• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.667-668
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• 2006

Usually nanosecond pulsing laser ablation of metal is under thermal effect. Many studies of the theoretical analysis and modeling to predict a result of laser ablation of metal are suggested on the basis of the photothermal mechanism. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper films. We proposed the simplified SSB Model(Srinivasan-Smrtic-Babudp model) to study the photothermal effect of nanosecond pulsing laser ablation of copper thin metal. The experimental results were obtained by using the 355nm DPSS $Nd:YVO_4$ laser.

• Laser Solutions
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• v.8 no.2
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• pp.7-12
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• 2005

The material processing of UV nanosecond pulse laser cannot be avoided the material shape change and contamination caused by interaction of base material and laser beam. Nowadays, ultra short pulse laser shorter than nanosecond pulse duration is used to overcome this problem. The advantages of this laser are no heat transfer, no splashing material, no left material to the adjacent material. Because of these characteristics, it is so suitable for micro material processing. The processing of sapphire wafer was done by UV 355nm, green 532nm, IR 1064nm. X-Y motorized stage is installed to investigate the proper laser beam irradiation speed and cycles. Also, laser beam fluence and peak power are calculated.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.6
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• pp.804-812
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• 2003

This paper introduces optical methods for in-situ measurement of surface temperature and pressure transient in thermal processes having nanosecond time scales. In the temperature measurement, a p -Si thin film whose refractive index is calibrated as a function of temperature is embedded beneath the sample surface and the photothermal reflectance is monitored for estimating the surface temperature. The pressure transients are measured using the photoacoustic optical deflection method. The experimental technique is used to analyze the nanosecond laser induced vaporization process that is central to numerous engineering and bio-medical applications. Based on the experimental results, discussions are made on the experimental technique and the physical mechanisms of laser-driven explosive vaporization phenomena.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.4
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• pp.409-413
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• 2013

A polypropylene film was ablated using a $CO_2$ laser, Ti-sapphire femtosecond laser, and UV nanosecond laser. For modified atmosphere packaging, polypropylene films were ablated by laser pulse with different pulse energies and measured on an optical microscope. Also, we observed the shelf life of a banana contained within packaging of a breathable zipper bag. As a result, we have demonstrated that the breathable film can efficiently extend the shelf life of respiring foods, particularly fresh fruits and vegetables. The development of breathable film laser microfabrication system will more useful for industrial applications.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.10
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• pp.108-115
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• 2009

Although nanosecond pulsed laser drilling and milling are rapid and non-wear processes in micromachining, the quality cannot meet the precision standard due to the recast layer and heat affected zone. On the other hand, electrical discharge machining (EDM) is a well-known high precision machining process in micro scale; however, the low material removal rate (MRR) and tool wear remain as drawbacks. In this paper, hybrid process of laser beam machining (LBM) using nanosecond pulsed laser and micro EDM was studied for micro drilling and milling. While the quality of the micro structure fabricated by this hybrid process remains as high as direct EDM, the machining time and tool wear can be reduced. In addition, variable depth of layer was introduced as an effective method improving efficiency of hybrid milling.

• Laser Solutions
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• v.17 no.1
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• pp.13-16
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• 2014

Indium Tin Oxide (ITO) has been used widely for transparent conducting thin films. In this work, the feasibility of a laser sintering process to fabricate ITO thin films on flexible substrates is examined. Nanoparticles of ~10 nm were spin coated on a Si wafer and then sintered by a KrF excimer laser. The sintered structure was characterized by scanning electron microscopy. Polycrystalline structures were fabricated by the process without thermally damaging the substrate. The electrical resistivity of the film was reduced to ~ 1/1000 of the initial value. This work demonstrates that nanosecond laser sintering of ITO particles can be a useful tool to fabricate ITO films on various flexible substrates.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2003.05a
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• pp.100-102
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• 2003

• Laser Solutions
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• v.14 no.3
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• pp.7-11
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• 2011

As an active emission display using emissive polymer has had much attention recently, needs for a selective patterning of emissive layer for those displays have been increased abruptly. Therefore, the various laser sources in terms of its wavelength has been used for laser direct patterning. In this work, the feasibility of those processes is examined using numerical analysis and the experimental investigation. A sample has multi-layered structure, emissive polymer on aluminum which is deposited on a glass substrate. Key factors for optimizing the laser patterning of the emissive polymer are considered into the control of ablation products, large-sized particle, and the choice of the appropriate wavelength for minimizing the heat affected zone and the remnant layer.

• Journal of the Optical Society of Korea
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• v.11 no.1
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• pp.34-39
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• 2007

Laser-induced breakdown of colloidal suspensions, such as polystyrene, $ZrO_2$, and $SiO_2$ particles in diameters of 100-400 nm in water is investigated by nanosecond flash-pumped Nd:YAG laser pulses operating at a wavelength ${\lambda}$= 532 nm. The breakdown threshold intensity is examined in terms of breakdown probability as a function of laser pulse energy. The threshold intensity for $SiO_2$ particles ($1.27{\times}10^{11}\;W/cm^2$) with a size of 100 nm is higher than those for polystyrene and $ZrO_2$ particles with the same size, namely $5.7{\times}10^{10}$ and $5.5{\times}10^{10}\;W/cm^2$, respectively. Results indicate that the absorption of five photons is required to induce ionization of $SiO_2$ particles, whereas the other particles necessitate four-photon absorption. These breakdown thresholds are compared with those measured by nanosecond pulses from a diode-pumped Nd:YAG laser having a different focusing geometry.

• Journal of the Korean Solar Energy Society
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• v.39 no.3
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• pp.9-17
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• 2019

Laser cutting cell of solar cells can achieve high voltage and efficiency through more array than conventional 6 inch cell compared to same area. In this study, we fabricated c-Si cutting cell with various lasers and laser conditions such as power, speed, and number of times. In the case of picosecond laser, excellent surface characteristics were obtained due to small surface defects and low thermal damage at the output of 20W and the speed of 100 mm/s. However, it is not possible to fabricate a cutting cell having good characteristics due to nonuniform cutting inside the wafer when the processing for forming a cutting cell is not sufficiently performed. For nanosecond lasers, the best wafer characteristics were obtained for fabrication of excellent cutting cells at a frequency of 500 kHz and a laser speed of 100 mm/s. However, the nanosecond laser has not been processed sufficiently in the condition of a number of times. As a result, it was confirmed that the wafer thickness was cut by $63{\mu}m$ of the cell thickness of $170{\mu}m$ in the condition of five times of laser process. It was found that more than 30% of the wafer thickness had to be processed to fabricate the cutting cell. After cutting the 6-inch cell having the voltage of 0.65 V, we obtained the voltage of about 0.63 V.