• Title/Summary/Keyword: ohmic

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Fabrication of self aligned APCVD A-Si TFT by using ion shower doping method (이온 샤우어 도핑을 이용한 자기정렬방식의 APCVD 비정질 실리콘 박막 트랜지스터의 제작)

  • Moon, Byeong-Yeon;Lee, Kyung-Ha;Jung, You-Chan;Yoo, Jae-Ho;Lee, Seung-Min;Jang, Jin
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.1
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    • pp.146-151
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    • 1995
  • We have studied the fabrication self aligned atmospheric pressure(AP) CVD a-Si thin film transistor with source-drain ohmic contact by using ion shower doping method. The conductivity is 6*10$^{-2}$S/cm when the acceleration voltage, doping time and doping temperature are 6kV, 90s and 350.deg. C, respectively. We obtained the field effect mobility of 1.3cm$^{2}$/Vs and the threshold voltage of 7V.

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Wideband modulation analysis of a packaged semiconductor laser in consideration of the bonding wire effect (실장된 반도체 레이저의 본딩와이어를 고려한 광대역 변조 특성 해석)

  • 윤상기;한영수;김상배;이해영
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.2
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    • pp.148-162
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    • 1996
  • Bonding wires for high frequency device packaging have dominant parasitic inductances which limit the performance of semiconductor lasers. In this paper, the inductance sof bonding wires are claculated by the method of moments with incorporation of ohmic loss, and the wideband modulation characteristics are analyzed for ddifferent wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire lengths and structures. We observed the modulation bandwidth for 1mm-length bonding wire is 7 GHz wider than that for 2mm-length bonding wire. We also observed th estatic inductance calculation results in dispersive deviation of the parasitic inductance and the modulation characteristics from the wideband moment methods calculations. The angled bonding wire has much less parasitic inductance and improves the modulation bandwidth more than 6 GHz. This calculation resutls an be widely used for designing and packaging of high-speed semiconductor device.

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Electric Voltage and Current Characteristics of Fuel Cell for Machine Tool Power Supply (공작기계 동력용 연료전지의 전압과 전류특성에 관한 연구)

  • Kim H. G.;Kim Y. S.;KIm H. Y.
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.14 no.1
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    • pp.1-7
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    • 2005
  • PEMFC (Proton Exchange Membrane Fuel Cell) is considered as an attractive option to produce electric power in manyapplications. A fundamental step of theoretical fuel cell open circuit potential is examined and compared with the measured data from 1.2KW PEMFC module. The hydrogen pressure and stack temperature are also measured during the operation of PEMFC module. It is found that the stack voltage and current data agree in general with the results calculated by chemical potential approach though they still have a discrepancy. It is analysed that the discrepancy is due to activation polarization, concentration overvoltage and ohmic overvoltage.

Electrical Conduction and Resistance Switching Mechanisms of Ag/ZnO/Ti Structure

  • Nguyen, Trung Do;Pham, Kim Ngoc;Tran, Vinh Cao;TuanNguyen, Duy Anh;Phan, Bach Thang
    • Journal of IKEEE
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    • v.17 no.3
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    • pp.229-233
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    • 2013
  • We investigated electrical conduction and resistance switching behavior of the Ag/ZnO/Ti structures for random access memory devices. These films were prepared on glass substrate by dc sputtering technique at room temperature. The resistance switching follows unipolar switching mode with small switching voltages (0.4 V - 0.6 V). Two electrical conduction mechanisms dominating the LRS and HRS are Ohmic and trap-controlled space charge limited current, respectively. These both conductions are consistent with the filamentary model. Based on the filamentary model, the switching mechanism was also interpreted.

Electrical Characteristics of n-GaN Schottky Diode fabricated by using Electrochemical Metallization (Electrochemical Metallization방법을 이용한 GaN Schottky Diode의 제작과 전기적 특성 향상 및 분석)

  • ;Daejun Fu
    • Proceedings of the IEEK Conference
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    • 2001.06b
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    • pp.205-208
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    • 2001
  • Schottky barrier diodes are fabricated on a intrinsic GaN(4${\mu}{\textrm}{m}$) epitaxial structure grown by rf plasma molecular beam epitaxy (MBE) on sapphire substrates. First, We make Ohmic electrodes (Ti/Al/Ti/Au) by evaporator. Next, we contact RuO$_2$ by dipping in the solution (RuCl$_3$.HClO$_4$), and then we deposit Ni/Au on the surface of RuO$_2$ by evaporator. We study the electrical characteristics of GaN Schottky barrier diodes made by these methods. Measurements are C-V, I-V, SEM, EDX, and XRD for the characteristics of devices. Thickness of RuO$_2$ layer depends on supplied voltage and dipping time. Device of thinner RuO$_2$ layer have a good Schottky characteristics compare with device of thicker RuO$_2$ layer

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Wideband Characterization of Angled Double Bonding Wires for Microwave Devices (초고주파 소자를 위한 사잇각을 갖는 이중 본딩와이어의 광대역 특성 해석)

  • 윤상기;이해영
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.9
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    • pp.98-105
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    • 1995
  • Recent microwave IC's reach to the extent of high operating frequencies at which bonding wires limit their performance as dominant parasitic components. Double bonding wires separated by an internal angle have been firstly characterized using the Method of Moments with the incorporation of the ohmic resistance calculated by the phenomenological loss equivalence method. For a 30$^{\circ}$ internal angle, the calculated total reactance is 45% less than that of a single bonding wire due to the negative mutual coupling effect. The radiation effect has been observed decreasing the mutual inductance, whereas for parallel bonding wires it greatly increases the mutual inductance. This calculation results can be widely used for designing and packaging of high frequency and high density MMIC's and OEIC's.

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A study on the fabrication and the extraction of small signal equivalent circuit of power AlGaAs/GaAs HBTs (전력용 AlGaAs/GaAs HBT의 제작과 소신호 등가 회로 추출에 관한 연구)

  • 이제희;우효승;원태영
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.6
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    • pp.164-171
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    • 1996
  • We report the experimental resutls on AlGaAs/GaAs heterojunction bipolar transistors (HBTs) with carbon-doped base structure. To characterize the output power, load-pull mehtod was employed. By characterizing the devices with HP8510C, we extracted the small-signal equivalent circuit. The HBTs were fabricated employing wet mesa etching and lift-off process of ohmic metals. the implementation of polyimide into the fabriction process was accomplished to obtain the lower dielectric constant resultig in significant reduction of interconnect routing capacitance. The fabricated HBTs with an emitter area of 6${\times}14{\mu}m^{2}$ exhibited current gain of 45, BV$_{CEO}$ of 10V, cut-off frequency of 30GHz and power gain of 1 3dBm. To extract the small signal equivalent circuit, the de-embedded method was applied for parasitic parameters and the calculation of circuit equations for intrinsic parameters.

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Parasitics analysis of a grounded bondwire for low-cost plastic packaging of microwave devices (초고주파소자의 저가 플라스틱 실장을 위한 접지된 본딩와이어의 기생특성 해석)

  • 윤상기;이해영
    • Journal of the Korean Institute of Telematics and Electronics D
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    • v.34D no.2
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    • pp.21-26
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    • 1997
  • The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials hav been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The FR-4 composite is widely used as a basis material for PCB and plastic packages, because of it sinherent electricl and chemical stbility and low cost. The cole-cole model, which is representative complex permittivity model of epoxy polymers, has been applied to consider the dielectric effects in the MoM calculation. The prasitic impedance of a grounded bondwire in FR-4 composite is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies. These calculation results will be helpful for designing and packaging of high-frequency low-cost IC's.

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Noise Analysis of Sub Quarter Micrometer AlGaN/GaN Microwave Power HEMT

  • Tyagi, Rajesh K.;Ahlawat, Anil;Pandey, Manoj;Pandey, Sujata
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.3
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    • pp.125-135
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    • 2009
  • An analytical 2-dimensional model to explain the small signal and noise properties of an AlGaN/GaN modulation doped field effect transistor has been developed. The model is based on the solution of two-dimensional Poisson's equation. The developed model explains the influence of Noise in ohmic region (Johnson noise or Thermal noise) as well as in saturated region (spontaneous generation of dipole layers in the saturated region). Small signal parameters are obtained and are used to calculate the different noise parameters. All the results have been compared with the experimental data and show an excellent agreement and the validity of our model.

Fabrication and analysis of 400DPI LED array (400DPI LED array 제작 및 평가)

  • 박광범;김인회;문현찬;신상모;이태호;주동욱
    • Proceedings of the Optical Society of Korea Conference
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    • 2000.02a
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    • pp.30-31
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    • 2000
  • 400DPI LED array was fabricated by using reactive ion etching(RIE) method. Material of fabricated LED array was used the GaP for green light emitting and had a homojunction structure. Each cells of emitting area in the LED array were defined with RIE etching for electrical isolation between cells. Electrodes were formed on each cells to emit independently. Ohmic contact resistivity was approximate 1.2$\times$10$^{5}$ $\Omega$/$\textrm{cm}^2$ and 1.26$\times$10$^{5}$ $\Omega$/$\textrm{cm}^2$ using isothermal annealing at 38$0^{\circ}C$ and 43$0^{\circ}C$. Emitting intensity of each etmitting cell was 1.65 cd/$m^2$.

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