• 제목/요약/키워드: ni-p electroplating

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Effect of Electroplating Parameters on Conductivity and Hardness of Ni-P Alloy (Ni-P 합금의 전기전도도와 경도에 대한 도금 조건의 영향)

  • Kim, Nam-Gil;Sun, Yong-Bin
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.3
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    • pp.77-81
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    • 2017
  • Pulse electroplating of Ni-P alloy was studied to fulfill the material requirement to the advanced vertical probe tip in wafer probe card. The major concerns are for the electrical conductivity and yield strength. Plating parameters such as current density, duty cycle and solution components were examined to obtain the nanocrystal structure and proper percentage of phosphorus, leading to how to control the nanocrystal grain growth and precipitation of $Ni_3P$ after heat treatment. Among the parameters, the amount of phosphorus acid was the main factor affecting on the grain size and sheet resistance, and the amount of 0.1 gram was appropriate. Since hardness in Ni-P alloy is increased by as-plated nanocrystal structure plus precipitation of $Ni_3P$, the concentration of P less than 15 at% was better choice for the grain coarsening without minus in hardness value. The following heat treatment made grain growth and dispersion of precipitates adjustable to meet the target limit of resistance of $100m{\Omega}$ and hardness number of over 1000Hv. The Ni-P alloy will be a candidate for the substitute of the conventional probe tip material.

Study on Oxygen Evolution Reaction of Ni-Zn-Fe Electrode for Alkaline Water Electrolysis (알칼라인 수전해용 Ni-Zn-Fe 전극의 산소 발생 반응 특성)

  • LEE, TAEKYUNG;KIM, JONGWON;BAE, KIKWANG;PARK, CHUSIK;KANG, KYOUNGSOO;KIM, YOUNGHO;JEONG, SEONGUK
    • Transactions of the Korean hydrogen and new energy society
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    • v.29 no.6
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    • pp.549-558
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    • 2018
  • The overall efficiency depend on the overpotential of the oxygen evolution reaction in alkaline water electrolysis. Therefore, it is necessary to research to reduce the oxygen evolution overpotential of electrodes. In this study, Ni-Zn-Fe electrodes were prepared by electroplating and the surface area was increased by Zn leaching process. Electroplating variables were studied to optimize the plating parameters(electroplating current density, pH value of electroplating solution, Ni/Fe content ratio). Ni-Zn-Fe electrode, which is electroplated in a modified Watts bath, showed 0.294 V of overpotential at $0.1A/cm^2$. That result is better than that of Ni and Ni-Zn plated electrodes. As the electroplating current density of the Ni-Zn-Fe electrode increased, the particle size tended to increase and the overpotential of oxygen evolution reaction decreased. As reducing pH of electroplating solution from 4 to 2, Fe content in electrode and activity of oxygen evolution reaction decreased.

Effects of Electroplating Current Density and Duty Cycle on Nanocrystal Size and Film Hardness

  • Sun, Yong-Bin
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.1
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    • pp.67-71
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    • 2015
  • Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

Study on Thermal Stability of Ni-P-Fe and Ni-P-B Layers Electroplated on Alloy 600 (Alloy 600에 전기 도금한 Ni-P-Fe 및 Ni-P-B 층의 열적 안정성 연구)

  • Kim, Myong-Jin;Kim, Joung-Soo;Kim, Dong-Jin;Kim, Hong-Pyo
    • Journal of the Korean institute of surface engineering
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    • v.43 no.2
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    • pp.57-63
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    • 2010
  • In this study, thermal stability of the mechanical properties of Ni-P-B and Ni-P-Fe layers electroplated on Alloy 600 material was evaluated by measuring their microhardness, tensile strength, and elongation after heat treatment at $325^{\circ}C$ and $400^{\circ}C$. According to the results, there was no noticeable change in microhardness of the two electrodeposits before and after heat treatment at the temperatures for 30 days. In the case of a Ni-P-B electrodeposit, ultimate tensile strength (UTS) slightly increases with heat treatment time, while its elongation decreases, showing good thermal stability in the mechanical properties at high temperature. On the other hand, UTS and elongation of Ni-P-Fe decrease with heat treatment time, which is very unusual observation. This result was attributed to the bad microstructure of Ni-P-Fe having many defects in the deposit formed early stage of an electroplating process and their redistribution to link to become large ones during heat treatment.

Thermal Cycle Reliabilties and Cracking Characteristics of Electroplated Cr/Ni-P Coatings (전해 Cr/Ni-P 도금막의 열 사이클 신뢰성 및 균열거동 분석)

  • Lee, Jina;Son, Kirak;Lee, Kyu Hwan;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.133-140
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    • 2019
  • The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.

Mechanical Properties and Microstructure of Nano Grain Nickel Alloy Deposit

  • Seo, Moo Hong;Kim, Jung Su;Kim, Seung Ho;Wyi, Jung Il;Hwang, Woon Suk;Jang, Si Sung;Jung, Hyun Kyu;Chun, Byung Sun
    • Corrosion Science and Technology
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    • v.2 no.4
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    • pp.197-201
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    • 2003
  • In this study, Ni-P layers were electroplated on the surface of stainless steel in order to investigate the effects of an additive and agitation on their mechanical properties and microstructure. The concentration of the additive in the plating solution increased, the pores formed in the layer decreased, while the residual stress developed in the layers during electroplating increased. Agitation of the solution during electroplating was observed to force to increase local pores in the layer, which lowers its tensile properties. Grain growth was suppressed due to very fine $Ni_3P$ precipitates formed at its grain boundaries during heat treatment at $343^{\circ}C$ for 1 hr in air.

Ni-Co Alloy Electroforming for Micro Mold Fabrication (마이크로 금형 제작을 위한 니켈-코발트 합금 전주기술개발)

  • Shin S. H.;Jeong M. K.;Kim Y. S.;Han S. H.;Hur Y. M.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.10a
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    • pp.276-279
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    • 2004
  • The factors affecting Ni-Co alloy electroforming were investigated to determine the optimum bath composition and electroplating parameters, like pH, temperature, and current density, suitable for high speed fabrication of a micro mold with longer lifetime. To obtain alloy deposits having uniform thickness and composition, electroplating parameters were finely tuned with home-made electroforming apparatus. Ni-Co alloy deposits had linearly increased Co with $Co^{2+}$ ion concentration in electroplating bath, and showing $412H_v$ of Victors hardness at $23wt\%$ of Co content. For Ni-Co alloy, sulfonate and diol related organic additives were very effective to alleviate its residual stress and surface roughness. The maximum deposition rate was $106{\mu}m/hr$ at 10ASD and the tensile strength of alloy deposit was 2 times larger than that of Ni only case.

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Fabrication of Tip of Probe Card Using MEMS Technology (MEMS 기술을 이용한 프로브 카드의 탐침 제작)

  • Lee, Keun-Woo;Kim, Chang-Kyo
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.4
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    • pp.361-364
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    • 2008
  • Tips of probe card were fabricated using MEMS technology. P-type silicon wafer with $SiO_2$ layer was used as a substrate for fabricating the probe card. Ni-Cr and Au used as seed layer for electroplating Ni were deposited on the silicon wafer. Line patterns for probing devices were formed on silicon wafer by electroplating Ni through mold which formed by MEMS technology. Bridge structure was formed by wet-etching the silicon substrate. AZ-1512 photoresist was used for protection layer of back side and DNB-H100PL-40 photoresist was used for patterning of the front side. The mold with the thickness of $60{\mu}m$ was also formed using THB-120N photoresist and probe tip with thickness of $50{\mu}m$ was fabricated by electroplating process.

A nuclear battery based on silicon p-i-n structures with electroplating 63Ni layer

  • Krasnov, Andrey;Legotin, Sergey;Kuzmina, Ksenia;Ershova, Nadezhda;Rogozev, Boris
    • Nuclear Engineering and Technology
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    • v.51 no.8
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    • pp.1978-1982
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    • 2019
  • The paper presents the electrical performance measurements of a prototype nuclear battery and two types of betavoltaic cells. The electrical performance was assessed by measuring current-voltage properties (I-V) and determining the short-circuit current and the open-circuit voltage. With 63Ni as an irradiation source, the open-circuit voltage and the short-circuit current were determined as 1 V and 64 nA, respectively. The prototype consisted of 10 betavoltaic cells that were prepared using radioactive 63Ni. Electroplating of the radioactive 63Ni on an ohmic contact (Ti-Ni) was carried out at a current density of 20 mA/㎠. Two types of betavoltaic cells were studied: with an external 63Ni source and a 63Ni-covered source. Under irradiation of the 63Ni source with an activity of 10 mCi, the open-circuit voltage Voc of the fabricated cells reached 151 mV and 109 mV; the short-circuit current density Jsc was measured to be 72.9 nA/cm2 and 64.6 nA/㎠, respectively. The betavoltaic cells had the fill factor of 55% and 50%, respectively.