An Analysis on the Material Removal Mechanism of Chemical-Mechanical Polishing Process Part II: Dynamic Simulation (화학-기계적 연마 공정의 물질제거 메커니즘 해석 Part II: 동적 시뮬레이션)
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- Journal of the Semiconductor & Display Technology
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- v.6 no.3
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- pp.1-6
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- 2007