• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.481-484
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• 2016

Jansen mechanism is basic principal of walking robot. Because that mechanism have many link, walking robot can walk like animals. One of the feature is that space is existed between leg of walking robot and ground surface. So, it can walk through the non-uniform ground surface that have obstacle. In this paper, I will suggest design of walking robot that can walk on non-uniform ground surface effectively based on Jansen mechanism.

• Proceedings of the Korean Geotechical Society Conference
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• 2009.03a
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• pp.210-221
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• 2009

A new foundation type which is called Top-Base method has been used frequently in engineering practices in Korea. In this study, the settlement behavior of concrete Top-Base foundation on soft ground is investigated since the consolidation settlement of the embedding depth and the effect of footing dimensions are not included in current Korean criterion (2007). To obtain detailed information, the model tests of the Top-Base foundation are performed using the PLAXIS 3D finite element analysis. It is shown that in-situ measurements and finite element analysis of the behavior of foundations indicate that consolidation settlement is reduced up and bearing capacity of the foundation increases up to 50%~100%, compared to the primary non-treated ground. Based on this study, it is found that the Top-Base foundation prevents the lateral deformation of soft ground and reduces its negative dilatancy to the surface settlement, and that the foundation creates rather uniform stress distribution under it to increase its bearing capacity. It is also found that the total settlement of Top-Base foundation was highly dependent on the consolidation settlement and footing configurations.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.10
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• pp.82-88
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• 2014

This paper presents the results of model tests for the attachment process of lightning leader to ground which is one of poorly understood processes of cloud-to-ground lightning discharges. In order to simulate the attachment process of lightning leader to ground, we investigated the discharge characteristics of air gap between the tip of needle-shaped electrode and the soil surface as a parameter of moisture content in soils when the positive and negative $1.2/50{\mu}s$ lightning impulse voltages are applied. The breakdown voltage and the discharge light were observed. As a result, the attachment processes of lightning leader to ground are strongly dependent on the grain size and the moisture content of soils. The time to breakdown was shortened with increasing the magnitude of incident impulse voltages. The delay time from application of the highest voltage to breakdown in sand is shortened with increasing the moisture content. The delay time from application of the voltage to breakdown in gravel varied from about $0.5{\mu}s$ to several ${\mu}s$. As the moisture content in soil increases, the breakdown voltages are decreased and the breakdown voltage versus time to breakdown curves are shifted toward the lower side. The results obtained in this work are similar to those for non-uniform air gap stressed by lightning impulse voltages.

• Earthquakes and Structures
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• v.15 no.2
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• pp.193-202
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• 2018

This paper studied the probability of pounding occurred between decks and abutments of a long span high-pier continuous rigid fame bridge subjected to ground motions with local soil effect. A pounding probability analysis methodology has been proposed using peak acceleration at bedrock as intensity measure (IM) for multi-support seismic analysis. The bridge nonlinear finite element (FE) models was built with four different separation distances. Effect of actual site condition and non-uniform spatial soil profiles on seismic wave propagating from bedrock to ground surface is modelled. Pounding probability of the high-pier bridge under multi-support seismic excitations (MSSE) is analyzed based on the nonlinear incremental dynamic analysis (n-IDA). Pounding probability results under uniform excitations (UE) without actual local site effect are compared with that under MSSE with site effect. The study indicates that the required design separation length between deck and abutment under uniform excitations is larger than that under MSSE as the peak acceleration at bedrock increases. As the increase of both separation distance between deck and abutment and the peak acceleration, the probability of pounding occurred at a single abutment or at two abutments simultaneously under MSSE is less than that under UE. It is of great significance considering actual local site effect for determining the separation distance between deck and abutment through the probability pounding analysis of the high-pier bridge under MSSE.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Journal of the Korean Geotechnical Society
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• v.35 no.5
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• pp.21-30
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• 2019

While the study of the shallow tunnel has been mainly on the longitudinal load transfer and horizontal surface conditions, the study of the ground behavior of shallow tunnel under the slope is not sufficient. Therefore, in this study on the ground behavior around a tunnel due to the sidewall deformation of shallow tunnel under the slope that is excavated in longitudinal direction, a scale-down model test has been performed. The model tunnel has the dimension of 320 mm wide, 210 mm high and 55 mm long with enough material strength in aluminum and the model ground has the uniform ground conditions by 3 types of carbon rods. The model test has been performed with the variables of slopes and the cover depths by controlling the tunnel sidewall deformation, and the change of sidewall-load, load transfer, ground subsidence was monitored and analyzed. According to the increase of the slope, the maximum ground subsidence increased by 20~39% compared to the horizontal surface. The load ratio increased by maximum 20% in the tunnel crown and decreased in sidewall according to the surface slope. The load transfer shows maximum 128% of increase at the cover depth of 1.0D, while at the 1.5D cover depth it shows non-critical difference from horizontal surface. The slope has major effects on load transfer at the cover depth of 1.0D.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated

• Geotechnical Engineering
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• v.7 no.1
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• pp.33-40
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• 1991

This paper reports the application study of the ground reinforcement under a pipe joint. The soil-reinforcement interaction helps to minimize the stress concentration at joint. The settlement pattern and the earth pressure variation have been evaluated under the pipeline subjected to differential settlement. The pipeline is fixed at one side with the other side set free being loaded with a uniform surface loading. The problem has been studied by means of laboratory model test and flite element technique, and the analysis results are compared for both non-reinforced and reinforced cases to evaluate the effectiveness of the soil reinforcement for restraining the settlement of the pipeline.

• The Journal of Korean Academy of Prosthodontics
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• v.17 no.1
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• pp.23-34
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• 1979

In this study, the adhesive strength of three commercial polycarboxylate cements to ten types of dental casting alloys, such as gold, palladium, silver, indium, copper, nickel, chromium, and human enamel and dentine were measured and compared with that of a conventional zinc phosphate cement. The $8.0mm{\times}3.0mm$ cylindrical alloy specimens were made by casting. The enamel specimens were prepared from the labial surface of human upper incisor, and the dentine specimens were prepared from the occulusal surface of the human molar respectively. Sound extracted human teeth, which had been kept in a fresh condition since, extraction, were mounted in a wax box with a cold-curing acrylic resin to expose the flattened area. The mounted teeth were then placed in a Specimen Cutter (Technicut) and were cut down under a water spray, and then the flat area on the all specimens were ground by hand with 400 and 600 grit wet silicone carbide paper. Two such specimens were then cemented together face-to-face with freshly mixed cement, and moderate finger pressure was applied to squeeze the cement to a thin and uniform film. All cemented specimens were then kept in a thermostatic humidor cabinet regulated at $23{\pm}2^{\circ}C.$ and more than 95 per cent relative humidity and tested after 24 hours and 1 week. Link chain was attached to each alloy specimen to reduce the rigidity of the jig assembly, and then all the specimens were mounted in the grips of the Instron Universal Testing Machine, and a tensile load was delivered to the adhering surface at a cross head speed of 0.20 mm/min. The loads to which the specimens were subjected were recorded on a chart moving at 0.50 mm/min. The adhesive strength was determined by measuring the load when the specimen separated from the cement block and by dividing the load by the area. The test was performed in a room at $23{\pm}2^{\circ}C.$ and $50{\pm}10$ per cent relative humidity. A minimum of five specimens were tested each material and those which deviated more than 15 per cent from the mean were discarded and new specimens prepared. From the experiments, the following results were obtained. 1) It was found that the adhesive strength of the polycarboxylate cement to all alloys tested was considerably greater than that of the zinc phosphate cement. 2) The adhesive strength of the polycarboxylate cements was superior to the non precious alloys, such as the copper, indium, nickel and chromium alloys, but it was inferior to the precious gold, silver and palladium alloys. 3) Surface treatment of the alloy was found to be an important factor in achieving adhesion. It appears that a polycarboxylate cement will adhere better to a smooth surface than to a rough one. This contrasts with zinc phosphate cements, where a rough helps mechanical interlocking. 4) The adhesion of the polycarboxylate cement with enamel was found superior to its adhesion with dentine.