• Journal of the Korean Solar Energy Society
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• v.33 no.3
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• pp.27-35
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• 2013

One of the most important factors that have a large influence on performance of the solar water heater system is performance of the solar collector, more detailedly, coating technology on the surface of the solar collector, which can provide high solar absorptance and low emittance. The core of the coating technology is to coat solar selective surfaces. In this study, various performance experiments are carried out using $Cr_2(SO_4)_3{\cdot}15H_2O$ coating technology. Here, IGBT(Insulated Gate Bipolar Transistor) of 5000A-15V was used as the surface processing rectifier which can stably output power and also can control voltage and current. The plating solution mainly contains black chrome$^{+3}$ concentration, H-y Conductivity, N-u Complex, NF Additive and NC-2 Wetter. Before applying the black chrome coating on the copper plate, optimal conditions are provided by using various preprocessing methods such as removal of fat, activation, electrolytic polishing, nickel strike, copper sulfate plating and bright neckel plating, and then the automatic continuous coating experiment are performed according to plating time and cathode current density. In the experiment, after the removal of fat, chemical polishing, nickel strike and activation processes as the preprocessing methods, the black chrome coating was performed in a plate solution temperature of $28^{\circ}C$ and a cathode current density of $18A/cm^2$ for 90 seconds. The thickness of chrome and nickel on the coated plate is $0.389{\mu}m$, $159{\mu}m$ respectively. As a result of the coating experiment, it showed the most excellent performance having a high solar absorptance of 98% and a low emittance of $5{\pm}1%$ when the black chrome surface had a thickness of $0.398{\mu}m$.

• Journal of the Korean institute of surface engineering
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• v.47 no.5
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• pp.269-274
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• 2014

Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at $70^{\circ}C$. The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.

• Journal of the Korean institute of surface engineering
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• v.11 no.3
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• pp.56-59
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• 1978

• Journal of the Korean Chemical Society
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• v.3 no.1
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• pp.9-17
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• 1954

• Proceedings of the Korean Nuclear Society Conference
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• 2002.05a
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• pp.204-204
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• 2002

• Applied Chemistry for Engineering
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• v.26 no.3
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• pp.270-274
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• 2015

We develop advanced oxidation processes for the treatment of spent electroless nickel plating solution. Apart form recovering nickel by leaching and enrichment, more emphasis is placed on rendering the waste water recyclable via oxidizing phosphite and hypophosphite into phosphate which can then be precipitated easily. $UV/H_2O_2$ process is employed and the conversion efficiency of COD and $PO_4-P$, and $H_2O_2$ consumption are analyzed. Furthermore, the $UV/H_2O_2/O_3$ process in conjunction with $O_3$ generator enables us to not only save the treatment time by 6 hours but also reduce $H_2O_2$ consumption by 30%.

• Journal of the Korean institute of surface engineering
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• v.4 no.1
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• pp.5-15
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• 1971

"Rapid Determination of Boric Acid in Nickel Plating Solution" by the addition of Na$_2$C$_2$O$_4$ and thus preventing the precipitation of i(OH)$_2$ during titiration , has previously been reported. In this paper, the exact amount of glycerine and the complexing possibility of oxalate with nickel has been determined by measn of conductivity titrations. This experimental work has been supported by the mathematical application of the Debye-Huckel and mass action equitions as well as statistical analysis. The results were ; (1) Fro determining boric acid in nickel plating solution, 20 ml of 400ml/ι glycerine was sufficient, since 97% of the H$_3$BO$_3$ was dissoicated by this addition. (2) In the absence of Na$_2$C$_2$O$_4$ the continious precipitation of Ni(OH)$_2$ during titration with NaOH even past end -point for boric acid determination resulted in considerable anlaytical error. (3) In the presence of Na$_2$C$_2$O$_4$ during titration , Ni++ combined with C$_2$O$_4$-to form NiC$_2$O$_4$. The solution with this precititate of very fine, colloidal , trantsparent particles, remained quite clear for approximately 2 hours. Therefore it was shown that the presence of Na$_2$C$_2$O$_4$ prevents the formation of gross Ni(OH)$_2$ precititation by forming NiC$_2$O$_4$ instead of a complex salt with Ni++ , which did not interfere with the visible determination of the end point for boric acid with NaOH titation. This observous may be interpreted in the light of the previously published solubility ratio for NiC$_2$O$_4$ and Ni(OH)$_2$, 0.3mg/100g H$_2$O(25$^{\circ}C$), respectively. Precipitation of the less soluble , albeit transparent salt, NiC$_2$O$_4$ precluded therefore the precipitation of the Ni(OH)$_2$ salt.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.192-193
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• Journal of Korean Society of Environmental Engineers
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• v.38 no.1
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• pp.1-7
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• 2016

In order to treat electrolysis nickel plating pickling wastewater to meet the effluent limit less than 3.0 mg/L, the electrolysis process by using soluble and insoluble electrode were studied. Electrolysis using soluble electrodes has a characteristic of easy elution from the electrode which the insoluble electrodes close not release metal from the electrode. For these reasons, there exist different characteristics in nickel removal efficiency, purity of nickel sludge. With this connection, the feasibility test were concluded to develop optimal conditions for the treatment of pickling wastewater electrolysis by using soluble electrodes, insoluble electrodes. Optimal condition of current density, pH were derived from the pickling wastewater using insoluble electrodes. It was concluded the highest removal efficiency of nickel at the operation condition of at pH 9, current density of $15mA/cm^2$. At these conditions, 95.3% purity of nickel sludge was achieved, iron content was 2.9%. Optimal condition when using soluble electrodes was derived current density of $10mA/cm^2$, pH 9. Purity of nickel sludge was 77.3%, iron content was 21.0%. 50.7% and 24.2% of operating cost can be saved by the use of soluble electrodes and the use of insoluble electrodes, respectively.

• Corrosion Science and Technology
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• v.8 no.1
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• pp.15-20
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• 2009

Surface of PEEK(poly-ether-ether-ketone) was modified by chemical etching, plasma treatment and mechanical grinding to improve the plating adhesion. The plating characteristics of these samples were studied by the contact angle, plating thickness, gloss and adhesion. Chemical etching and plasma treatment increased wettability, adhesion and gloss. The contact angle of as-received PEEK was $61^{\circ}$. The contact angles of chemical etched, plasma treated or both were improved to the range of $15{\sim}33^{\circ}$. In the case of electroless plating, the thickest layer without blister was $1.6{\mu}m$. The adhesion strengths by chemical etching, plasma treatment or both chemical etching and plasma treatment were $75kgf/cm^2$, $102kgf/cm^2$, $113kgf/cm^2$, respectively, comparing to the $24kgf/cm^2$ of as-received. In the case of mechanically ground PEEKs, the adhesion strengths were higher than those unground, with the sacrifice of surface gloss. The gloss of untreated PEEK were greater than mechanically ground PEEKs. Plating thickness increased linearly with the plating times.