• 한국태양에너지학회 논문집
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• 제33권3호
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• pp.27-35
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• 2013

One of the most important factors that have a large influence on performance of the solar water heater system is performance of the solar collector, more detailedly, coating technology on the surface of the solar collector, which can provide high solar absorptance and low emittance. The core of the coating technology is to coat solar selective surfaces. In this study, various performance experiments are carried out using $Cr_2(SO_4)_3{\cdot}15H_2O$ coating technology. Here, IGBT(Insulated Gate Bipolar Transistor) of 5000A-15V was used as the surface processing rectifier which can stably output power and also can control voltage and current. The plating solution mainly contains black chrome$^{+3}$ concentration, H-y Conductivity, N-u Complex, NF Additive and NC-2 Wetter. Before applying the black chrome coating on the copper plate, optimal conditions are provided by using various preprocessing methods such as removal of fat, activation, electrolytic polishing, nickel strike, copper sulfate plating and bright neckel plating, and then the automatic continuous coating experiment are performed according to plating time and cathode current density. In the experiment, after the removal of fat, chemical polishing, nickel strike and activation processes as the preprocessing methods, the black chrome coating was performed in a plate solution temperature of $28^{\circ}C$ and a cathode current density of $18A/cm^2$ for 90 seconds. The thickness of chrome and nickel on the coated plate is $0.389{\mu}m$, $159{\mu}m$ respectively. As a result of the coating experiment, it showed the most excellent performance having a high solar absorptance of 98% and a low emittance of $5{\pm}1%$ when the black chrome surface had a thickness of $0.398{\mu}m$.

• 대한금속재료학회지
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• 제46권3호
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• pp.159-168
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• 2008

Thermally-evaporated 10 nm-Ni/1 nm-Ru/(30 nm or 70 nm-poly)Si structures were fabricated in order to investigate the thermal stability of Ru-inserted nickel monosilicide. The silicide samples underwent rapid thermal anne aling at $300{\sim}1,100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process were formed on the top of the single crystal and polycrystalline silicon substrates mimicking actives and gates. The sheet resistance was measured using a four-point probe. High resolution X-ray diffraction and Auger depth profiling were used for phase and chemical composition analysis, respectively. Transmission electron microscope and scanning probe microscope(SPM) were used to determine the cross-sectional structure and surface roughness. The silicide, which formed on single crystal silicon and 30 nm polysilicon substrate, could defer the transformation of $Ni_2Si $i and $NiSi_2 $, and was stable at temperatures up to $1,100^{\circ}C$ and $1,100^{\circ}C$, respectively. Regarding microstructure, the nano-size NiSi preferred phase was observed on single crystalline Si substrate, and agglomerate phase was shown on 30 nm-thick polycrystalline Si substrate, respectively. The silicide, formed on 70 nm polysilicon substrate, showed high resistance at temperatures >$700^{\circ}C$ caused by mixed microstructure. Through SPM analysis, we confirmed that the surface roughness increased abruptly on single crystal Si substrate while not changed on polycrystalline substrate. The Ru-inserted nickel monosilicide could maintain a low resistance in wide temperature range and is considered suitable for the nano-thick silicide process.

• 청정기술
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• 제28권2호
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• pp.154-162
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• 2022

알루미늄 (Al) 금속을 전구체 및 구조체로 이용, 수열 반응을 통하여 Al@Al₂O₃와 Al@Ni-Al LDH (LDH = layered double hydroxide) 코어-쉘 복합 구조체를 합성하였다. 제조된 구조체의 형상, 조성, 결정 구조는 수용액에 존재하는 이온들에 의하여 크게 영향을 받았으며, 이를 활용하여 다양한 특성의 촉매 구조체 유도가 가능하였다. Al@Ni-Al LDH 코어-쉘 구조체의 환원을 통하여 Ni 나노 입자가 고정화된 Ni/Al@Al₂O₃ 촉매를 제조하였고, CO₂ 메탄화 반응에 적용하여 촉매의 특성을 평가하였다. Ni/Al@Al₂O₃ 촉매는 전통적 incipient wetness impregnation 방법에 의하여 제조된 Ni/Al₂O₃ 촉매에 비교하여 Ni 입자의 분산도와 균일성이 매우 높았으며 약 2 배 이상의 CO₂ 전환율로 높은 촉매적 활성과 더불어 구조의 안정성을 보여 주었다. 이러한 Ni/Al@Al₂O₃ 구조체 촉매의 우수한 특성은 Al 금속을 기반으로 한 새로운 개념의 촉매 구조체 설계와 합성 방법의 타당성을 보여준다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.799-802
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• 2003

[ $LaNiO_3$ ](LNO) thin films were deposited on various substrates as Si and $Al_2O_3$ by sol-gel process using lanthanum nitrate and nickel acetate. The structure and orientation of the films were characterized by X-ray diffraction. The orientation factors of films on Si(100), Si(111), $SiO_2/Si(100)$ and $Al_2O_3$were 97%, 63%, 73%, and 24% respective. The conductivity was $7.6{\times}10^{-3}{\Omega}{\cdot}cm$ with 10 times coating at Si(100) substrate.

• 한국분무공학회지
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• 제17권3호
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• pp.128-133
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• 2012

The present study aims to examine the influence of flame spray distance on the thermal behavior of micro-metal particles and the morphological characteristics of $Ni_{20}Cr$ layers coated on the preheated SCM415 substrates by using the conventional flame spray system. Commercially available nickel-based $Ni_{20}Cr$ particles with a mean diameter of $45{\mu}m$ were used. In addition, CFD simulations using a commercial code (FLUENT ver. 6.3.26) were conducted to estimate temperature and velocity distributions of the continuous and discrete phases before impact on the substrate. From FE-SEM images of coated layers on the substrates, it was observed that as the spray distance decreased, the metal particle morphology showed splash-like patterns and such a short stretch shape, resulting from higher particle momentums and the impact of partially melted particles. Moreover, it was found that the spray distance should be considered as one of important parameters in controlling the porosity and the adhesion strength.

• 대한기계학회논문집A
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• 제25권6호
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• pp.959-964
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• 2001

An experimental investigation on the near-field electromagnetic loss of thin copper layers has been presented using microfabricated microwave transceivers for applications to multi-chip microsystems. Copper layers in the thickness range of 0.2$\mu$m∼200$\mu$m have been electroplated on the Pyrex glass substrates. Microwave transceivers have been fabricated using the 3.5mm$\times$3.5mm nickel microloop antennas, electroformed on the silicon substrates. Electromagnetic radiation loss of the copper layers placed between the microloop transceivers has been measured as 10dB∼40dB for the wave frequency range of 100MHz∼1GHz. The 0.2$\mu$m-thick copper layer provides a shield loss of 20dB at the frequencies higher than 300MHz, whereas showing a predominant decreases of shield loss to 10dB at lower frequencies. No substantial increase of the shield effectiveness has been found for the copper shield layers thicker that 2 $\mu$m.

• 한국전기전자재료학회논문지
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• 제19권7호
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• pp.631-635
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• 2006

The properties of metal interlayered DLC films between the Si substrate and the DLC films were studied. DC magnetron sputtering method has been used to deposit intermediate layers of metals. And RF-PECVD method has been employed to synthesize DLC onto substrates of the silicon and metal layers. After we used metal Inter-layers, such as chromium, nickel, titanium and we studied tribological properties of the DLC films. The thickness of films were observed by field emission scanning electron microscope (FE-SEM). Also the surface morphology of the films were observed by an atomic force microscope (AFM). The crystallographic properties of the films were analyzed with X-ray diffraction (XRD), the friction coefficients were investigated by AFM in friction force microscope (FFM) mode. Tribological performances of the films were estimated by nano-indenter, stress tester measurement.

• 전자공학회논문지D
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• 제35D권5호
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• pp.48-53
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• 1998

Poly-Si TFT's could be fabricated on glass substrates by metal induced lateral crystallization (MILC) method at 450.deg. C. Channel area of the poly-Si TFT's was laterally crystallized from source and drain areas, where a thn nickel film was deposited. Dopants activation for the formation of source and drain region could be achieved by thermal annealing at 450.deg. C after the ion mass doping of phosphorus. The field effect mobility of thus formed N-channel poly-Si TFT's was 76cm$^{2}$/Vs, and the on/off current ratio was higher than 7E6.

• 한국표면공학회지
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• 제32권2호
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• pp.172-181
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• 1999

The effect of the DMAB concentration, temperature, deposition time, and stabilizer concentration on the precipitation reaction of the electroless nickel plating using dimethylamine borane (DMAB) as reducing agent was investigated to by the weight gain and electrochemical method. The deposition rate was dependent with DMAB concentration. The polarization resistance of the precipitation reaction was reduced with DMAB concentration. The precipitation reaction rate of Ni-B deposits was controlled by the oxidation rate of DMAB as the source of electron. The boron content of the deposit was constant at about 5.5wt%, even when DMAB concentration in the solution was increased. The effect of temperature and stabilizer ($Pb(NO_3)_2$) concentration on deposition rate was shown to have co-dependent behaviors.

• Carbon letters
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• 제6권2호
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• pp.79-85
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• 2005

The work reported in this paper relates to preparation and characterization of carbon nanomaterials by CVD method on different substrates by decomposition of certain hydrocarbons at 550-$800^{\circ}C$ using a horizontal quartz tube reactor. Monometallic and bimetallic catalyst system of iron and nickel were used for the preparation of different carbon nanomaterials. The influence of various parameters such as substrate/catalyst preparation parameters, the nature of substrate, catalyst concentration, reaction time and temperature on the growth, yield and alignment of carbon nanotubes has been studied. The characterization of carbon nanomaterials has been carried out using SEM, TEM and TGA. The carbon nanomaterials developed were vertically aligned on a large area of flat quartz substrate.