• Electrical & Electronic Materials
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• v.7 no.3
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• pp.231-235
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• 1994

The multi-dielectric layer $SiO_2$/$Si_3{N_4}$/$SiO_2$ (ONO) is used to improve charge retention and to scale down the memory device. The nitride layer of MNOS device is oxidize to form ONO system. During the oxidation of the nitride layer, the change of thickness of nitride layer and generation of interface state between nitride layer and top oxide layer occur. In this paper, effects of oxidation of the nitride layer is studied. The decreases of the nitride layer due to oxidation and trapping characteristics of interface state of multi layer dielectric film are investigated through the C-V measurement and F-N tunneling injection experiment using SONOS capacitor structure. Based on the experimental results, carrier trapping model for maximum flatband voltage shift of multi layer dielectric film is proposed and compared with experimental data. As a results of curve fitting, interface trap density between the top oxide and layer is determined as being $5{\times}10^11$~$2{\times}10^12$[$eV^1$$cm^2$].

• Journal of the Korean Magnetics Society
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• v.12 no.4
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• pp.127-131
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• 2002

We fabricated MTJ devices that have doubly oxidized tunnel barrier using plasma oxidation method to from oxidized AlO$\sub$x/ tunnel barrier. Doubly oxidation I, which sputtered 10 ${\AA}$-bottom Al layer and oxidized it with oxidation time of 10 s. Subsequent sputtering of 13 ${\AA}$-Al was performed and the metallic layer was oxidized for 50, 80 and 120 s., respectively. Doubly oxidation II, which sputtered 10 ${\AA}$-bottom Al layer and oxidized it varying oxidation time for 30∼120 s. Subsequent sputtering of 13 ${\AA}$-Al was performed and the metallic layer was oxidized for 210 sec. Double oxidation process specimen showed MR ratio of above 27％ in all experiment range. Singly oxidation process. 13 ${\AA}$-Al layer and oxidized up to 210 s, showed less MR ratio and more narrow process window than those of doubly oxidation. Cross-sectional TEM images would that doubly oxidized barrowers were thinner and denser than singly oxidized ones. XPS characterization confirmed that doubly oxidation of Fe with bottom insulating layer. As a result, doubly oxidation could have superior MR ratio in process extent during long oxidation time because of preventing oxidation of bottom magnetic layer than singly oxidation.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.449-452
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• 1998

We have studied the oxidatio nrte of $Si_{1-x}Ge_{x}$ epitaxial layer grown by MBE(molecular beam epitaxy). Oxidation were performed at 700.deg. C, 800.deg. C, 900.deg. C, and 1000.deg. C. After the oxidation, the results of AES(auger electron spectroscopy) showed that Ge was completely rejected out of the oxide and pile up at $SiO_{2}/$Si_{1-x}Ge_{x}$ interface. It is shown that the presence of Ge at the $SiO_{2}$/$Si_{1-x}Ge_{x}$ interface changes the dry oxidation rate. The dry oxidation rate was equal to that of pure Si regardless of Ge mole fraction at 700.deg. C and 800.deg.C, while it was decreased at both 900.deg. C and 1000.deg.C as the Ge mole fraction was increased. The ry oxidation rates were reduced for heavy Ge concentration, and large oxidation time. In the parabolic growth region of $Si_{1-x}Ge_{x}$ oxidation, The parabolic rate constant are decreased due to the presence of Ge-rich layer. After the longer oxidation at the 1000.deg.C, AES showed that Ge peak distribution at the $SiO_{2}$/$Si_{1-x}Ge_{x}$ interface reduced by interdiffusion of silicon and germanium.

• 연구논문집
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• s.29
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• pp.141-149
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• 1999

Brazing of Fe-Cr-Al alloy was carried out at $1200^{\circ}C$ in vacuum furnace using nickel-based filler metals : BNi-5 powder(Ni-Cr-Si-Fe base alloy} and MBF-50 foil (Ni-Cr-Si-B). The effect of boron content on the stability of oxide scale on the brazed joint was investigated by means of cyclic oxidation test performed at $1050^{\circ}C$ and $1200^{\circ}C$. Apparently, the joints brazed with MBF-50 containing boron showed relatively stable oxidation rates compared to boron-free BNi-5 at both temperatures. However, it was considered that the slower weight loss of MBF-50 brazed specimen wasn’t resulted from the low oxidation rate but from the spallation of oxide layer. The oxide layer consisted of thick spinel oxide on the surface and $Al_2 O_3$ internal oxide layer along the interface between mother alloy and braze, the mother alloy was also eroded seriously by the formation of spinel oxides such as $FeCr_2 O_4$ and $NiCr_2 O_4$ on the surface, likely to be induced by the change of oxide forming mechanism due to diffusion of boron from the braze. On the contrary, the joint brazed with BNi-5 showed the good oxidation resistance during the cyclic oxidation test. It seems that the oxidation can be retarded by the formation of stable $Al_2 O_3$ layer at the surface.

• Journal of the Korean institute of surface engineering
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• v.47 no.1
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• pp.7-12
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• 2014

The characteristics of oxidation for the Zry-4 was measured in the $800^{\circ}C$ and high steam pressure (50 bar, 75 bar, 100 bar) conditions, using an apparatus for high pressure steam oxidation. The effect of accelerated oxidation by high-pressure steam was increased more than 60% in hydrogen-charged cladding than normal cladding. This difference between hydrogen charged claddings and normal claddings tends to be larger as the higher pressure. The accelerated oxidation effect of hydrogen charging cladding is regarded as the hydrogen on the metal layer affects the formation of the protective oxide layer. The creation of the sound monoclinic phase in Zry-4 oxidation influences reinforcement of corrosion-resistance of the oxide layer. The oxidation is estimated to be accelerated due to the creation of equiaxial type oxide film with lower corrosion resistance than that of columnar type oxide film. When tetragonal oxide film transformed into the monoclinic oxide film, surface energy of the new monoclinic phase reduced by hydrogen in the metal layer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.121-126
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• 2004

In this paper, the effects of the ozone oxidation of the landing polycrystalline silicon on the cell contact resistance of the DRAM device were studied. For this study, the ozone oxidation of the landing polycrystalline silicon layer was performed under various conditions, which was followed by the normal DRAM processes. Then, the cell contact resistance and $t_{WR}$ (write recovery time) of the devices were measured and analyzed. The experimental results showed that the cell contact resistance was more significantly increased for higher temperature of oxidation, longer time of oxidation, and higher concentration of ozone in the oxidation furnace. In addition, the TEM cross-sectional micrographs clearly showed that the oxide layer at the interface between the landing polycrystalline silicon layer and the plug polycrystalline silicon layer was increased by the ozone oxidation. Furthermore, the rate of the device failure due to too large write recovery time was also found to be well correlated with the increase of the cell contact resistance.

• Journal of the Korean Ceramic Society
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• v.36 no.11
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• pp.1228-1234
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• 1999

In order to form a uniform oxidation layer and spinel crystalline phase that was supposed to help strong bonding in Kovar(Fe-29Ni-17Co)to-glass sealing the humidified nitrogen (2.3%H2O/N2) was used as an oxidation atmosphere. Kovar oxidation was diffusion-contolled and the activation energy was 2.51 kcal/mol at 600-900$^{\circ}C$ After oxidation at 600$^{\circ}C$ the oxidation layer was under 1$\mu\textrm{m}$ thickness and crystalline phase was spinel which was found to be suitable for the Kovar-to-glass sealing.

• Korean Journal of Materials Research
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• v.15 no.4
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• pp.233-239
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• 2005

In this study, the effects of Pd buffer layer on the oxidation resistance of Pt modified-pack aluminized Inconel 738LC, used for gas turbine, were investigated. Pd was electroplated on Inconel 738LC, and Pt was electroplated on the electroplated Pd surface. Thus, the thickness of electroplated Pt/Pd was $10\;{\mu}m$ and the atomic ratio of Pt : Pd was about 6 : 4. After Pt/Pd electroplating, Inconel 738LC was pack aluminized to form the oxidation resistant layer. To investigate the oxidation resistance of Pt/Pd modified-pack aluminized Inconel 738LC, iso-thermal oxidation and cyclic oxidation were performed. The iso-thermal oxdation and the cyclic oxidation data indicated that the Pt/Pd modified-pack aluminized Inconel 738LC was more oxidation resistant than the Pt modified-pack aluminized Inconel 738LC. It was thought that the difference of thermal expansion coefficient between Inconel 738LC and Pt was lowered by the Pd buffer layer.

• Transactions on Electrical and Electronic Materials
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• v.1 no.3
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• pp.23-28
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• 2000

A block-oxide layer was formed on the surface of Cu-based leadframe by chamical oxidation method in order to enhance the adhesion strength between Cu-based leadframe and epoxy molding compound (EMC) Using sandwiched double cantilever beam (SDCB) specimens, the adesion strength was measured in terms of interfacial fracture toughness, G$\sub$IC//Results showed that the black-oxide layer was composed of two kinds of layers: pebble-like Cu$_2$O layer and acicular CuO layer, At the initial stage of oxidation the Cu$_2$O layer was preferentially formed and thickened up to around 200 nm whithin 1 minute of the oxidation time. Then the CuO layer started to from atop of the Cu$_2$O layer and thickened up to around 1300 nm until 20 minutes. As soon as the CuO layer formed, the thickness of Cu$_2$O layer began to reduce and finally reached to around 150 nm. The pre-cleaned and the Cu$_2$O coated leadframes showed almost no adhesion of EMC, however, as the CuO precipitates appeared and became continuous, G$\sub$IC/ increased up to around 80 J/㎡. Further oxidation raised G$\sub$IC/ up. to around 100 J/㎡.

• Clean Technology
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• v.27 no.3
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• pp.217-222
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• 2021

Although monolayer black phosphorus (BP) and few-layer BP nanosheets (NSs) have been extensively studied as promising alternatives to graphene, research has focused primarily on atomically thin-layered BP in an isolated form. In order to realize the practical applications of BP-related devices, a BP film based on continuous networking of few-layer BP NSs should be developed. In this study, a transparent BP film with high quality was fabricated via a vacuum filtration method. An oxygen-free water solvent was used as an exfoliation medium to avoid significant oxidation of the few-layer BP NSs in liquid-phase exfoliation. The exfoliation efficiency from bulk BP to the few-layer BP NSs was estimated at 22%, which is highly efficient for the production of continuous BP film. The characteristics of the high-quality BP film were determined as 98% transparency, minimum oxidation of 18%, structural stability, and an appropriate bandgap of about 1.8 eV as a semiconductor layer. In order to demonstrate the potential of the BP film for photocatalytic activity, we performed photoelectrochemical water oxidation of the transparent BP film. Although its performance should be improved for practical applications, the BP film could function as a photoanode, which offers a new potential semiconductor in water oxidation. We believe that if the BP film is adequately engineered with other catalysts the photocatalytic activity of the BP film will be improved.