• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2512-2517
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• 2007

Effect of natural convention for hot plate surface temperature uniformity was studied by experiments that were adjusted height of chamber and temperature difference. The hot plate chamber is composed of the hot plate and the upper heater and adiabatic vertical wall. The hot plate diameter is 220mm and maintains temperature at $150^{\circ}C$. Flow pattern compares with surface temperature and confirms that natural convection affects on temperature uniformity of hot plate surface. In case, temperature non-uniformity of hot plate surface is due to heater pattern, lots of weak and small flow cells more improve temperature uniformity than stronger flow cells or non-developing flow cell. Improve temperature uniformity $1.2^{\circ}C$ when developing weak and small flow cells.

• Journal of Information Display
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• v.2 no.2
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• pp.27-31
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• 2001

Transistor slicing refers to the use of multiple smaller transistors in implementing a large MOS transistor. What is special about transistor slicing is that it can reduce the effects of device non-uniformity introduced during the fabrication process. The paper presents the idea of transistor slicing and analyzes the benefits of using transistor slicing in the context of Poly-Si TFT-LCD driving.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.73-73
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• 2008

In this work, the study on the $SiO_2$ film non-uniformity by PECVD (Plasma Enhanced Chemical Vapor Deposition) was performed. Plasma diagnostics was analyzed by a DLP(Double Langmuir Probe) and a probe-type QMS(Quadrupole Mass Spectrometer) in order to investigate the spatial distribution of the plasma species in the chamber. The relationship between the plasma species and the depositing rate of the films was examined. On the basis of this work, it was confirmed that O radical density mainly contributed to the increase in the depositing rate of the $SiO_2$ films and the electron temperature in the plasma had a main effect on the formation of the oxygen radicals.

• KSTLE International Journal
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• v.5 no.1
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• pp.32-35
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• 2004

The purpose of this study is to investigate the effects of the structure and mechanical properties of laser-processed pads on their polishing behavior such as their removal rate and WIWNU (within wafer non-uniformity) during the chemical mechanical planarization (CMP) process. The holes on the pad acted as the reservoir of slurry particles and enhanced the removal rate. Without grooves, no effective removal of wafers was possible. When the length of the circular-type grooves was increased, higher removal rates and lower wafer non-uniformity were measured. The removal rate and non-uniformity linearly increased as the elastic modulus of the top pad increased. Higher removal rates and lower non-uniformity were measured as the hardness of the pad increased.

• Journal of Magnetics
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• v.22 no.2
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• pp.315-325
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• 2017

Magnetically suspended sensitive gyroscopes (MSSGs) provide an interesting alternative for achieving precious attitude angular measurement. To effectively reduce the measurement error caused by the non-uniformity of the air-gap flux density in a MSSG, this paper proposes a novel compensation method based on measuring and modeling of the air-gap flux density. The angular velocity measurement principle and the structure of the MSSG are described, and then the characteristic of the air-gap flux density has been analyzed in detail. Next, to compensate the flux density distribution error and improve the measurement accuracy of the MSSG, a real-time compensation method based on the online measurement with hall probes is designed. The common issues caused by the non-uniformity of the air-gap flux density can be effectively resolved by the proposed method in high-precision magnetically suspended configurations. Comparative simulation results before and after compensation have verified the effectiveness and superiority of the proposed compensation method.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.790-792
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• 2005

In this work we attempted to find the origin of brightness non-uniformity in SLS poly-Si TFT AMOLED. By developing a suitable SLS process with a compensation circuit, we have successfully improved the non-uniformity from 40% to 1.7%. We could fabricate 2.2" AMOLED display using SLS poly-Si.

• Journal of the Korea Safety Management & Science
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• v.17 no.1
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• pp.103-109
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• 2015

In this study, we quantitatively analyzed the data by measuring the radiation shielding rate and uniformity in order to evaluate the performance of an Apron. In addition, storage conditions were also evaluated. The uniformity measurement was performed by evaluating the Apron DICOM images using a PACS program. The experiment was intended for 51 Aprons being used in three hospitals in the Daejeon area. The radiation shielding rate and uniformity were measured per lead equivalent for 0.25 mmPb, 0.35 mmPb, and 0.5 mmPb. As a result, the higher lead equivalents were, the greater differences in the non-uniformity between the top part and the bottom part became (p=0.020). In all hospitals, regarding the non-uniformity of four places in Aprons, all showed statistically significant differences (p<0.01). The average value of the transmitted radiation dose showed less difference (p=0.005) in the bottom right than in the upper right but was statistically significant. There have been no marks of manufacturing date or the date of purchase in the Apron.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.4
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• pp.92-98
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• 2003

The optimum design of Hanyang low speed wind tunnel has been performed to augment flow uniformity and to reduce turbulence intensity of wind tunnel test section have to be known for reliability of wind tunnel test. The non-uniformity and turbulence intensity of Hanyang low speed wind tunnel were measured with Pilot tube and X-type hot-wire probe at various wind speeds. As the results, the non-uniformity decreases as the wind speed increases. The non-uniformity is relatively high in the proximity of the diffuser. The turbulence intensity is a little higher than design requirement in the middle of the test section.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.263-264
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• 2011

• 한국가시화정보학회:학술대회논문집
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• 2004.11a
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• pp.48-51
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• 2004

Chemical Mechanical Polishing(CMP) is popularly used in production of semiconductor because of large area polishing ability probability of improvement for more integrated circuit. However, present CMP processing causes some non-uniformity errors which can be critical for highly integrated circuit. Previous studies predict that flow-field of slurry during CMP can create non-uniformity, but no quantitative measurement has conducted. In this study, using PIV, slurry velocity flow-field during CMP is measured by changing the ratio of RPM of pad and carrier with tuned PIV system adequate for small room in CMP machine and Cabot's non-groove pad Epad-A100. The result show that velocity of slurry is majorly determined by pad-rpm and the ratio of between carrier and pad rpm make some changes in streamlines.