• 대한금속재료학회지
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• 제49권11호
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• pp.905-909
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• 2011

The formation of front metal contact silicon solar cells is required for low cost, low contact resistance to silicon surfaces. One of the available front metal contacts is Ni/Cu plating, which can be mass produced via asimple and inexpensive process. A selective emitter, meanwhile, involves two different doping levels, with higher doping (${\leq}30{\Omega}/sq$) underneath the grid to achieve good ohmic contact and low doping between the grid in order to minimize the heavy doping effect in the emitter. This study describes the formation of a selective emitter and a nickel silicide seed layer for the front metallization of silicon cells. The contacts were thickened by a plated Ni/Cu two-step metallization process on front contacts. The experimental results showed that the Ni layer via SEM (Scanning Electron Microscopy) and EDX (Energy dispersive X-ray spectroscopy) analyses. Finally, a plated Ni/Cu contact solar cell displayed efficiency of 18.10% on a $2{\times}2cm^2$, Cz wafer.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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• pp.281-285
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• 2001

This technology Provides an economical Production of high value added goods applicable to electro chemicals by recycling of waste products in EGL(Electro Galvanizing Line). The waste products produced in EGL contain potassium chloride (KCI), nickel and zinc. Highly pure KCI and Zinc Chloride which are raw material of electro plating, can be produced by the development of the recycling process. The scope of this study ranges from laboratory experiments to pilot test in plant. We have developed the whole process of recycling technology such as purification method of waste products, fabrication methods of electro chemicals, basic design of plant, pilot scale production and evaluation of pilot goods, Developed electro chemicals were pure enough to satisfy the specification of steel company.

• 한국산학기술학회논문지
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• 제5권5호
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• pp.433-437
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• 2004

The MmSH is a process of injecting ABS to produce innovated physical properties compared to the conventional injection process. Physical properties such as thickness and adhesion strength of Ni plate electrolessly coated on a conventional and a MmSH injected ABS have been studied in the pH range 4~8. Thickness of the plate on the MmSH and the conventionally injected ABS appeared to be directly proportional to pH. The ABS processed by the conventional injection showed adhesion strength corresponded to ASTM 4B above pH 5. On the other hand, the ABS processed by the MmSH injection showed a superior adhesion strength corresponded to ASTM 5B above pH 6. It was calculated the shielding effectiveness of above 50 dB in all conditions.

• 한국표면공학회지
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• 제45권6호
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• pp.248-256
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• 2012

A Pd-based hydrogen membranes for hydrogen purification and separation need high hydrogen perm-selectivity. The surface roughness of the support is important to coat the pinholes free and thin-film membrane over it. Also, The pinholes drastically decreased the hydrogen perm-selectivity of the Pd-based composite membrane. In order to remove the pinholes, we introduced various surface pre-treatment such as alumina powder packing, nickel electro-plating and micro-polishing pre-treatment. Especially, the micro-polishing pretreatment was very effective in roughness leveling off the surface of the porous nickel support, and it almost completely plugged the pores. Fine Ni particles filled surface pinholes with could form open structure at the interface of Pd alloy coating and Ni support by their diffusion to the membrane and resintering. In this study, a $4{\mu}m$ surface pore-free Pd-Cu-Ni ternary alloy membrane on a porous nickel substrate was successfully prepared by micro-polishing, high temperature sputtering and Cu-reflow process. And $H_2$ permeation and $N_2$ leak tests showed that the Pd-Cu-Ni ternary alloy hydrogen membrane achieved both high permeability of $13.2ml{\cdot}cm^{-2}{\cdot}min^{-1}{\cdot}atm^{-1}$ permation flux and infinite selectivity.

• 한국표면공학회지
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• 제22권2호
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• pp.69-77
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• 1989

Codeposion of inert particles particles in a metallic mateix by electroless plating process involves two phenomena. Firstly, the adsorption of inercles and secondly, the adsorption of inert particles on the cathode. In the present paper the first adsorption phenomenon and in the next paper the second ane are studied in greaterdetail for the Ni-SiCc, Ni-Al2AO3 and Ni-WC systems. Measurements of the Zeta potentials for the SiC and Al2AO3 particles have been in different electrolyte solutions and the ionic species adsorbed on the Particles studied. The addition of sodium acetate, trisodium citrate and sodium phosphinate to nikel sulface sruomotes the zeta potential of SiC and Al2O3 particles, but zeta phosphinate to nickel is more positive than Al2O3 particles although the amount of nickel ion adsorbrd on the Al2O3 particles become greater than that of SiC particles. It is suggested that this is due to adsortion of Na ion onto the surface SiC particles.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.230-234
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• 2009

It is significant technique to increase competitiveness that solar cells have a high energy conversion efficiency and cost effectiveness. When making high efficiency crystalline Si solar cells, evaporated Ti/Pd/Ag contact system is widely used in order to reduce the electrical resistance of the contact fingers. However, the evaporation process is no applicable to mass production because high vacuum is needed. Furthermore, those metals are too expensive to be applied for terrestrial applications. Ni/Cu/Ag contact system of silicon solar cells offers a relatively inexpensive method of making electrical contact. Ni silicide formation is one of the indispensable techniques for Ni/Cu/Ag contact sytem. Ni was electroless plated on the front grid pattern, After Ni electroless plating, the cells were annealed by RTP(Rapid Thermal Process). Ni silicide(NiSi) has certain advantages over Ti silicide($TiSi_2$), lower temperature anneal, one step anneal, low resistivity, low silicon consumption, low film stress, absence of reaction between the annealing ambient. Ni/Cu/Ag metallization scheme is an important process in the direction of cost reduction for solar cells of high efficiency. In this article we shall report an investigation of rapid thermal silicidation of nickel on silngle crystalline silicon wafers in the annealing range of $350-390^{\circ}C$. The samples annealed at temperatures from 350 to $390^{\circ}C$ have been analyzed by SEM(Scanning Electron Microscopy).

• 한국전기전자재료학회논문지
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• 제17권12호
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• pp.1352-1355
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• 2004

We have applied front contact metallization of plated nickel and copper for high efficiency passivated emitter rear contact(PERC) solar cell. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. The plating technique is a preferred method for commercial solar cell fabrication because it is a room temperature process with high growth rates and good morphology. In this system, the electroless plated Ni is utilized as the contact to silicon and the plated Cu serves as the primary conductor layer instead of traditional solution that are based on Ti/Pd/Ag contact system. Experimental results are shown for over 20 % PERC cells with the Plated Ni/Cu contact system for good performance at low cost.

• 전기화학회지
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• 제10권2호
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• pp.88-93
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• 2007

Nano-sized Sn particles were coated with Ni-P layer using an electroless deposition method and their anodic performance was tested for lithium secondary batteries. Uniform coating layers were obtained, of which the thickness was controlled by varying the $Ni^{2+}$ concentration in the plating bath. It was found that the Ni-P layer plays two important roles in improving the anodic performance of Sn powder electrode. First, it prevents the inter-particle aggregation between Sn particles during the charge/discharge process. Second, it provides an electrical conduction pathway to the Sn particles, which allows an electrode fabrication without an addition of conductive carbon. A pseudo-optimized sample showed a good cyclability and high capacity ($>400mAh\;g^{-1}$) even without conductive carbon loading.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2004년도 춘계학술대회
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• pp.65-68
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• 2004

순간금형가열방법(MmSH injection process)과 일반적인 방법으로 사출된 ABS 위에 전자파를 차폐하기 위한 무전해 Ni 과 Ag도금을 하였다. 무전해 Ni의 경우, 알칼리성 도금욕일수록 도금속도가 증가하였고 순간금형가열방법으로 사출된 ABS가 일반적인 방법으로 사출된 ABS 보다 밀착력, 광택. 전자파 차폐효율이 다소 높은 값을 가졌으며 pH 8에서 5B의 밀착력, 509의 광택도와 76dB의 전자파 차폐효과를 나타냈다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 춘계학술발표회 논문집
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• pp.318-318
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• 2012

최근 고급스러운 표면을 가지는 제품의 수요가 증가함에 따라 pore를 통하여 rough한 표면을 구현하고 광택을 줄인 사틴 도금이 각광받고 있다. 사틴 효과를 구현하기 위하여 도금 용액에 첨가되는 첨가제의 종류 중 에멀젼 타입의 사틴 첨가제는 시간이 경과함에 따라 첨가제 입자들의 뭉침 현상이 발생하기 때문에 건욕 후 2시간이 경과하면 사틴 효과가 감소하게 되고 연속 공정이 불가능하다. 이에 본 연구에서는 크기가 증가한 첨가제 입자들만을 제거한 후 첨가제를 소량씩 재첨가하여 사틴 니켈의 연속 공정이 가능하도록 필터링 및 첨가제 보충이 가능한 필터링 시스템을 도입하였다. 필터링 시스템에 의하여 2시간 경과 후 발생되는 뭉쳐진 첨가제가 선택적으로 제거 되어 pore의 크기를 제어할 수 있었으며 제거된 첨가제는 재첨가로 인해 보충되어 pore의 크기와 개수도 유지 할 수 있었다.