• 한국재료학회지
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• 제2권3호
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• pp.228-238
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• 1992

서브마이크론 설계규칙을 갖는 소자의 이층 배선 공정에서 다챔버 장비를 이용한 금속 층간절연막의 공극없는 평탄화를 위하여 PECVD와 $O_3$ ThCVD산화막의 증착시 층덮힘성을 연구하였다. 산화막의 두께가 증가됨에 따라 변화되는 순간단차비의 개념을 도입하여 공극형성의 개시점을 예측할 수 있는 관계식을 모델링하였고, 금속배선간격의 초기 단차비가 다양한 패턴에서 산화막의 두께에 따른 순간 단차비의 변화를 조사하였다. 모델링 검정결과 $5^{\circ}$이하의 re-entrant각을 갖는 TEOS에 의한 PECVO 산화막의 순간단차비가 모델링에 잘 일치하였다. 공극없는 평탄화는 제1층의 PECVD 산화막의 순간 단차비를 0.8이하로 유지하거나 Ar sputter식각을 통하여 산화막의 모서리에 경사를 준후 층덮힘성이 우수한 $O_3$ ThCVD산화막을 증착함으로써 가능하였다. $O_3$ ThCVD산화막의 etchback이 non etchback공정에 비하여 via접쪽저항체인에서 높은 수율을 보였으며, via접촉저항은 $0.1~0.3{\Omega}/{\mu}m^2$로 나타났다.

• 한국재료학회지
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• 제3권1호
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• pp.19-27
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• 1993

RF magnetrom sputtering으로 52/48 PZT target을 사용하여 PZT thin film을 증착시킨후, furnace annealing을 실시하여 Si 기판에서는 55$0^{\circ}C$에서부터 안정상인 peroskite구조가 형성되었다. Si기판위에서는 후속열처리시 계면에 상당한 산화막층이 형성되었으며 TiN 기판위에서는 후속열처리시 TiN층은 사라지고 Ti$O_2$층이 형성되었다. Si$O_2$기판에서는 후속열처리후에도 안정한 PZT film을 형성시킬 수 있었다. As-depo.시에는 PZT film의 조성비가 균일하게 유지되었으나 75$0^{\circ}C$후속열 처리시에는 상당량의 Pb가 Si기판으로 diffusion하였으며 Si도 out-diffusion하였다. 전기적 특성은 10KHz에서 C-V를 측정결과 약 1300정도의유전상수 값이 나왔으나 후속열처리시 표면에 crack이 발생하였다.

• 한국재료학회지
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• 제21권2호
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• pp.120-124
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• 2011

Silicon heterojunction solar cells have been studied by many research groups. In this work, silicon heterojunction solar cells having a simple structure of Ag/ZnO:Al/n type a-Si:H/p type c-Si/Al were fabricated. Samples were fabricated to investigate the effect of transparent conductive oxide growth conditions on the interface between ZnO:Al layer and a-Si:H layer. One sample was deposited by ZnO:Al at low working pressure. The other sample was deposited by ZnO:Al at alternating high working pressure and low working pressure. Electrical properties and chemical properties were investigated by light I-V characteristics and AES method, respectively. The light I-V characteristics showed better efficiency on sample deposited by ZnO:Al by alternating high working pressure and low working pressure. Atomic concentrations and relative oxidation states of Si, O, and Zn were analyzed by AES method. For poor efficiency samples, Si was diffused into ZnO:Al layer and O was diffused at the interface of ZnO:Al and Si. Differentiated O KLL spectra, Zn LMM spectra, and Si KLL spectra were used for interface reaction and oxidation state. According to AES spectra, sample deposited by high working pressure was effective at reducing the interface reaction and the Si diffusion. Consequently, the efficiency was improved by suppressing the SiOx formation at the interface.

• Journal of information and communication convergence engineering
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• 제3권4호
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• pp.179-183
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• 2005

A photodiode capable of obtaining a sufficient photo/ dark current ratio at both forward bias state and reverse bias state is proposed. The photodiode includes a glass substrate, an aluminum film formed as a lower electrode over the glass substrate, an alumina film formed as an insulator barrier over the aluminum film, a hydrogenated amorphous silicon film formed as a photo conduction layer over a portion of the alumina film, and a transparent conduction film formed as an upper electrode over the hydro-generated amorphous silicon film. A good quality alumina $(Al_2O_3)$ film is formed by oxidation of aluminum film using electrolyte solution of succinic acid. Alumina is used as a potential barrier between amorphous silicon and aluminum. It controls dark-current restriction. In case of photodiodes made by changing the formation condition of alumina, we can obtain a stable dark current $(\~10^{-12}A)$ in alumina thickness below $1000{\AA}$. At the reverse bias state of the negative voltage in ITO (Indium Tin Oxide), the photo current has substantially constant value of $5{\times}10^{-9}$ A at light scan of 100 1x. On the other hand, the photo/dark current ratios become higher at smaller thicknesses of the alumina film. Therefore, the alumina film is used as a thin insulator barrier, which is distinct from the conventional concept of forming the insulator barrier layer near the transparent conduction film. Also, the structure with the insulator thin barrier layer formed near the lower electrode, opposed to the ITO film, solves the interface problem of the ITO film because it provides an improved photo current/dark current ratio.

• Journal of Electrochemical Science and Technology
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• 제13권3호
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• pp.407-415
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• 2022

Surface coating of cathodes is an essential process for all-solid-state batteries (ASSBs) based on sulfide electrolytes as it efficiently suppresses interfacial reactions between oxide cathodes and sulfide electrolytes. Based on computational calculations, Li₃PO₄ has been suggested as a promising coating material because of its higher stability with sulfides and its optimal ionic conductivity. However, it has hardly been applied to the coating of ASSBs due to the absence of a suitable coating process, including the selection of source material that is compatible with ASSBs. In this study, polyphosphoric acid (PPA) and (NH₄)₂HPO₄ were used as source materials for preparing a Li₃PO₄ coating for ASSBs, and the properties of the coating layer and coated cathodes were compared. The Li₃PO₄ layer fabricated using the (NH₄)₂HPO₄ source was rough and inhomogeneous, which is not suitable for the protection of the cathodes. Moreover, the water-based coating solution with the (NH₄)₂HPO₄ source can deteriorate the electrochemical performance of high-Ni cathodes that are vulnerable to water. In contrast, when an alcohol-based solvent was used, the PPA source enabled the formation of a thin and homogeneous coating layer on the cathode surface. As a consequence, the ASSBs containing the Li₃PO₄-coated cathode prepared by the PPA source exhibited significantly enhanced discharge and rate capabilities compared to ASSBs containing a pristine cathode or Li₃PO₄-coated cathode prepared by the (NH₄)₂HPO₄ source.

• JSTS:Journal of Semiconductor Technology and Science
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• 제1권4호
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• pp.202-208
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• 2001

In Recent results suggested that doping $Ta_2O_5$ with a small amount of $TiO_2$ using standard ceramic processing techniques can increase the dielectric constant of $Ta_2O_5$ significantly. In this paper, this concept is studied using RTCVD (Rapid Thermal Chemical Vapor Deposition). Ti-doped $Ta_2O_5$ films are deposited using $TaC_{12}H_{30}O_5N$, $C_8H_{24}N_4Ti$, and $O_2$ on both Si and $NH_3$-nitrided Si substrates. An $NH_3$-based interface layer at the Si surface is used to prevent interfacial oxidation during the CVD process and post deposition annealing is performed in $H_2/O_2$ ambient to improve film quality and reduce leakage current. A sputtered TiN layer is used as a diffusion barrier between the Al gate electrode and the $TaTi_xO_y$ dielectric. XPS analyses confirm the formation of a ($Ta_2O_5)_{1-x}(TiO_2)_x$ composite oxide. A high quality $TaTi_xO_y$ gate stack with EOT (Equivalent Oxide Thickness) of $7{\AA}$ and leakage current $Jg=O.5A/textrm{cm}^2$ @ Vg=-1.0V has been achieved. We have also succeeded in forming a $TaTi_x/O_y$ composite oxide by rapid thermal oxidation of the as-deposited CVD TaTi films. The electrical properties and Jg-EOT characteristics of these composite oxides are remarkably similar to that of RTCVD $Ta_2O_5, suggesting that the dielectric constant of $Ta_2O_5$ is not affected by the addition of $TiO_2$.

• 한국재료학회지
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• 제14권9호
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• pp.607-613
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• 2004

This study was to investigate the surface properties of electrochemically oxidized Ti-6Al-7Nb alloy by anodic spark discharge technique. Anodizing was performed at current density 30 $mA/cm^2$ up to 300 V in electrolyte solutions containing $DL-{\alpha}$-glycerophosphate disodium salt hydrate($DL-{\alpha}$-GP) and calcium acetate (CA). Hydrothermal treatment was done at $300^{\circ}C$ for 2 hrs to produce a thin outermost layer of hydroxyapatite (HA). The bioactivity was evaluated from HA formation on the surfaces in a Hanks' solution with pH 7.4 at $36.5^{\circ}C$ for 30 days. The size of micropores and the thickness of oxide film increased and complicated multilayer by increasing the spark forming voltage. Needle-like HA crystals were observed on anodic oxide film after the hydrothermal treatment at $300^{\circ}C$ for 2 hrs. When increasing $DL-{\alpha}$-GP in electrolyte composition, the precipitated HA crystals showed the shape of thick and shorter rod. However, when increasing CA, the more fine needle shape HA crystals were appeared. The bioactivity in Hanks' solution was accelerated when the oxide films composed with strong anatase peak with presence of rutile peak. The increase of amount of Ca and P was observed in groups having bioactivity in Hanks' solution. The Ca/P ratio of the precipitated HA layer was equivalent to that of HA crystal and it was closer to 1.67 as increasing the immersion time in Hanks' solution.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.477-477
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• 2008

For more than three decades, the gate dielectrics in CMOS devices are $SiO_2$ because of its blocking properties of current in insulated gate FET channels. As the dimensions of feature size have been scaled down (width and the thickness is reduced down to 50 urn and 2 urn or less), gate leakage current is increased and reliability of $SiO_2$ is reduced. Many metal oxides such as $TiO_2$, $Ta_2O_4$, $SrTiO_3$, $Al_2O_3$, $HfO_2$ and $ZrO_2$ have been challenged for memory devices. These materials posses relatively high dielectric constant, but $HfO_2$ and $Al_2O_3$ did not provide sufficient advantages over $SiO_2$ or $Si_3N_4$ because of reaction with Si substrate. Recently, $HfO_2$ have been attracted attention because Hf forms the most stable oxide with the highest heat of formation. In addition, Hf can reduce the native oxide layer by creating $HfO_2$. However, new gate oxide candidates must satisfy a standard CMOS process. In order to fabricate high density memories with small feature size, the plasma etch process should be developed by well understanding and optimizing plasma behaviors. Therefore, it is necessary that the etch behavior of $HfO_2$ and plasma parameters are systematically investigated as functions of process parameters including gas mixing ratio, rf power, pressure and temperature to determine the mechanism of plasma induced damage. However, there is few studies on the the etch mechanism and the surface reactions in $BCl_3$ based plasma to etch $HfO_2$ thin films. In this work, the samples of $HfO_2$ were prepared on Si wafer with using atomic layer deposition. In our previous work, the maximum etch rate of $BCl_3$/Ar were obtained 20% $BCl_3$/ 80% Ar. Over 20% $BCl_3$ addition, the etch rate of $HfO_2$ decreased. The etching rate of $HfO_2$ and selectivity of $HfO_2$ to Si were investigated with using in inductively coupled plasma etching system (ICP) and $BCl_3/Cl_2$/Ar plasma. The change of volume densities of radical and atoms were monitored with using optical emission spectroscopy analysis (OES). The variations of components of etched surfaces for $HfO_2$ was investigated with using x-ray photo electron spectroscopy (XPS). In order to investigate the accumulation of etch by products during etch process, the exposed surface of $HfO_2$ in $BCl_3/Cl_2$/Ar plasma was compared with surface of as-doped $HfO_2$ and all the surfaces of samples were examined with field emission scanning electron microscopy and atomic force microscope (AFM).

• 접착 및 계면
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• 제19권3호
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• pp.106-112
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• 2018

악성 조직의 온열 치료는 성공적인 암 치료 방법의 하나로서 방사선 치료 및 화학 요법에 비해 생체 적합성이 우수하고 비교적 온화한 조건에서 사용할 수 있어 최근 큰 주목을 받고 있다. 본 연구에서는 온열 치료를 목적으로 생체 적합성 고분자인 poly(2-methacryloyloxyethyl phosphorylcholine/fluorescein O-methacrylate) (P(MPC/FOM))를 코팅한 초상자성 산화철 나노 입자 (IONP)를 제조하고 관련 특성을 분석하였다. 15 nm 직경을 갖는 IONP는 먼저 공침법에 의해 제조된 후, 4-cyanopentanoic acid dithiobenzoate (CTP) 을 사용하여 IONP의 표면을 개질하였으며, 이 후 MPC 및 FOM 단량체의 reversible addition-fragmentation chain transfer (RAFT) 공중합을 통해 P(MPC/FOM)의 코로나 층을 형성시켰다. 투과 전자 현미경 (TEM)과 동적 광 산란 (DLS) 분석을 통해 IONP@P(MPC/FOM)의 형태 및 수력학적 크기를 확인할 수 있었으며, 열 중량 분석 (TGA)을 통해 P(MPC/FOM) 코로나 층의 형성을 확인하였다. 또한 교류 자기장을 이용해 IONP 분산액을 노출시킨 결과, 0.2 중량 %의 IONP @ P(MPC / FOM) 수분산액이 온열 치료에 사용될 수 있음을 확인하였다.

• 한국결정성장학회지
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• 제13권5호
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• pp.254-259
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• 2003

Sol-gel dip coating법으로 soda lime glass 기판 위에 ATO(antimony-doped tin oxide) 투명전도막을 제조할 때, 기판 위에 형성된 $SiO_2$ barrier 층 및 $N_2$ gas annealing 에 따른 광투과율 및 전기적 특성에 대한 효과를 정량적으로 측정하고, XPS(X-ray photoelectron spectroscopy) 분석을 통해 고찰하였다. $SiO_2$ barrier층을 갖는 glass 기판 위에 코팅된400 nm 두께의 ATO 박막을 질소분위기에서 annealing한 결과, 광 투과율은 84%그리고 전기저항은 약 $5.0\times 10^{-3}\Omega \textrm{cm}$로 측정되었다 XPS 분석결과 이러한 우수한 전기전도성은 $SiO_2$ buffer층이 glass 기판으로부터 Na 이온의 확산을 막아 ATO막 내에 $Na_2SnO_3$ 및 SnO와 같은 2차상 불순물의 형성을 억제하여 막 내부의 Sb의 농도 및 $Sb^{5+}/Sb^{3+}$ 비를 증가시키고, $N_2$ annealing은 $Sb^{5+}$ 도 환원시키지만 $Sn^{4+}$를 환원시키는 효과가 크게 작용하였기 때문으로 사료된다.