam-Ki
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.1552-1554
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    • 2002
  • 본 논문에서는 실리콘을 기초로 한 포토다이오드를 제작하여 현재 바이오센서에서 이용되고 있는 luminol 화학 발광을 전기적으로 검출하였다. 우선, 실리콘 웨이퍼에 이온주입을 통해 p-n 접합을 형성하고 Al 전극을 형성시켜 포토다이오드를 제작하였다. PDMS을 passivation 막으로 사용하여 horseradish peroxidase(HRP) 농도 변화에 따른 발광의 최적조건과 luminol, HRP가 섞인 용액에 서로 다른 양의 과산화수소를 넣어 발광이 최대로 발생하는 혼합비를 측정하였다. 최종적으로 2mM luminol, 25U HRP 조건 하에서 과산화수소 농도에 따른 화학 발광을 측정하였으며, $10{\mu}M$부터 $500{\mu}M$ 범위의 과산화수소 농도 변화에 따른 포토다이오드의 감도는 단위 면적당 23.429pA/ ${\mu}M$이다.

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