• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.3-6
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• 2009

Aluminum nitride (AIN) thin films were deposited on a polycrystalline 3C-SiC intermediate layer by a pulsed reactive magnetron sputtering system. Characteristics of the AIN/SiC heterostructures were investigated by field emission scanning electron microscopy (FE-SEM), atomic force microscopy (AFM), X-ray diffraction (XRD), and Fourier transform infrared spectroscopy (FT-IR). The columnar structure of AIN thin films was observed by FE-SEM. The surface roughness of AlN films on the 3C-SiC buffer layer was measured using AFM. The XRD pattern of AlN films on SiC buffer layers was highly oriented at (002). Full width at half maximum (FWHM) of the rocking curve near (002) reflections was $1.3^{\circ}$. The infrared absorbance spectrum indicated that the residual stress of AIN thin films grown on SiC buffer layers was nearly negligible. The 3C-SiC intermediate layers are promising for the realization of nitride based electronic and mechanical devices.

• 한국재료학회지
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• 제18권10호
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• pp.558-563
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• 2008

TiAlN films were deposited on WC-5Co substrates with different buffer layers by D.C. magnetron sputtering. The films were evaluated by microstructural observations and measuring of preferred orientation, hardness value, and adhesion force. As a process variable, various buffer layers were used such as TiAlN single layer, TiAlN/TiAl, TiAlN/TiN and TiAlN/CrN. TiAlN coating layer showed columnar structures which grew up at a right angle to the substrates. The thickness of the TiAlN coating layer was about $1.8{\mu}m$, which was formed for 200 minutes at $300^{\circ}$. XRD analysis showed that the preferred orientation of TiAlN layer with TiN buffer layer was (111) and (200), and the specimens of TiAlN/TiAl, TiAlN/CrN, TiAlN single layer have preferred orientation of (111), respectively. TiAlN single layer and TiAlN/TiAl showed good adhesion properties, showing an over 80N adhesion force, while TiAlN/TiN film showed approximately 13N and the TiAlN/CrN was the worst case, in which the layer was destroyed because of high internal residual stress. The value of micro vickers hardness of the TiAlN single layer, TiAlN/TiAl and TiAlN/TiN layers were 2711, 2548 and 2461 Hv, respectively.

• 전자공학회논문지B
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• 제31B권5호
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• pp.123-133
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• 1994

This paper presents an output arbitrator for input buffering ATM (Asynchronous Transfer Mode) switches using neural networks. To avoid blocking in ATM switches with blocking characteristics, it is required to buffer ATM cells in input buffer and to schedule them. The N$\times$N request matrix is divided into N/16 submatrices in order to get rid of internal blocking systematically in scheduling phase. The submatrices are grouped into N/4 groups, and the cells in each group are switched alternatively. As the window size of input buffer is increases, the number of input cells switched in a time slot approaches to N. The selection of nonblocking cells to be switched is done by neural network modules. N/4 neural network modules are operated simultaneously. Fast selection can be achieved by massive parallelism of neural networks. The neural networks have 4N neurons and 14N connection. The proposed method is implemented in C language, and the simulation result confirms the feasibility of this method.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.273-273
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• 2008

This paper describes the frequency response of two-port surface acoustic wave (SAW) resonator made of 002-polycrystalline aluminum nitride (AlN) thin film on 111-poly 3C-SiC buffer layer. In there, Polycrystalline AlN thin films were deposited on polycrystalline 3C-SiC buffer layer by pulsed reactive magnetron sputtering system, the polycrystalline 3C-SiC was grown on $SiO_2$/Si sample by CVD. The obtained results such as the temperature coefficient of frequency (TCF) of the device is about from 15.9 to 18.5 ppm/$^{\circ}C$, the change in resonance frequency is approximately linear (30-$150^{\circ}C$), which resonance frequency of AlN/3C-SiC structure has high temperature stability. The characteristics of AlN thin films grown on 3C-SiC buffer layer are also evaluated by using the XRD, and AFM images.

• 한국재료학회지
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• 제9권6호
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• pp.599-603
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• 1999

AIN과 저온 GaN 완충충율 이용하여 Si 기판 위의 후막 GaN의 성장특성을 조샤하였다. Si과 GaN의 격자부정합도와 열팽창계수의 차이를 줄이기 위해 AIN과 저온 GaN를 완충충으로 사용하였다. AIN은 RF sputter를 이용하여 중착온도와 증착시간 및 RF power에 따른 표면 거칠기를 AFM으로 조사하여 최척조건을 확립하여 사용하였다. 또한 저온에서 GaN를 성장시켜 이를 완충충으로 이용하여 후막 GaN의 성장시 미치는 영향을 살펴보았다. 성장온도와 V/III 비율이 후막 성장시 표면특성과 결정성 및 성장속도에 미치는 영향을 조사하였다. 후막 GaN의 표연특성 및 막의 두께는 SEM과 $\alpha-step$을 이용하여 측정하였으며 결정성은 X-ray Diffractometer를 이용하여 조사하였다.

• Transactions on Electrical and Electronic Materials
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• 제18권3호
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• pp.125-128
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• 2017

This study is on how ohmic area etching affects the buffer breakdown voltage of AlGaN/GaN HEMT. The surface morphology of the ohmic metal can be improved by whole etching on the ohmic area. The buffer breakdown voltages of the samples with whole etching on the ohmic area were improved by the suppression of the metal spikes formed under the ohmic contact regions during high-temperature annealing. The samples with selective etching on the ohmic area were investigated for comparison. In addition, the buffer leakage currents were measured on the different radii of the wafer, and the uniformity of the buffer leakage currents on the wafer were investigated by PL mapping measurement.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권1호
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• pp.30-33
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• 2006

Transparent indium tin oxide (ITO) anode surface was modified using $O_3$ Plasma and organic ultrathin buffer layers were deposited on the ITO surface using 13.56 MHz RF plasma polymerization technique. The EL efficiency, operating voltage and lifetime of the organic light-emitting device (OLED) were investigated in order to study the effect of the plasma surface treatment and role of plasma polymerized organic ultrathin buffer layer. Poly methylmethacrylate (PMMA) layers were plasma polymerized on the ITO anode as buffer layer between anode and hole transport layer (HTL). The plasma polymerization of the organic ultrathin layer were carried out at a homemade capacitive-coupled RF plasma equipment. N,N'-diphenyl-N,N'(3- methylphenyl)-1,1'-diphenyl-4,4'-diamine (TPD) as HTL, Tris(8-hydroxyquinolinato) Aluminum $(Alq_3)$ as both emitting layer (EML)/electron transport layer (ETL), and aluminum layer as cathode were deposited using thermal evaporation technique. Effects of the plasma surface treatment of ITO and plasma polymerized buffer layers on the OLED performance were discussed.

• 한국세라믹학회지
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• 제30권4호
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• pp.332-338
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• 1993

TiN/Ti is the best buffer layer between PZT thin film and si substrate among the Ti, TiN, ZrN, TiN/Ti, ZrN/Ti. The amorphous PZT films deposited on TiN/Ti buffer layer directly transform into perovskite phase when rapid thermal annealed for 30sec above 55$0^{\circ}C$. As Rapid Thermal Annealing(RTA) temperature increased, the remanent polarization(Pr) and dielectric constant($\varepsilon$r) increased and then showed Pr=21 $\varepsilon$r=593 when rapid thermal annealed 80$0^{\circ}C$ for 30sec. On the contrary the leakage current increased with increasing RTA temperature due to the formation of void made by Pb evaporationand grain cohesion.

• 한국토양비료학회지
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• 제37권4호
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• pp.251-258
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• 2004

밭작물에 대한 규산질 비료의 시용이 널리 이루어지고 있으나 적정시용수준이 밝혀져 있지 못하며 또한 밭토양에서의 유효규산 측정방법이 구명되어있지 못한 실정이다. 본 연구는 참외 시설재배지 토양에 대하여 유효규산 측정방법을 구명하기 위해 수행되었다. 경북 성주지역의 참외 시설재배지,10개소의 토양과 참외 잎 시료를 채취하여 가용성 토양 규산 함량과 잎 중의 총 규산 함량을 분석하였다. 가용성 토양 규산은 0.5 N HCI, 1 N sodium acetate buffer (pH 4.0). citric acid 1%, water, Tris buffer (pH 7.0), 그리고 1주간 담수하는 방법 등으로 추출하였으며, 식물체 규산은 autoclave 방법으로 추출하였다. 추출액중의 가용성 규산은 비색법으로 정량하였다. 각 추출방법별로 가용성 토양규산 함량과 식물체규산 함량과의 관계를 비교하였는데, 1 N sodium acetate buffer 방법이 토양 규산과 식물체 규산 관계를 가장 뚜렷한 포화곡선으로 나타내었다. 포화곡선으로부터 산출된 참외 잎 중의 포화 규산 함량은 약 $14g\;SiO_2\;kg^{-1}$이었고 1 N sodium acetate buffer 방법으로 추출할 경우토양 규산 함량 $120mg\;SiO_2\;kg^{-1}$이 참외에 적정한 수준인 것으로 나타났다. 특히 1 N sodium acetate buffer방법의 경우 참외 잎 중의 규산 함량이 포화되는 수준 이하의 토양 규산 함량 범위에서는 토양 규산 함량과 식물체 규산 함량 사이에 유의성 있는 상관관계가 있었다. 따라서 현재 우리나라에서 논토양의 유효규산 측정방법으로 널리 사용퇴고 있는 1 N sodium acetate buffer를 이용한 유효규산 추출방법이 밭토양에도 적용될 수 있을 것으로 판단되나 앞으로 다양한 작물과 토양을 대상으로 계속적인 연구가 요구된다.

• 한국전기전자재료학회논문지
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• 제25권1호
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• pp.24-28
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• 2012

In this study, we fabricated an amorphous InGaZnO pseudo-MOS transistor (a-IGZO ${\Psi}$-MOSFET) with a stacked $Si_3N_4/SiO_2$ (NO) gate dielectric and evaluated reliability of the devices with various thicknesses of a $SiO_2$ buffer layer. The roles of a $SiO_2$ buffer layer are improving the interface states and preventing degradation caused by the injection of photo-created holes because of a small valance band offset of amorphous IGZO and $Si_3N_4$. Meanwhile, excellent electrical properties were obtained for a device with 10-nm-thick $SiO_2$ buffer layer of a NO stacked dielectric. The threshold voltage shift of a device, however, was drastically increased because of its thin $SiO_2$ buffer layer which highlighted bias and light-induced hole trapping into the $Si_3N_4$ layer. As a results, the pseudo-MOS transistor with a 20-nm-thick $SiO_2$ buffer layer exhibited improved electrical characteristics and device reliability; field effective mobility(${\mu}_{FE}$) of 12.3 $cm^2/V{\cdot}s$, subthreshold slope (SS) of 148 mV/dec, trap density ($N_t$) of $4.52{\times}1011\;cm^{-2}$, negative bias illumination stress (NBIS) ${\Delta}V_{th}$ of 1.23 V, and negative bias temperature illumination stress (NBTIS) ${\Delta}V_{th}$ of 2.06 V.