• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.371.2-371.2
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• 2016

Graphene electronics is one of the promising technologies for the next generation electronic devices due to the outstanding properties such as conductivity, high carrier mobility, mechanical, and optical properties along with extended applications using 2 dimensional heterostructures. However, large contact resistance between metal and graphene is one of the major obstacles for commercial application of graphene electronics. In order to achieve low contact resistance, numerous researches have been conducted such as gentle plasma treatment, ultraviolet ozone (UVO) treatment, annealing treatment, and one-dimensional graphene edge contact. In this report, we suggest a fabrication method of one-dimensional graphene metal edge contact without using graphene exfoliation. Graphene is grown on Cu foil by low pressure chemical vapor deposition. Then, the graphene is transferred on $SiO_2/Si$ wafer. The patterning of graphene channel and metal electrode is done by photolithography. $O_2$ plasma is applied to etch out the exposed graphene and then Ti/Au is deposited. As a result, the one-dimensional edge contact geometry is built between metal and graphene. The contact resistance of the fabricated one-dimensional metal-graphene edge contact is compared with the contact resistance of vertically stacked conventional metal-graphene contact.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.307.1-307.1
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• 2016

Amorphous zinc tin oxide (ZTO) thin films are being widely studied for a variety electronic applications such as the transparent conducting oxide (TCO) in the field of photoelectric elements and thin film transistors (TFTs). Thin film transistors (TFTs) with transparent amorphous oxide semiconductors (TAOS) represent a major advance in the field of thin film electronics. Examples of TAOS materials include zinc tin oxide (ZTO), indium gallium zinc oxide (IGZO), indium zinc oxide, and indium zinc tin oxide. Among them, ZTO has good optical and electrical properties (high transmittance and larger than 3eV band gap energy). Furthermore ZTO does not contain indium or gallium and is relatively inexpensive and non-toxic. In this study, ZTO thin films were formed by UHV RF magnetron co-sputter deposition on silicon substrates and sapphires. The films were deposited from ZnO and SnO2 target in an RF argon and oxygen plasma. The deposition condition of ZTO thin films were controlled by RF power and post anneal temperature using rapid thermal annealing (RTA). The deposited and annealed films were characterized by X-ray diffraction (XRD), atomic force microscope (AFM), ultraviolet and visible light (UV-VIS) spectrophotometer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.12
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• pp.1245-1249
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• 2015

This study investigated the reflection spectra of wrinkled metal/polymer multilayers. A wavy surface was self-assembled by annealing an aluminum-coated poly(methyl metacrylate) layer on a silicon substrate. The total and diffuse reflectance characteristics of the sample with additional metal coatings(aluminum or silver) were evaluated in the visible wavelength(400~800 nm) using a spectrophotometer. The results showed that the wrinkled surface enhanced the diffuse reflectance up to 40~50% in the lower-wavelength range, demonstrating its potential for applications to optical thin-film devices.

• Journal of the Korean Ceramic Society
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• v.43 no.2 s.285
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• pp.69-73
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• 2006

A full retention of the tetragonal phase with coarse grains $(50\~60\;{\mu}m)$ was possible with the specimen $ZrO_2-1.9\;mol\%\;Y_2O_3$. In these coarse grains, $\{101\}_t$ annealing twins were frequently observed, although they do not exist in the usual fine grained specimens. The morphology and growth rate of the isothermally formed individual products are studied at an optical microscopic level. The habit planes of both products are also identified by performing two-surface trace analysis on the grains whose orientations are determined by the Electron Back Scattering Pattern (EBSP) method. The morphologies of isothermal martensite were well-defined thin plates and lenticular types. The growth rate in their longitudinal directions was quite slow and temperature-dependent. A two-surface trace analysis, incorporated with the EBSP method, identified the habit planes near $\{013\}_c$, in agreement with previous reports obtained from TEM works.

• Korean Journal of Materials Research
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• v.14 no.7
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• pp.477-481
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• 2004

High quality polycrystalline silicon is very critical part of the high quality thin film transistor(TFT) for display devices. Metal induced lateral crystallization(MILC) is one of the most successful technologies to crystallize the amorphous silicon at low temperature(below $550^{\circ}C$) and uses conventional and large glass substrate. In this study, we observed that the MILC behavior changed with abrupt variation of the amorphous silicon active pattern width. We explained these phenomena with the novel MILC mechanism model. The 10 nm thick Ni layers were deposited on the glass substrate having various amorphous silicon patterns. Then, we annealed the sample at $550^{\circ}C$ with rapid thermal annealing(RTA) apparatus and measured the crystallized length by optical microscope. When MILC progress from narrow-width-area(the width was $w_2$) to wide-width-area(the width was $w_1$), the MILC rate decreased dramatically and was not changed for several hours(incubation time). Also the incubation time increased as the ratio, $w_1/w_2$, get larger. We can explain these phenomena with the tensile stress that was caused by volume shrinkage due to the phase transformation from amorphous silicon to crystalline silicon.

• Corrosion Science and Technology
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• v.9 no.3
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• pp.109-115
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• 2010

Interstitial-free (IF) steels are widely used for car body material. However, a few types of streaky mark defect are commonly found on hot dip galvannealed (GA) IF steel sheets. In the present study, both the phase structure of a streaky mark defect and the microstructure of the substrate just below it were characterized by optical microscopy (OM) and scanning electron microscopy (SEM). It was found that the bright streaky mark area was composed of ${\delta}$ phase while the dark normal area was full of craters. More than half of the grains at the uppermost surface of the substrate just below the streaky mark defect are unrecrystallized grains which could result from lower finish rolling temperature during hot rolling and be kept stable during the annealing process, while almost all the grains in the normal area are equiaxed grains. In order to confirm the effect of the unrecrystallized grains on the coating morphology, hot dip galvannealing simulation experiments were carried out in IWATANI HDPS. It is proved that the unrecrystallized grains accelerate the Fe-Zn reaction rate during galvannealing and result in a flatter coating surface and an even coating thickness. Finally, a formation mechanism of the streaky mark defect on the hot dip galvannealed IF steel sheet was discussed.

• Transactions on Electrical and Electronic Materials
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• v.8 no.2
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• pp.89-92
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• 2007

$CuInSe_2$ thin film were prepared in order to clarify optimum conditions for growth of the thin film depending upon process, and then by changing a number of deposition conditions and heat treatment conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were deposited in the named order. Among them, Cu and In were deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1:1, while the annealing temperature having an effect on the quality of the thin film was changed from $200\;^{\circ}C$ to $350\;^{\circ}C$ at intervals of $50\;^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04c
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• pp.86-90
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• 2008

$CuInSe_2$ thin film were prepared in order to clarify optimum conditions for growth of the thin film depending upon process, and then by changing a number of deposition conditions and heat treatment conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were deposited in the named order. Among them, Cu and In were deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1:1, while the annealing temperature having an effect on the quality of the thin film was changed from $200^{\circ}C$ to $350^{\circ}C$ at intervals of $50^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.2
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• pp.117-121
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• 2018

Perovskite solar cells have received increasing attention in recent years because of their outstanding power conversion efficiency (exceeding 22%). However, they typically contain toxic Pb, which is a limiting factor for industrialization. We focused on preparing Pb-free perovskite films of Ag-Bi-I trivalent compounds. Perovskite thin films with improved optical properties were obtained by applying an anti-solvent (toluene) washing technique during the spin coating of perovskites. In addition, the surface condition of the perovskite film was optimized using a multi-step thermal annealing treatment. Using the optimized process parameters, $AgBi_2I_7$ perovskite films with good absorption and improved planar surface topography (root mean square roughness decreased from 80 to 26 nm) were obtained. This study is expected to open up new possibilities for the development of high performance $AgBi_2I_7$ perovskite solar cells for applications in Pb-free energy conversion devices.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.6
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• pp.1425-1431
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• 2013

We have measured the radiation-induced Bragg wavelength shift (BWS) of fiber Bragg grating (FBG) which was inscribed in Ge-doped core silica using a phase mask during irradiation up to a dose of 23 kGy and annealing effects after the gamma-exposure. For packaged FBG sensors, we observed the maximum radiation-induced BWS of about 91 pm during irradiation. Packaged FBG sensors also show higher radiation sensitivity above nearly a factor of two than non-packaged type sensor in the same condition.