• Journal of Fisheries and Marine Sciences Education
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• v.19 no.1
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• pp.129-136
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• 2007

The component parts of the shell plate of a ship are steel. but the screw propeller or the bow thruster is a compound of bronze, nickel and aluminum. On account of the these different components between metals of the shell plate, the screw propeller and the bow thruster, which are underwater, the shell plate of a ship is corroded by the action of ionization. Authors investigated the corrosion loss of the zinc anodes which were attached to the bottom shell of the training ship Kaya for about two years. The obtained results were as follows:1. In case of the shell plate the difference of the corrosion loss according to port and starboard was almost nothing. But the corrosion loss of the forward part was more than that of the aftward part.2. There was little difference in the corrosion loss between the forward and the aftward part on the bilge keel.3. The corrosion loss of the fore, midship and aft part on the false keel were 24.7%, 22.4% and 23.9% respectively.4. The corrosion loss of the fore and the aft part on the false keel was more than that of the midship part.5. The corrosion loss of the bow thruster was greater than any other parts.6. The nearer the zinc anode to the screw propeller the more the corrosion loss on the stern frame, and the situation was also same as on the rudder.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

• Bulletin of the Korean Chemical Society
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• v.34 no.9
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• pp.2597-2603
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• 2013

The reactions of hydrated $CdCl_2$, $MnCl_2$, and $NiCl_2$ with 2,2'-bipyidine-3,3',6,6'-tetracarboxylic acid ($H_4bptc$) afforded the mononuclear [$Cd^{II}(H_2bptc)(H_2O)_3]{\cdot}H_2O$ (1), linear $\{[Cd(H_2bptc)(H_2O)]{\cdot}3H_2O\}_n$ (2), 3-D heterobimetallic $[NaCd(Hbptc)(H_2O)]$ (3), layer $[Mn(H_2bptc)(H_2O)]_n$ (4) and a dinuclear compound $[Ni_2(H_2bptc)-(H_2O)_2]{\cdot}6H_2O$ (5). These compounds have been characterized by elemental analysis, IR, and their structures have been determined by X-ray crystallography. The thermal stabilities of 1-3 were measured by thermogravimetric analysis (TGA) and their solid state luminescence properties together with the free ligand $H_4bptc$ were investigated at room temperature.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.247-250
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• 2008

Biomass gasification is a promising technology for producing a fuel gas which is useful for power generation systems. In biomass gasification processes, tar formation often causes some problems such as pipeline plugging. Thus, proper tar treatment is necessary. So far, nickel (Ni)-based catalysts have been intensively studied for the catalytic tar removal. However, the deactivation of Ni-based catalysts takes place because of coke deposition and sintering of Ni metal particles. To overcome these problems, we have been using ruthenium (Ru)-based catalyst for tar removal. It is reported by Okada et al., that a Ru/$Al_2O_3$ catalyst is very effective for preventing the carbon deposition during the steam reforming of hydrocarbons. Also, this catalyst is more active than the Ni-based catalyst at a low steam to carbon ratio (S/C). Benzene was used for the tar model compound because it is the main constituent of biomass tar and also because it represents a stable aromatic structure apparent in tar formed in biomass gasification processes. The steam reforming process transforms hydrocarbons into gaseous mixtures constituted of carbon dioxide ($CO_2$), carbon monoxide (CO), methane ($CH_4$) and hydrogen ($H_2$).

• Nuclear Engineering and Technology
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• v.52 no.3
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• pp.647-653
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• 2020

Stainless steel is used commonly in nuclear applications for shielding radiation, so in this study, three different types of new stainless steel samples were designed and developed. New stainless steel compound ratios were determined by using Monte Carlo Simulation program Geant 4 code. In the sample production, iron (Fe), nickel (Ni), chromium (Cr), silicium (Si), sulphur (S), carbon (C), molybdenum (Mo), manganese (Mn), wolfram (W), rhenium (Re), titanium (Ti) and vanadium (V), powder materials were used with powder metallurgy method. Total macroscopic cross sections, mean free path and transmission number were calculated for the fast neutron radiation shielding by using (Geant 4) code. In addition to neutron shielding, the gamma absorption parameters such as mass attenuation coefficients (MACs) and half value layer (HVL) were calculated using Win-XCOM software. Sulfuric acid abrasion and compressive strength tests were carried out and all samples showed good resistance to acid wear and pressure force. The neutron equivalent dose was measured using an average 4.5 MeV energy fast neutron source. Results were compared to 316LN type stainless steel, which commonly used in shielding radiation. New stainless steel samples were found to absorb neutron better than 316LN stainless steel at both low and high temperatures.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• Corrosion Science and Technology
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• v.9 no.2
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• pp.98-103
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• 2010

In order to further reduce the cost without reducing the corrosion resistance, a high-manganese austenitic alloy for sink roll or stabilizer roll in continuous hot-dip coating lines was developed. A systematic study of corrosion behavior of the high-manganese austenitic alloy in pure zinc bath at $490^{\circ}C$ was carried out. The results shows that, the high-manganese austenitic alloy shows better corrosion resistance than 316L steel. The corrosion rate of the high-manganese austenitic alloy in pure zinc bath is calculated to be approximately $6.42{\times}10^{-4}g{\cdot}cm^{-2}{\cdot}h^{-1}$, while the 316L is $1.54{\times}10^{-3}g{\cdot}cm^{-2}{\cdot}h^{-1}$. The high-manganese austenitic alloy forms a three-phase intermetallic compound layer morphology containing ${\Gamma$}, ${\delta}$ and ${\zeta}$ phases, while the 316L is almost ${\zeta}$ phase. The ${\Gamma}$ and ${\delta}$ phases of the high-manganese austenitic alloy contain about 8.5 wt% Cr, the existence of Cr improve the stabilization of phases, which slow down the reaction of Fe and Zn, improve the corrosion resistance of the high-manganese austenitic alloy. So substitute the nickel with the manganese to manufacture the high-manganese austenitic alloy of low cost is feasible.

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.615-621
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• 1999

The new process in order to fabricate of Ni catalyst with high activity by the mechanochemical(MC) method which was combined the mechanical alloying(MA) and the chemical treatment process. The microstructure and characterization of mechanically alloyed Ni-5-wt% Al powder and Ni catalyst gained by alkali leaching were investigated byt he various analysis such as XRD, SEM-EDS, HRTEM and laser particle analyzer. The steady state powder with 1~2$\mu\textrm{m}$ mean particle size was obtained after 30hr milling with the PCA of 2 wt% stearic acid under the condition of grinding stainless steel ball to powder ratio of 60:1 and rotating speed fo 300rpm. According to result of HRTEM diffraction pattern, MA powder of the steady state was nanocrystalline $Al_3$$Ni_2$ intermetallic compound. Ni catalyst was obtained after KOH leaching of the steady state powder was about 20nm nanocrystalline which contained about 8 wt % Al.

• Journal of the Korean Applied Science and Technology
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• v.27 no.3
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• pp.361-369
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• 2010

A study on the corrosion inhibition of metals is important in many industrial applications (carbon steel, copper, aluminum, SUS 304, nickel). In this study, we investigated the C-V diagrams related to the surface corrosion of metals. It was observed through the SEM that the surface corrosion state of the various metals had the corrosion potential by the scan rate and the organic inhibitor containing an amine group. We determined to measure cyclic voltammetry using the three-electrode system. The measurement of oxidation and reduction ranged from -1350mV to 1650mV. The scan rate was 50, 100, 150, and 200mV/s. It turned out that the C-V characterization of SUS 304 was irreversible process caused by the oxidation current from the cyclic voltammogram. After adding organic inhibitors, the adsorption film was constituted, and the passive phenomena happened. As a result, it was revealed that the inhibition effect of metal corrosion depends on the molecular interaction, and the interaction has influence on the adsorption complex.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.