• Anatomy & Biological Anthropology
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• v.31 no.4
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• pp.151-158
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• 2018

The intervertebral foramen is formed by two adjacent vertebrae and an intervertebral disc. Previous studies examining the foramen have been performed using various methods. The author obtained characteristics of the intervertebral foramen based on silicon mold. The author used 18 cadavers and dissected the lumbar intervertebral foramen. First, positional levels of the spinal nerve in the intervertebral foramen were measured. Second, after being removed all tissues covering the intervertebral, bony foramen was filled with melted silicon to mold the cross section. Subsequently, the solidified silicon mold was removed and stamped on a paper. The paper was scanned and analyzed area, perimeter, height and width of the intervertebral foramen on a computer. Area (average, $9.43mm^2$) and perimeter (average, 48.02 mm) did not show any statistical significant pattern for any lumbar vertebral levels. However, the height and width significantly differed at the fifth lumbar vertebra, which had the shortest height (the fifth, 13.00 mm; average, 15.78 mm) and longest width (the fifth, 8.61 mm; average, 7.87 mm), although there were similar patterns in case of area and perimeter of the first to fourth lumbar vertebra. Height had a decrease tendency while width had an increase tendency both from the second to fifth lumbar vertebra. Spinal nerves went through near the intervertebral disc level from the first to fourth lumbar vertebra, although they passed below the disc at the fifth level. This study provides a different view of methodology for the 3-dimensional aspect for the intervertebral foramen. Results of this study may indicate that height and width of the intervertebral foramen changed along all lumbar vertebral levels; nevertheless, area and perimeter of the intervertebral foramen remained constant.

• Microbiology and Biotechnology Letters
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• v.10 no.3
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• pp.227-232
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• 1982

The methods determining the growth rate of mold on beans were investigated in order to compare the growth of Aspergillus oryzae on lupinseed to that on soybean. The growth of A. oryzae on cooked whole or paste form of bean substrates was evaluated by the measurements of colony diameter and hyphae length of the mold. The mold showed characteristic lag times to form the colony on different types of substrate. The growth of colony diameter was coincided with the increase in $\alpha$-amino nitrogen content of the substrate when the moisture level of the substrates was similar each other. The colony diameter and the cultivation time after the lag period showed a straight line relationship, from which the growth rate was estimated. in general, lupinseed paste allowed faster growth of A. oryzae than soybean paste at the initial growth phase. The lag time to form the colony was 24.0 hrs on lupinseed paste and 44.4 hrs on soybean paste. The growth rate after colony formation was, however, 7.05 mm/day for lupinseed paste and 8.83mm/day for soybean paste, which indicated that the growth rate after the lag period was faster on soybean compared to lupinseed. The sporulation time of the mold was related to the lag time for the colony formation. The measurement of hyphae length on whole beans could be used as a simple and rapid method of estimating the growth property of mold on different substrates.11 showed that the growth of A. oryzae was partly hindered by the thick hull of the lupinseed.

• Journal of Korean Society for Quality Management
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• v.30 no.2
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• pp.86-98
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• 2002

Defining the relationship between the quality of injection molded parts and the process condition is very complicate because of lots of factor are involved and each factor has a non-linearity. With the development of CAE(Computer Aided Engineering) technology, the estimation of volumetric shrinkage of injection mold parts is possible by computer simulation even though restricted application. In this research, Neural Network applied for finding optimal processing condition. The percent of volumetric shrinkage compared on each case and show neural network can be successfully applied selecting optimum condition not only within factor level but also between factor level.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.411-411
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• 2012

Over the recent years, surface enhanced Raman spectroscopy (SERS) has dramatically grown as a label-free detecting technique with the high level of selectivity and sensitivity. Conventional SERS-active nanostructured layers have been deposited or patterned on rigid substrates such as silicon wafers and glass slides. Such devices fabricated on a flexible platform may offer additional functionalities and potential applications. For example, flexible SERS-active substrates can be integrated into microfluidic diagnostic devices with round-shaped micro-channel, which has large surface area compared to the area of flat SERS-active substrates so that we may anticipate high sensitivity in a conformable device form. We demonstrate fabrication of flexible SERS-active nanostructured substrates based on soft-lithography for simple, low-cost processing. The SERS-active nanostructured substrates are fabricated using conventional Si fabrication process and inkjet printing methods. A Si mold is patterned by photolithography with an average height of 700 nm and an average pitch of 200 nm. Polydimethylsiloxane (PDMS), a mixture of Sylgard 184 elastomer and curing agnet (wt/wt = 10:1), is poured onto the mold that is coated with trichlorosilane for separating the PDMS easily from the mold. Then, the nano-pattern is transferred to the thin PDMS substrates. The soft lithographic methods enable the SERS-active nanostructured substrates to be repeatedly replicated. Silver layer is physically deposited on the PDMS. Then, gold nanoparticle (AuNP) inks are applied on the nanostructured PDMS using inkjet printer (Dimatix DMP 2831) to deposit AuNPs on the substrates. The characteristics of SERS-active substrates are measured; topology is provided by atomic force microscope (AFM, Park Systems XE-100) and Raman spectra are collected by Raman spectroscopy (Horiba LabRAM ARAMIS Spectrometer). We anticipate that the results may open up various possibilities of applying flexible platform to highly sensitive Raman detection.

• Transactions of Materials Processing
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• v.15 no.9 s.90
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• pp.667-672
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• 2006

Agglutination is one of the most commonly employed reactions in clinical diagnosis. In this paper, we have designed and fabricated nickel mold insert for injection molding of a microfluidic lab-on-a-chip for the purpose of the efficient detection of agglutination. In the presented microfluidic lab-on-a-chip, two inlets for sample blood and reagent, flow guiding microchannels, improved serpentine laminating micromixer(ISLM) and reaction microwells are fully integrated. The ISLM, recently developed by our group, can highly improve mixing of the sample blood and reagent in the microchannel, thereby enhancing reaction of agglutinogens and agglutinins. The reaction microwell was designed to contain large volume of about $25{\mu}l$ of the mixture of sample blood and reagent. The result of agglutination in the reaction microwell could be determined by means of the level of the light transmission. To achieve the cost-effectiveness, the microfluidic lab-on-a-chip was realized by the injection molding of COC(cyclic olefin copolymer) and thermal bonding of two injection molded COC substrates. To define microfeatures in the microfluidic lab-on-a-chip precisely, the nickel mold inserts of lab-on-a-chip for the injection molding were fabricated by combining the UV photolithography with a negative photoresist SU-8 and the nickel electroplating process. The microfluidic lab-on-a-chip developed in this study could be applied to various clinical diagnosis based on agglutination.

• Journal of Power System Engineering
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• v.16 no.5
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• pp.70-75
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• 2012

In mechanical industries, forging is one of the basic process. But comparing the other developed industries, forging industries can not reach at the level of that development. In forging industries, the quality of the products totally depends on the skills of workers and also the precision of the equipments. Particularly because the open die forging industry is unable to deviate from the past method of production and all works are manually progressed, the operator is always exposed to the danger. In the regard some additional device has been made especially. Thus, in this research, by using the forklift as the means for the manipulation of the development object system, it tries to be comprised the process automation. After than it is fitted with the forklift for safe and easy handling of jobs and products during open die forging process. First of all, development system mold has been assembled to the system, after than it is assembled with forklift. This development system has been applied for handling of large scale products more than 300kg, and the satisfactory result with uniform quality of the products have been achieved due to this mechanical setup.

• The Plant Pathology Journal
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• v.36 no.6
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• pp.579-590
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• 2020

Botrytis cinerea, which causes gray mold disease in more than 200 plant species, is an economically important pathogen that is mainly controlled by synthetic fungicides. Synergistic fungicide mixtures can help reduce fungicide residues in the environment and mitigate the development of fungicide-resistant strains. In this study, we screened microbial culture extracts on Botrytis cinerea to identify an antifungal synergist for tebuconazole. Among the 4,006 microbial extracts screened in this study, the culture extract from Schizophyllum commune displayed the most enhanced activity with a sub-lethal dosage of tebuconazole, and the active ingredient was identified as schizostatin. In combination with 5 ㎍/ml tebuconazole, schizostatin (1 ㎍/ml) showed disease control efficacy against gray mold on tomato leaf similar to that achieved with 20 ㎍/ml tebuconazole treatment alone. Interestingly, schizostatin showed demethylation inhibitor (DMI)-specific synergistic interactions in the crossed-paper strip assay using commercial fungicides. In a checkerboard assay with schizostatin and DMIs, the fractional inhibitory concentration values were 0.0938-0.375. To assess the molecular mechanisms underlying this synergism, the transcription levels of the ergosterol biosynthetic genes were observed in response to DMIs, schizostatin, and their mixtures. Treatment with DMIs increased the erg11 (the target gene of DMI fungicides) expression level 15.4-56.6-fold. However, treatment with a mixture of schizostatin and DMIs evidently reverted erg11 transcription levels to the pre-DMI treatment levels. These results show the potential of schizostatin as a natural antifungal synergist that can reduce the dose of DMIs applied in the field without compromising the disease control efficacy of the fungicides.

• Korean Journal of Environmental Biology
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• v.21 no.3
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• pp.240-244
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• 2003

Conidia of molds within the Asian dust were captured in the ambient air of mid-west Korea, in springtime of 2000~2002. An eight-stage Cascade impactor and 0.22 $\mu\textrm{m}$ pore size membrane filters were used for the dust samples. Several kinds of molds grown from the samples were identified to the genus level. Those are Aspergillus, Basipetospora, Epicoccum, Fusarium, Monotospora and Penicillium. Relatively diversified mycelia of hyphomycetes were grown on the fine dust sample (1.1~2.1 $\mu\textrm{m}$) in the first year Asian dust episode (23~24 March, 2000). On the other hand, some fluffy molds and dark molds aggregations were grown on even the backup particle sample less than 0.43 $\mu\textrm{m}$ during the second year episode (24~26 April, 2001). The result of the last year episode (21~22 March, 2002) showed various mycelia grown on the sample contained from 1.1 to 2.1 $\mu\textrm{m}$ sized particles, just like the result of the first year episode (23~24 March, 2000). These variations between the episodes might be caused by the difference of the dust origins.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.114-122
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• 2013

This study introduces an optimization methodology for the determination of gate location that ensures the melt flow balance within a part cavity of injection mold. A new sequential direct-search scheme based on the recursive reduction of the designer-specified gate design area is developed, and it is integrated with a commercial flow simulation tool for optimization. To quantify the level of melt flow balance, we employ the maximum difference among the fill times for the melt fronts to reach the boundary elements of part cavity as objective function. The proposed methodology is successfully applied in the case study of melt flow balancing in molding of a bar code scanner model. The result shows that the melt flow balance at the optimized gate positions is significantly improved from that for the initial gate position.