• 동력기계공학회지
• /
• 제14권2호
• /
• pp.34-39
• /
• 2010

Recently, technical trend for machine tools is focused on enhancement of speed and accuracy. High speedy processing causes thermal and structural deformation of objects from the machine tools. Water cooler has to be applied to machine tools to reduce the thermal negative influence with accurate temperature controlling system. Existing On-Off control type can't control temperature accurately because compressor is operated and stopped repeatedly and causes increment of power consumption and decrement of the expected life of compressor. The goal of this study is to minimize temperature error in steady state. In addition, control period of an electronic expansion valve were considered to increment of lifetime of the machine tools and quality of product with a water cooler. PI controller is designed using type of hot-gas bypass for precise control of temperature. Gain of PI is decided easily by method of critical oscillation response, excellent performance of control is shown with 4.24% overshoot and ${\pm}0.2^{\circ}C$error of steady state. Also, error range of temperature is controlled within $0.2^{\circ}C$although disturbance occurs.

• 한국구조물진단유지관리공학회 논문집
• /
• 제26권1호
• /
• pp.58-66
• /
• 2022

이 연구에서는 FRP 보강근과 콘크리트의 횡방향 열팽창 거동이 콘크리트 피복두께에 미치는 영향을 살펴보기 위해 온도 20℃를 기준으로 -70℃~80℃까지 변화시켜가며, 콘크리트의 거동을 해석적으로 검토하였다. 이를 위해 서로 다른 FRP 보강근의 지름과 피복 두께를 가지는 FRP 보강근 콘크리트를 대상으로 이론적 탄성해석과 비선형 유한요소해석을 수행하였다. 그 결과, 음의 온도차이에서는 콘크리트가 압축을 받아 이론적 변형율 결과와 유한요소결과가 유사하였지만, 양의 온도차이에서는 콘크리트에 인장응력이 발생하고 더 나아가 균열이 발생하여 이론적 결과보다 1.2~1.4 배 큰 변형률을 나타내었다. 또한 FRP 보강근의 지름과 콘크리트의 피복두께 비(c/db)가 균열의 발생과 밀접한 연관이 있으며, 보강근의 지름에 비하여 피복두께가 부족할 경우 균열이 발생하여 구조물의 사용성이 저하되었다. FRP 보강근의 횡방향 열팽창계수는 콘크리트보다 3배 이상 크기 때문에, 설계 시 이에 대한 고려가 필요하다고 판단되었다.

• The Korean Journal of Ceramics
• /
• 제6권2호
• /
• pp.168-171
• /
• 2000

VO$_2$ceramics exhibiting a negative temperature coefficient (NTC) of resistivity have been widely used as temperature dependence resistors. The NTC effect similar to $VO_2$ceramics was observed when a low-thermal-expansion ceramic matrix was loaded near the percolation threshold with conductive metal particles. The resistivity in a composite made from silica glass and 20 vol% Ag filler suddenly decreased from $10^{-7}$ to $10^3\;\Omega$cm at about $300^{\circ}C$.

• 한국초전도저온공학회:학술대회논문집
• /
• 한국초전도저온공학회 2000년도 KIASC Conference 2000 / 2000년도 학술대회 논문집
• /
• pp.43-47
• /
• 2000

Two modes of shock waves, a compression shock wave and a thermal shock wave, propagating in He II have been investigated. The shock waves are at a time generated by the impingement of a gasdynamic shock wave onto a He II free surface in the newly developed superfluid shock tube facility. Superconductive temperature sensors, piezo-type pressure transducers and visualization photograph were used for the measurement of them and the phenomena induced by them were investigated in detail. It is found that the compression by a compression shock wave in He II causes temperature drop because He II has negative thermal expansion coefficient. the thermal shock wave is found to be of a single triangular waveform with a limited shock strength. The waveform is similar to that generated by stepwise strong heating from an electrical heater for relatively long heating time. In the experiments at the temperatures near the lambda temperature, no thermal shock wave is sometimes detected in shock compressed He II. It can be understood that shock compression makes He Ii convert to He I in which no thermal shock wave is excited.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.138-141
• /
• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2009년도 춘계학술발표대회
• /
• pp.3.1-3.1
• /
• 2009

Normal sintering process of producing porous ceramics is not to sinter perfectly, i.e., stop sintering in middle-process. Our porous ceramic materials are a product of complete sintering. For example if one want to make a porous carborundum, raw carborundum powder is sintered at either lower temperatures than normal sintering temperature or shorter sintering periods than normal sintering time to obtain incompletely sintered materials, i.e., porous carborundum. This implies normally sintered porous ceramic materials can mot be used in high vacuum conditions due to dust coming out from uncompleted sintering. We could produce completely sintered porous ceramic materials. For example, we can produce porous carborundum material by using carborundum particles bonded by glassy material. The properties of this material are similar to carborundum. We could make quasi-zero thermal expansion porous material by using carborundum and particles of negative thermal expansion materials bonded by the glassy material. We apply to sinter them also by microwave to sinter quickly. We also use HIP process to introduce closed pores. We could sinter them in large size to produce $2.5m{\times}2.5m$ ceramic plate to use as a precision plate for flat display industries. This flat ceramic plate is the world largest artificial ceramic plate. Precision plates are basic importance to any advanced electronic industries. The produced precision plate has lower density, lower thermal expansivity, higher or similar damping properties added extra properties such as vacuum vise, air sliding capacity. These plates are highly recommended to use in flat display industries. We could produce also cylindrical porous ceramics materials, which can applied to precision roller for polymer film precision motion for also electronic industries.

• Earthquakes and Structures
• /
• 제9권2호
• /
• pp.415-430
• /
• 2015

Integral abutment bridges have many advantages over bridges with expansion joints in terms of economy and maintenance costs. However, in the design of abutments of integral bridges temperature loads play a crucial role. In addition, seismic loads are readily transferred to the substructure and affect the design of these components significantly. Currently, the European and American bridge design codes consider these two load cases separately in their recommended design load combinations. In this paper, the importance and necessity of combining the thermal and seismic loads is investigated for integral bridges. A 2D finite element combined pile-soil-structure interactive model is used in this evaluation. Nonlinear behavior is assumed for near field soil behind the abutments. The soil around the piles is modeled by nonlinear springs based on p-y curves. The uniform temperature changes occurring at the time of some significant earthquakes around the world are gathered and applied simultaneously with the corresponding earthquake time history ground motions. By comparing the results of these analyses to prescribed AASHTO LRFD load combinations it is observed that pile forces and abutment stresses are affected by this new load combination. This effect is more severe for contraction mode which is caused by negative uniform temperature changes.

• Corrosion Science and Technology
• /
• 제23권2호
• /
• pp.145-153
• /
• 2024

In the automotive industry, the hole expanding test is widely used to assess the formability of punched holes in sheets. This test provides a good representation of formability within the framework defined by the ISO 16630 standard. During hole expanding tests on galvanized high strength steels, a negative effect was observed when there was a delay between hole punching and expansion, as compared to performing both operations directly. This effect is believed to be caused by hydrogen aging, which occurs when hydrogen diffuses towards highly-work hardened edges. Therefore, the aim of this study is to demonstrate the migration of hydrogen towards work-hardened edges in high strength Zn-coated steel sheets using a novel Thermal Desorption Analyzer (TDA) designed for small samples. This newly-developed TDA setup allows for the quantification of local diffusible hydrogen near cut edges. With its induction heating and ability to analyze Zn-coated samples while reducing artifacts, this setup offers flexible heat cycles. Through this method, a hydrogen gradient is observed over short distances in shear-cut galvanized steel sheets after a certain period of time following punching.

• 한국안전학회지
• /
• 제36권5호
• /
• pp.1-9
• /
• 2021

With the convergence of the information and communication technologies, a new age of technological civilization has arrived. This is the age of intelligent revolution, known as the 4th industrial revolution. The 4th industrial revolution is based on technological innovations, such as robots, big data analysis, artificial intelligence, and unmanned transportation facilities. This revolution would interconnect all the people, things, and economy, and hence will lead to the expansion of the industry. A high-density, high-capacity energy technology is required to maintain this interconnection. As a next-generation energy source, lithium-ion batteries are in the spotlight today. However, lithium-ion batteries can cause thermal runaway and fire because of electrical, thermal, and mechanical abuse. In this study, thermal runaway was induced in 72.5 Ah NCM pouch-type lithium-ion batteries because of thermal abuse. The surface of the pouch-type lithium-ion batteries was heated by the hot plate heating method, and the effect of the rate of increase in the surface temperature on the thermal runaway trigger time was analyzed using Minitab 19, a statistical analysis program. The correlation analysis results confirmed that there existed a strong negative relationship between each variable, while the regression analysis demonstrated that the thermal runaway trigger time of lithium-ion batteries can be predicted from the rate of increase in their surface temperature.

• Advances in nano research
• /
• 제7권5호
• /
• pp.293-310
• /
• 2019

In this paper, thermal-buckling behavior of the functionally graded (FG) nanocomposite plates reinforced with graphene oxide powder (GOP) is studied under three types of thermal loading once the plate is supposed to be rested on a two-parameter elastic foundation. The effective material properties of the nanocomposite plate are considered to be graded continuously through the thickness according to the Halpin-Tsai micromechanical scheme. Four types of GOPs' distribution namely uniform (U), X, V and O, are considered in a comparative way in order to find out the most efficient model of GOPs' distribution for the purpose of improving the stability limit of the structure. The governing equations of the plate have been derived based on a refined higher-order shear deformation plate theory incorporated with Hamilton's principle and solved analytically via Navier's solution for a simply supported GOP reinforced (GOPR) nanocomposite plate. Some new results are obtained by applying different thermal loadings to the plate according to the GOPs' negative coefficient of thermal expansion and considering both Winkler-type and Pasternak-type foundation models. Besides, detailed parametric studies have been carried out to reveal the influences of the different types of thermal loading, weight fraction of GOP, aspect and length-to-thickness ratios, distribution type, elastic foundation constants and so on, on the critical buckling load of nanocomposite plates. Moreover, the effects of thermal loadings with various types of temperature rise are investigated comparatively according to the graphical results. It is explicitly shown that the buckling behavior of an FG nanocomposite plate is significantly influenced by these effects.