• 제목/요약/키워드: on-wafer measurement

검색결과 199건 처리시간 0.031초

Superconductivity on Nb/Si(111) System : scanning tunneling microscopy and spectroscopy study

  • Jeon, Sang-Jun;Suh, Hwan-Soo;Kim, Sung-Min;Kuk, Young
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
    • /
    • pp.390-390
    • /
    • 2010
  • Superconducting proximity effects of Nb/Si(111) were investigated with scanning tunneling microscopy(STM) and scanning tunneling spectroscopy(STS). A highly-doped($0.002\;{\omega}{\diamondsuit}cm$) Si wafer pieces were used as substrate and Nb source was thermally evaporated onto the atomically clean silicon substrate. The temperature of the silicon sample was held at $600^{\circ}C$ during the niobium deposition. And the sample was annealed at $600^{\circ}C$ for 30 minutes additionally. Volmer-Weber growth mode is preferred in Nb/Si(111) at the sample temperature of $600^{\circ}C$. With proper temperature and annealing time, we can obtain Nb islands of lateral size larger than Nb coherence length(~38nm). And outside of the islands, bare Si($7{\times}7$) reconstructed surface is exposed due to the Volmer-Weber Growth mode. STS measurement at 5.6K showed that Nb island have BCS-like superconducting gap of about 2mV around the Fermi level and the critical temperature is calculated to be as low as 6.1K, which is lower than that of bulk niobium, 9.5K. This reduced value of superconducting energy gap indicates suppression of superconductivity in nanostructures. Moreover, the superconducting state is extended out of the Nb island, over to bare Si surface, due to the superconducting proximity effect. Spatially-resolved scanning tunneling spectroscopy(SR-STS) data taken over the inside and outside of the niobium island shows gradually reduced superconducting gap.

  • PDF

자동화 물류시스템 내 차량 혼잡도를 고려한 무인운반차량의 동적 경로 결정 알고리즘 (A Dynamic OHT Routing Algorithm in Automated Material Handling Systems)

  • 강봉권;강병민;홍순도
    • 산업경영시스템학회지
    • /
    • 제45권3호
    • /
    • pp.40-48
    • /
    • 2022
  • An automated material handling system (AMHS) has been emerging as an important factor in the semiconductor wafer manufacturing industry. In general, an automated guided vehicle (AGV) in the Fab's AMHS travels hundreds of miles on guided paths to transport a lot through hundreds of operations. The AMHS aims to transfer wafers while ensuring a short delivery time and high operational reliability. Many linear and analytic approaches have evaluated and improved the performance of the AMHS under a deterministic environment. However, the analytic approaches cannot consider a non-linear, non-convex, and black-box performance measurement of the AMHS owing to the AMHS's complexity and uncertainty. Unexpected vehicle congestion increases the delivery time and deteriorates the Fab's production efficiency. In this study, we propose a Q-Learning based dynamic routing algorithm considering vehicle congestion to reduce the delivery time. The proposed algorithm captures time-variant vehicle traffic and decreases vehicle congestion. Through simulation experiments, we confirm that the proposed algorithm finds an efficient path for the vehicles compared to benchmark algorithms with a reduced mean and decreased standard deviation of the delivery time in the Fab's AMHS.

Optimal pressure and temperature for Cu-Cu direct bonding in three-dimensional packaging of stacked integrated circuits

  • Seunghyun Yum;June Won Hyun
    • 한국표면공학회지
    • /
    • 제56권3호
    • /
    • pp.180-184
    • /
    • 2023
  • Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm2. Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

Quatrz 웨이퍼의 직접접합과 극초단 레이저 가공을 이용한 체내 이식형 혈압센서 개발 (Development of Implantable Blood Pressure Sensor Using Quartz Wafer Direct Bonding and Ultrafast Laser Cutting)

  • 김성일;김응보;소상균;최지연;정연호
    • 대한의용생체공학회:의공학회지
    • /
    • 제37권5호
    • /
    • pp.168-177
    • /
    • 2016
  • In this paper we present an implantable pressure sensor to measure real-time blood pressure by monitoring mechanical movement of artery. Sensor is composed of inductors (L) and capacitors (C) which are formed by microfabrication and direct bonding on two biocompatible substrates (quartz). When electrical potential is applied to the sensor, the inductors and capacitors generates a LC resonance circuit and produce characteristic resonant frequencies. Real-time variation of the resonant frequency is monitored by an external measurement system using inductive coupling. Structural and electrical simulation was performed by Computer Aided Engineering (CAE) programs, ANSYS and HFSS, to optimize geometry of sensor. Ultrafast laser (femto-second) cutting and MEMS process were executed as sensor fabrication methods with consideration of brittleness of the substrate and small radial artery size. After whole fabrication processes, we got sensors of $3mm{\times}15mm{\times}0.5mm$. Resonant frequency of the sensor was around 90 MHz at atmosphere (760 mmHg), and the sensor has good linearity without any hysteresis. Longterm (5 years) stability of the sensor was verified by thermal acceleration testing with Arrhenius model. Moreover, in-vitro cytotoxicity test was done to show biocompatiblity of the sensor and validation of real-time blood pressure measurement was verified with animal test by implant of the sensor. By integration with development of external interrogation system, the proposed sensor system will be a promising method to measure real-time blood pressure.

$AgGaSe_2$ 단결정 박막 성장과 광전기적 특성 (Growth and Optoelectrical Properties for $AgGaSe_2$ Single Crystal Thin Films)

  • 홍광준;유상하
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
    • /
    • pp.171-174
    • /
    • 2004
  • The stochiometric $AgGaSe_2$ polycrystalline mixture of evaporating materials for the $AgGaSe_2$ single crystal thin film was prepared from horizontal furnace. To obtain the single crystal thin films, $AgGaSe_2$ mixed crystal and semi-insulating GaAs(100) wafer were used as source material and substrate for the Hot Wall Epitaxy (HWE) system, respectively. The source and substrate temperature were fixed at $630^{\circ}C$ and $420^{\circ}C$, respectively. The thickness of grown single crystal thin films is $2.1{\mu}m$. The single crystal thin films were investigated by photoluminescence and double crystal X-ray diffraction(DCXD) measurement. The carrier density and mobility of $AgGaSe_2$ single crystal thin films measured from Hall effect by van der Pauw method are $4.89{\times}10^{17}\;cm^{-3},\;129cm^2/V{\cdot}s$ at 293K, respectively. From the photocurrent spectrum by illumination of perpendicular light on the c - axis of the $AgGaSe_2$ single crystal thin film, we have found that the values of spin orbit splitting ${\Delta}S_o$ and the crystal field splitting ${\Delta}C_r$ were 0.1762 eV and 0.2494 eV at 10 K, respectively. From the photoluminescence measurement of $AgGaSe_2$ single crystal thin film, we observed free excition $(E_X)$ observable only in high quality crystal and neutral bound exciton $(D^o,X)$ having very strong peak intensity And, the full width at half maximum and binding energy of neutral donor bound excition were 8 meV and 14.1 meV, respectively. By Haynes rule, an activation energy of impurity was 141 meV.

  • PDF

광위상변조기 제작용 Single Channel 및 1$^\circ$ Y-branch Mach-Zehnder간섭기형 Ti:LiNbO$_3$ 도파로 Pigtailing 및 도파실험 (Pigtailing and Guiding Experiments of Single and 1$^\circ$ Y-branch Ti:LiNbO$_3$ Mach-Zehnder Inteferometric Optical Waveguide for fabricating an Optical Phase Modulator)

  • 김성구;정운조;조재철;박계춘;이진
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 1998년도 춘계학술대회 논문집
    • /
    • pp.101-104
    • /
    • 1998
  • We report some methods for measuring a LiNbO$_3$ optical phase modulator bandwidth. Since Mach-Zehnder waveguide type, one of methods for modulation bandwidth measurement, is comparatively simple and useful, it was adapted in this work. In order to confirm this method, the waveguide of single and Mach-Zehnder type were fabricated on the same wafer. The Mach-Zehnder interferometric waveguide and the single channel waveguide were used for the measurement of the phase modulator's driving voltage and bandwidth for device fabrications, respectively. Ti-860$\AA$ in-diffusion was achieved in a wet-bubbling oxygen environment at 105$0^{\circ}C$/8hours. LINbO$_3$ internal chips were pigtailed to PMF(polarization maintaining fiber)/SMF(single mode fiber) using an epoxy curing technique. Examined were optical properties such as an insertion loss, propagation loss and mode size, and the loss mechanism of optical coupling between an optical fiber and a waveguide was considered.

  • PDF

광산란법에서 실리카 졸의 농도 및 표면특성이 입자 크기 및 전기영동 이동도 측정결과에 미치는 영향 (Effect of Concentration and Surface Property of Silica Sol on the Determination of Particle Size and Electrophoretic Mobility by Light Scattering Method)

  • 조경숙;이동현;김대성;임형미;김종엽;이승호
    • Korean Chemical Engineering Research
    • /
    • 제51권5호
    • /
    • pp.622-627
    • /
    • 2013
  • 콜로이달 실리카는 실리콘과 사파이어 웨이퍼의 정밀연마슬러리, 유-무기 하이브리드 코팅제, 정밀주조의 바인더 등 다양한 제품으로 사용되는 물질이다. 이러한 실리카 졸의 입자크기 및 분산 안정성은 웨이퍼의 표면, 코팅 막 혹은 벌크의 기계적, 화학적, 광학적 특성에 영향을 주기 때문에 정확한 측정값이 요구된다. 본 연구에서는 제조사에서 제시한 입자 크기 및 표면 특성이 다른 8종류 실리카 졸의 부피 분율에 따라 입자 크기, 졸 점도 및 입자 전기영동이동도의 측정결과에 미치는 영향을 논의하였다. 높은 표면활성을 지닌 실리카 입자의 특성 및 실리카 졸의 희석에 의한 안정화 이온 농도의 변화로 인해 실리카의 측정 입자 크기와 이동도는 졸의 부피 분율 혹은 입자 크기에 따라 변한다. 60 nm 보다 작은 입자는 부피 분율이 증가함에 따라 측정된 입자 크기가 증가한 반면에, 그 보다 큰 입자에서는 측정된 입자 크기가 감소하였다. 12 nm와 같이 작은 입자는 부피 분율이 증가함에 따라 점도가 상승하면서 측정 입자의 이동도가 감소한 반면에 100 nm의 큰 입자는 0.048의 낮은 부피 분율까지 이동도가 증가하다가 그보다 높은 부피 분율부터 감소하였다.

디지털 홀로그래피를 이용한 포토리소그래피 공정 제품 패터닝의 폭과 단차 측정 (Measurement of Width and Step-Height of Photolithographic Product Patterns by Using Digital Holography)

  • 신주엽;강성훈;마혜준;권익환;양승필;정현철;홍정기;김경석
    • 비파괴검사학회지
    • /
    • 제36권1호
    • /
    • pp.18-26
    • /
    • 2016
  • 반도체 산업은 우리나라 주력산업중 하나로 매년 꾸준한 성장세를 보이며 지속적인 성장을 하고 있다. 이러한 반도체 산업에서의 중요한 기술은 소자의 고 집적화이다. 이는 면적당 메모리 용량을 증가시키는 것으로 핵심역할을 하는 것이 바로 포토리소그래피 기술이다. 포토리소그래피란 마스크의 표면에 빛을 쬐어 생기는 그림자를 웨이퍼 상에 인쇄하는 기술이며 반도체 제조공정에서의 가장 중요한 공정이다. 이러한 공정을 통해 나온 패터닝을 분석 시에 폭과 단차의 균일성을 측정한다. 이에 따라 본 논문은 포토리소그래피 공정이 적용된 시험편 패터닝에 폭과 판 사이와의 단차를 투과형 디지털 홀로그래피를 구성하여 측정하고자 한다. 투과형 디지털 홀로그래피 간섭계를 구성하고 시험편에 임의의 9포인트를 설정하여 각 포인트를 측정하고 상용장비인 SEM (scanning electron microscopy)과 alpha step으로 측정한 결과와 비교하고자 한다. 투과형 디지털 홀로그래피는 측정시간이 타 기법에 비에 짧다는 장점과 배율렌즈를 사용하기 때문에 저 배율에서 고 배율로 변경하여 측정할 수 있는 장점을 가지고 있다. 실험 결과로부터 투과형 디지털 홀로그래피가 포토 리소그래피가 적용된 패터닝 측정에 유용한 기술임을 확인할 수 있었다.

The effect of thermal anneal on luminescence and photovoltaic characteristics of B doped silicon-rich silicon-nitride thin films on n-type Si substrate

  • Seo, Se-Young;Kim, In-Yong;Hong, Seung-Hui;Kim, Kyung-Joong
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
    • /
    • pp.141-141
    • /
    • 2010
  • The effect of thermal anneal on the characteristics of structural properties and the enhancement of luminescence and photovoltaic (PV) characteristics of silicon-rich silicon-nitride films were investigated. By using an ultra high vacuum ion beam sputtering deposition, B-doped silicon-rich silicon-nitride (SRSN) thin films, with excess silicon content of 15 at. %, on P-doped (n-type) Si substrate was fabricated, sputtering a highly B doped Si wafer with a BN chip by N plasma. In order to examine the influence of thermal anneal, films were then annealed at different temperature up to $1100^{\circ}C$ under $N_2$ environment. Raman, X-ray diffraction, and X-ray photoemission spectroscopy did not show any reliable evidence of amorphous or crystalline Si clusters allowing us concluding that nearly no Si nano-cluster could be formed through the precipitation of excess Si from SRSN matrix during thermal anneal. Instead, results of Fourier transform infrared and X-ray photoemission spectroscopy clearly indicated that defective, amorphous Si-N matrix of films was changed to be well-ordered thanks to high temperature anneal. The measurement of spectral ellipsometry in UV-visible range was carried out and we found that the optical absorption edge of film was shifted to higher energy as the anneal temperature increased as the results of thermal anneal induced formation of $Si_3N_4$-like matrix. These are consistent with the observation that higher visible photoluminescence, which is likely due to the presence of Si-N bonds, from anneals at higher temperature. Based on these films, PV cells were fabricated by the formation of front/back metal electrodes. For all cells, typical I-V characteristic of p-n diode junction was observed. We also tried to measure PV properties using a solar-simulator and confirmed successful operation of PV devices. Carrier transport mechanism depending on anneal temperature and the implication of PV cells based on SRSN films were also discussed.

  • PDF

다중 시계열 패턴인식을 이용한 반도체 생산장치의 지능형 감시시스템 (An Intelligent Monitoring System of Semiconductor Processing Equipment using Multiple Time-Series Pattern Recognition)

  • 이중재;권오범;김계영
    • 정보처리학회논문지D
    • /
    • 제11D권3호
    • /
    • pp.709-716
    • /
    • 2004
  • 본 논문에서는 다중 시계열 패턴인식 사용하여 생산장치의 상태자료부터 공정결과를 예측하여 정상 또는 비정상을 판정하는 지능형 감시시스템에 관하여 기술한다. 제안하는 감시스템은 초기화, 학습 그리고 인식의 세 단계로 구성된다. 초기화 단계에서는 감시대상의 생산장치가 가지는 인사들 각각의 가중치와 각 인자들이 가지는 시계열 자료 중에서 학습과 인식에 유효단계를 설정한다. 학습단계에서는 LBG알고리즘을 사용하여 이 생산장치에 의하여 생성되고 수집된 패턴들을 군집화 한다. 각 패턴은 시계열 형태의 자료와 처리 완료 후 계측기에 의하여 측정된 ACI로 구성된다. 인식단계에서는 DTW를 사용하여 실시간으로 입력된 패턴과 군집화된 패턴들 사이의 대응을 수행하여 가장 잘 정합되는 패턴을 찾는다. 다음은 이 패턴이 가지는 ACI, 차 그리고 가중치들의 조합으로 예측된 ACI 값을 산출한다. 최종적으로 예측된 ACI가 정상으로 수용할 수 있는 값 범위에 없는지 여부를 결정한다. 제안하는 시스템의 성능평가를 위하여 식각장치로부터 획득된 자료를 대상으로 실험하였다. 실험결과에서는 학습횟수가 증가함에 따라 예측 ACI값과 실측ACI값 사이의 오차가 현저히 감소함을 볼 수 있다