• Smart Structures and Systems
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• v.23 no.6
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• pp.579-587
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• 2019

In this paper, pounding tuned mass dampers (PTMDs) were designed to mitigate the multi-mode vortex-induced vibration (VIV) of stay cable utilizing the viscous-elastic material's energy-dissipated ability. The PTMD device consists of a cantilever metal rod beam, a metal mass block and a specially designed damping element covered with viscous-elastic material layer. Wind-tunnel experiment on VIV of stay cable model was set up to validate the effectiveness of the PTMD on multi-mode VIV mitigation of stay cable. By analyzing and comparing testing results of all testing cases, it could be verified that the PTMD with viscous-elastic pounding boundary can obviously mitigate the VIV amplitude of the stay cable. Moreover, the installed location and the design parameters of the PTMD device based on the controlled modes of the primary stay cable, would have a certain extent suppression on the other modal vibration of the stay cable, which means that the designed PTMDs are effective among a large band of frequency for the multi-mode VIV control of the stay cable.

• Proceedings of the Korea Concrete Institute Conference
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• 1998.10a
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• pp.474-479
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• 1998

In this paper, the structural behavior of R.C. multi-layered floor structure including foam concrete layer is numerically analyzed. For the analysis, 3D interface element has been implemented to finite element analysis program to consider the interfacial behavior of multi-layered floor structure which consists of rubber layer, foam concrete layer and mortar layer on RC slab. Based on analysis results on multi-layered structure, its structural behavior is analyzed according to geometrical and material properties of foam concrete. Optimum material property of each layer of the floor structure is proposed to get optimum multi-layered concrete structure.

• Journal of Welding and Joining
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• v.25 no.1
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• pp.37-41
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• 2007

The purpose of this study is to establish the predictive method of angular distortion of the double-sided multi-pass butt weldment achieve it, the behavior of angular distortion in the butt weldment were investigated using comprehensive finite element analyses and experiments. The angular distortion in the multi-pass butt weldment strongly depends on the welding heat input(Q) and the effective bending rigidity of the weld throat. The effective bending rigidity of the first welding pass on the backing side was defined as the function of dimensionless parameter(k) and a bending rigidity of bead-on-plate weldment. Based on the results, the predictive equation for angular distortion of multi-pass butt weldment was proposed and verified by experiments.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.1
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• pp.70-74
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• 2004

We investigated transmittance, surface characteristics, and resistivity according to bending of ITO(indium tin oxide) film with four other multi -harrier film). Transmission data of ITO film with four ITO films showed there was about large 90％ transmission above 550nm wavelength at three multi-barrier structures. But, both-side hard coated structure showed relatively low 75％ transmission above 550nm wavelength. And, surface images measured from SEM (scanning electron microscope) showed both-side hard coated structure have a tendency of more roughness. Also, resistivity change of four other multi-barrier film showed there was the lowest change at one-side hardcoated structure. Subsequently, with result of resistivity change according to position, we knew the resistivity change of the center increased rapidly than that of the edge.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.387-388
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• 2008

This paper presents the design approach and test results of the Q-band precision subminiature coaxial adaptor based on transmission line theory using multi-step impedance and air-holes to increase its cutoff frequency. In order to increase the frequency performance, the adaptor is designed with hooked structure, fixing step, multi-air-holes, and outer conductor. The return loss increments due to the hooked structure and multi air-holes are minimized to 2 dB and 1.5 dB, respectively. A VSWR(Voltage Standing Wave Ratio) of <1.2 is obtained from DC to 40 GHz, while guaranteeing the durability of the adaptor from room-temperature$(25^{\circ}C)$ to $120^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.176-180
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• 2003

Tri-crystalline silicon (Tri-Si) wafers have three different orientations and three grain boundaries. In this paper, tri-Si wafers have been used for the fabrication of buried contact solar cells. The optical and micro-structural properties of these cells after texturing in KOH solution have been investigated and compared with those of cast multi-crystalline silicon (multi-Si) wafers. We employed a cost effective fabrication process and achieved buried contact solar cell (BCSC) energy conversion efficiencies up to 15% whereas the cast multi-Si wafer has efficiency around 14%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.506-509
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• 2005

This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.

• Journal of the Korea Institute of Military Science and Technology
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• v.3 no.2
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• pp.179-188
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• 2000

Multi-disciplinary optimization design concept can provide a solution to many engineering problems. In the field of structural analysis, much development of size or topology optimization has been achieved in the application of research. This paper demonstrates an optimum design of a multi-layer cylindrical tube which behaves thermoelastically. A multi-layer cylindrical tube that has several different material properties at each layer is optimized within allowable stress and temperature range when mechanical and thermal loads are applied simultaneously. When thermal loads are applied to a multi-layer tube, stress phenomena become complicated due to each layer's thermal expansion and the layer thicknesses. Factors like temperature; stress; and material thermal thicknesses of each tube layer are very difficult undertaking. To analyze these problems using an efficient and precise method, the optimization theories are adopted to perform thermoelastic finite element analysis.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.533-534
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• 2008

This paper presents a multi-phase ring VCO for low-cost, low-power GPS receiver. In the RF band used in GPS, L1 band is now in commercial-use and L2,L5 are predicting to be commercial-use soon. Thus Wide band PLL and Cost-effective IC solutions are required for future multi-band GPS receiver that received three types band at once. A new PLL architecture for multi-band GPS application is proposed. Ring VCO is even smaller than LC-VCO and a good alternative for low-cost solution. Proposed multi-phase ring VCO offers wide frequency range covering L1, L2, and L5 band, 20% reduction of area, 23% reduction of PLL power and can generate I/Q without extra I/Q generator.