• 한국태양에너지학회 논문집
• /
• 제33권3호
• /
• pp.27-35
• /
• 2013

One of the most important factors that have a large influence on performance of the solar water heater system is performance of the solar collector, more detailedly, coating technology on the surface of the solar collector, which can provide high solar absorptance and low emittance. The core of the coating technology is to coat solar selective surfaces. In this study, various performance experiments are carried out using $Cr_2(SO_4)_3{\cdot}15H_2O$ coating technology. Here, IGBT(Insulated Gate Bipolar Transistor) of 5000A-15V was used as the surface processing rectifier which can stably output power and also can control voltage and current. The plating solution mainly contains black chrome$^{+3}$ concentration, H-y Conductivity, N-u Complex, NF Additive and NC-2 Wetter. Before applying the black chrome coating on the copper plate, optimal conditions are provided by using various preprocessing methods such as removal of fat, activation, electrolytic polishing, nickel strike, copper sulfate plating and bright neckel plating, and then the automatic continuous coating experiment are performed according to plating time and cathode current density. In the experiment, after the removal of fat, chemical polishing, nickel strike and activation processes as the preprocessing methods, the black chrome coating was performed in a plate solution temperature of $28^{\circ}C$ and a cathode current density of $18A/cm^2$ for 90 seconds. The thickness of chrome and nickel on the coated plate is $0.389{\mu}m$, $159{\mu}m$ respectively. As a result of the coating experiment, it showed the most excellent performance having a high solar absorptance of 98% and a low emittance of $5{\pm}1%$ when the black chrome surface had a thickness of $0.398{\mu}m$.

• 한국표면공학회지
• /
• 제47권5호
• /
• pp.269-274
• /
• 2014

Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at $70^{\circ}C$. The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.

• 한국표면공학회지
• /
• 제11권3호
• /
• pp.56-59
• /
• 1978

• 대한화학회지
• /
• 제3권1호
• /
• pp.9-17
• /
• 1954

• 한국원자력학회:학술대회논문집
• /
• 한국원자력학회 2002년도 춘계공동학술발표회요약집
• /
• pp.204-204
• /
• 2002

• 공업화학
• /
• 제26권3호
• /
• pp.270-274
• /
• 2015

본 연구에서는 고농도 무전해 니켈도금 폐액을 처리하기 위한 고도산화공정 기술을 개발하였다. 추출, 농축 공정을 이용한 니켈 금속 회수보다는 폐수를 방류수 수준으로 처리할 수 있는 기술 개발을 위하여 차아인산염과 아인산염을 침전이 용이한 인산염으로 효과적으로 전환시킬 수 있는 공정 개발에 초점을 맞추었다. 광화학적 방법인 $UV/H_2O_2$ 방식을 채택하여 COD, $PO_4-P$ 변화 효율 및 과산화수소의 소모량을 분석함으로써 고농도 무전해 니켈도금 폐액의 고도산화처리 특성을 평가하였다. 특히, $UV/H_2O_2/O_3$ 방식으로 오존산화법을 추가함으로써 과산화수소 사용량을 30% 가량 절감하고 처리시간을 약 6 h 단축시킬 수 있었다.

• 한국표면공학회지
• /
• 제4권1호
• /
• pp.5-15
• /
• 1971

"Rapid Determination of Boric Acid in Nickel Plating Solution" by the addition of Na$_2$C$_2$O$_4$ and thus preventing the precipitation of i(OH)$_2$ during titiration , has previously been reported. In this paper, the exact amount of glycerine and the complexing possibility of oxalate with nickel has been determined by measn of conductivity titrations. This experimental work has been supported by the mathematical application of the Debye-Huckel and mass action equitions as well as statistical analysis. The results were ; (1) Fro determining boric acid in nickel plating solution, 20 ml of 400ml/ι glycerine was sufficient, since 97% of the H$_3$BO$_3$ was dissoicated by this addition. (2) In the absence of Na$_2$C$_2$O$_4$ the continious precipitation of Ni(OH)$_2$ during titration with NaOH even past end -point for boric acid determination resulted in considerable anlaytical error. (3) In the presence of Na$_2$C$_2$O$_4$ during titration , Ni++ combined with C$_2$O$_4$-to form NiC$_2$O$_4$. The solution with this precititate of very fine, colloidal , trantsparent particles, remained quite clear for approximately 2 hours. Therefore it was shown that the presence of Na$_2$C$_2$O$_4$ prevents the formation of gross Ni(OH)$_2$ precititation by forming NiC$_2$O$_4$ instead of a complex salt with Ni++ , which did not interfere with the visible determination of the end point for boric acid with NaOH titation. This observous may be interpreted in the light of the previously published solubility ratio for NiC$_2$O$_4$ and Ni(OH)$_2$, 0.3mg/100g H$_2$O(25$^{\circ}C$), respectively. Precipitation of the less soluble , albeit transparent salt, NiC$_2$O$_4$ precluded therefore the precipitation of the Ni(OH)$_2$ salt.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.192-193
• /
• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electro less plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. In this paper, we investigated low-cost Ni/Cu contact formation by electro less and electroplating for crystalline silicon solar cells.

• 대한환경공학회지
• /
• 제38권1호
• /
• pp.1-7
• /
• 2016

무전해 니켈 도금 산세 폐액을 강화된 니켈의 배출허용기준 3.0 mg/L 이하로 처리하기 위해서는 기존 처리방법의 단점을 보완한 처리방법의 개발이 필요하다. 용성전극 및 불용성전극을 이용한 전기분해 처리방법은 공통적으로 무전해 니켈 도금 산세 폐액을 효과적으로 처리할 수 있다. 그러나 용성전극은 전극으로부터 금속이 잘 용출되는 특징을 갖는 반면 불용성전극은 금속이 용출되지 않는 차이점을 갖고 있어 니켈 제거 효율 및 니켈 슬러지 순도에서 서로 다른 장단점이 존재한다. 이에 본 연구에서는 용성전극 및 불용성전극을 이용한 전기분해 방법으로 무전해 니켈 도금 산세 폐액을 처리하기 위한 최적조건을 도출하고, 두 전극을 이용한 방법의 장단점을 조사하였다. 실험결과 불용성전극을 사용하였을 때 처리수의 효율적인 니켈 제거를 위한 최적조건은 전류밀도 $15mA/cm^2$ 이상, pH 9 이상으로 도출되었고 이 조건에서 니켈 슬러지의 순도는 95.3%로 나타났으며, 슬러지 내 철 함량은 2.9%로 조사되었다. 용성전극을 사용하였을 때의 최적 조건은 전류밀도 $10mA/cm^2$ 이상, pH 9 이상으로 도출되었으며 최적조건에서 니켈 슬러지 순도는 77.3%, 슬러지 내 철 함량은 21.0%로 조사되었다. 처리비용을 기존의 처리비용과 비교하여 용성전극 사용시 50.7%, 불용성전극 사용시 24.2% 저감시킬 수 있는 것으로 조사되었다.

• Corrosion Science and Technology
• /
• 제8권1호
• /
• pp.15-20
• /
• 2009

Surface of PEEK(poly-ether-ether-ketone) was modified by chemical etching, plasma treatment and mechanical grinding to improve the plating adhesion. The plating characteristics of these samples were studied by the contact angle, plating thickness, gloss and adhesion. Chemical etching and plasma treatment increased wettability, adhesion and gloss. The contact angle of as-received PEEK was $61^{\circ}$. The contact angles of chemical etched, plasma treated or both were improved to the range of $15{\sim}33^{\circ}$. In the case of electroless plating, the thickest layer without blister was $1.6{\mu}m$. The adhesion strengths by chemical etching, plasma treatment or both chemical etching and plasma treatment were $75kgf/cm^2$, $102kgf/cm^2$, $113kgf/cm^2$, respectively, comparing to the $24kgf/cm^2$ of as-received. In the case of mechanically ground PEEKs, the adhesion strengths were higher than those unground, with the sacrifice of surface gloss. The gloss of untreated PEEK were greater than mechanically ground PEEKs. Plating thickness increased linearly with the plating times.