• 제목/요약/키워드: nano-patterning process

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SPL에 의한 나노구조 제조 공정 연구 (Fabrication of nanometer scale patterning by a scanning probe lithography)

  • 류진화;김창석;정명영
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.330-333
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    • 2005
  • The fabrication of mold fur nano imprint lithography (NIL) is experimentally reported using the scanning probe lithography (SPL) technique, instead of the conventional I-beam lithography technique. The nanometer scale patterning structure is fabricated by the localized generation of oxide patterning on the silicon (100) wafer surface with a thin oxide layer, The fabrication method is based on the contact mode of scanning probe microscope (SPM) in air, The precision cleaning process is also performed to reach the low roughness value of $R_{rms}=0.084 nm$, which is important to increase the reproducibility of patterning. The height and width of the oxide dot are generated to be 15.667 nm and 209.5 nm, respectively, by applying 17 V during 350 ms.

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나노 패턴 장비용 컴플라이언스 스테이지 (Compliant Stage for Nano Patterning Machine)

  • 최기봉;이재종
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 춘계학술대회
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    • pp.1065-1068
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    • 2003
  • The nano imprint process is one of the next generation lithography has been mentioned as one of major nanoreplication techniques because it is simple process, low cost, high replication fidelity and relatively high throughput. This process requires a surface contact between a template with patterns and a wafer on a stage. After contact, the vertical moving the template to the wafer causes some directional motions of the stage. Thus the stage must move according to the motions of the template to avoid the damage of the transferred patterns on the wafer. This study is to develop the wafer stage with a passive compliance to overcome the damage. This stage is designed with the concept like that it has a monolithic, symmetry and planar 6-DOF mechanism.

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금속 배선 제작을 위한 메탈 나노 파우더 임프린팅 공정기술 개발 (Development of Metal nano Powder Imprinting Process for Fabrication of Conductive Tracks)

  • 김진수;김호관;임지석;배형대;최민석;강신일
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 춘계학술대회 논문집
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    • pp.371-374
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    • 2007
  • A method for metal nano powder imprinting is proposed as a patterning process for conductive tracks that is inexpensive and scalable down to the nanoscale. Conductive tracks with line widths of $0.5{\sim}20{\mu}m$ were fabricated using this method. The processing conditions were optimized to avoid various types of defects, and to increase the degree of sintering and electric conductivity of the imprinted conductive tracks. The mean electric resistivity of the conductive tracks imprinted under optimum conditions was $8.95{\mu}{\Omega}{\cdot}cm$, which is in the range required for practical applications.

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금속 나노 입자를 이용한 인쇄 회로 기판의 회로 형성 (Formation of electric circuit for printed circuit board using metal nano particles)

  • 정재우
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.545-545
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    • 2007
  • Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

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UV 임프린팅 공정을 이용한 금속막 필터제작 (Fabrication of Metallic Nano-Filter Using UV-Imprinting Process)

  • 노철용;이남석;임지석;김석민;강신일
    • 소성∙가공
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    • 제14권5호
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    • pp.473-476
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    • 2005
  • The demand of on-chip total analyzing system with MEMS (micro electro mechanical system) bio/chemical sensor is rapidly increasing. In on-chip total analyzing system, to detect the bio/chemical products with submicron feature size, a filtration system with nano-filter is required. One of the conventional methods to fabricate nano-filter is to use direct patterning or RIE (reactive ion etching). However, those procedures are very costly and are not suitable fur mass production. In this study, we suggested new fabrication method for a nano-filter based on replication process, which is simple and low cost process. After the Si master was fabricated by laser interference lithography and reactive ion etching process, the polymeric mold was replicated by UV-imprint process. Metallic nano-filter was fabricated after removing the polymeric part of metal deposited polymeric mold. Finally, our fabrication method was applied to metallic nano-filter with $1{\mu}m$ pitch size and $0.4{\mu}m$ hole size for bacteria sensor application.

초발수 현상을 이용한 나노 잉크 미세배선 제조 (Fabrication of Micro Pattern on Flexible Substrate by Nano Ink using Superhydrophobic Effect)

  • 손수정;조영상;나종주;최철진
    • 한국분말재료학회지
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    • 제20권2호
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    • pp.120-124
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    • 2013
  • This study is carried out to develop the new process for the fabrication of ultra-fine electrodes on the flexible substrates using superhydrophobic effect. A facile method was developed to form the ultra-fine trenches on the flexible substrates treated by plasma etching and to print the fine metal electrodes using conductive nano-ink. Various plasma etching conditions were investigated for the hydrophobic surface treatment of flexible polyimide (PI) films. The micro-trench on the hydrophobic PI film fabricated under optimized conditions was obtained by mechanical scratching, which gave the hydrophilic property only to the trench area. Finally, the patterning by selective deposition of ink materials was performed using the conductive silver nano-ink. The interface between the conductive nanoparticles and the flexible substrates were characterized by scanning electron microscope. The increase of the sintering temperature and metal concentration of ink caused the reduction of electrical resistance. The sintering temperature lower than $200^{\circ}C$ resulted in good interfacial bonding between Ag electrode and PI film substrate.

나노물질의 선택적 레이저소결을 이용한 유연전기소자 구현 연구현황 (Status of Research on Selective Laser Sintering of Nanomaterials for Flexible Electronics Fabrication)

  • 고승환
    • 대한기계학회논문집B
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    • 제35권5호
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    • pp.533-538
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    • 2011
  • 대부분의 유연전기소자는 플라스틱, 옷감, 종이와 같이 고온에 민감한 물질이기 때문에 열에 민감한 기판 위에 금속을 증착하고 패터닝할 수 있는 저온 공정의 개발이 필요하다. 최근 기존의 광식각과 진공증착 방법을 이용하지 않고 액상으로 금속 나노입자의 박막을 형성하고 선택적 레이저 소결을 이용하여 플라스틱에 열적손상을 최소화하고 고해상도의 금속 패터닝을 방법이 많은 연구가 활발히 진행되고 있다. 본 논문에서는 본 연구실에서 활발히 수행중인 나노물질의 선택적 레이저소결법을 이용하여 유연 디스플레이와 유연태양전지와 같은 유연전기소자의 개발 동향에 대해 알아보고 앞으로의 발전방향에 대해 논의한다.

박막펌핑을 이용한 Nano Fountain-Pen의 유동 특성에 관한 수치적 연구 (Numerical Analysis of the Flow Characteristics in the Nano Fountain-Pen Using Membrane Pumping)

  • 이진형;이영관;이석한;김훈모;김윤제
    • 한국유체기계학회 논문집
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    • 제9권2호
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    • pp.19-24
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    • 2006
  • Nano fountain-pen is a novel device to make the constant patterning in micro process using new designed probe. Fountain-pen nanolithography (FPN) is applied for constant supply of liquid in conjunction of patterns and surface variation in the micro process. In this study, nuo fountain-pen is composed with reservoir, micro channels, tip and scondary chamber. Instead of traditional method only using capillary force, liquid can be definitely and exactly injected with membrane pumping by the repulse force of tip. It is dfficult to perform experiments in the micro range so that we carried out a numerical analysis for internal flow, using a commercial code, FlUENT, The velocity, pressure and flow rate are obtained under laminar, unsteady, three-dimensional incompressible flow with no-slip condition, and results are graphically described.

잉크젯 인쇄 기술을 이용한 인쇄회로기판용 나노구리배선 개발 (Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board)

  • 서상훈;이로운;윤관수;정재우;이희조;육종관
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1806-1809
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    • 2008
  • Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

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One- and Two-Dimensional Arrangement of DNA-Templated Gold Nanoparticle Chains using Plasma Ashing Method

  • Kim, Hyung-Jin;Hong, Byung-You
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
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    • pp.291-291
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    • 2010
  • Electron-beam lithography (EBL) process is a versatile tool for a fabrication of nanostructures, nano-gap electrodes or molecular arrays and its application to nano-device. However, it is not appropriate for the fabrication of sub-5 nm features and high-aspect-ratio nanostructures due to the limitation of EBL resolution. In this study, the precision assembly and alignment of DNA molecule was demonstrated using sub-5 nm nanostructures formed by a combination of conventional electron-beam lithography (EBL) and plasma ashing processes. The ma-N2401 (EBL-negative tone resist) nanostructures were patterned by EBL process at a dose of $200\;{\mu}C/cm2$ with 25 kV and then were ashed by a chemical dry etcher at microwave (${\mu}W$) power of 50 W. We confirmed that this method was useful for sub-5 nm patterning of high-aspect-ratio nanostructures. In addition, we also utilized the surface-patterning technique to create the molecular pattern comprised 3-(aminopropyl) triethoxysilane (APS) as adhesion layer and octadecyltrichlorosilane (OTS) as passivation layer. DNA-templated gold nanoparticle chain was attached only on the sub-5 nm APS region defined by the amine groups, but not on surface of the OTS region. We were able to obtain DNA molecules aligned selectively on a SiO2/Si substrate using atomic force microscopy (AFM).

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