• Title/Summary/Keyword: moisture absorption test

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Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions (Bendable 임베디드 전자모듈의 손상 메커니즘)

  • Jo, Yun-Seong;Kim, A Young;Hong, Won Sik
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.59-63
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    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

Reliability Evaluation of Semiconductor using Ultrasonic (초음파를 이용한 반도체의 신뢰성 평가)

  • Jang, Hyo-Sung;Ha, Yop;Jang, Kyung-Young;Kim, Jung-Kyu
    • Proceedings of the Korean Reliability Society Conference
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    • 2001.06a
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    • pp.239-244
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    • 2001
  • Today, Ultrasonic is used as an important non-destructive test tool of semiconductor reliability evaluation and failure analysis. The semiconductor packaging trend goes to develop thin package, this trend makes difficult to inspect to defect in semiconductor package. One of the important problem in all semiconductor is moisture absorption in the atmosphere. This moisture causes crack or delamination to package when the semiconductor package is soldered on PCB. Reliability evaluation of semiconductor's object is investigating the effect of this moisture. For that reason, this study is investigating the effect of this moisture and reliability evaluation of semiconductor after preconditioning test and scanning acoustic microscope.

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Impact Damages and Residual Strength of CFRP Laminates under the Hygrothermal Environment (고온.고습 환경에서 CFRP 적층재의 충격손상와 잔류강도)

  • Jeong, Jong-An;Yang, In-Yeong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.12
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    • pp.3748-3758
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    • 1996
  • This study is to investigate experimentally relationships between the impact energy and moisture absorption characteristies vs.the residual bending strength with the variation of stacking seqences. When Carbon-fiber reinforced plastics(CFRP) impact-induced laminates are subjected to the high temperatures and hygrothermal effects, it is found that what CFRP laminates are impacted by a steel ball (5 mm in diametar) ; thus, the generated delamination is observed by the ultrasonic microscope. And the residual bending strength is evaluated by a three-point bending test. Also, a thermostat is used in test with the unimpacted and impacted specimens for the moisture experimentaiton. The percision electro lever scles is used to measure the moisture content(1/10, 000g).

Mechanical properties of stabilized saline soil as road embankment filling material

  • Li Wei;Shouxi Chai;Pei Wang
    • Geomechanics and Engineering
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    • v.37 no.5
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    • pp.499-510
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    • 2024
  • In northern China, abundant summer rainfall and a higher water table can weaken the soil due to salt heave, collapsibility, and increased moisture absorption, thus the chlorine saline soil (silty clay) needs to be stabilized prior to use in road embankments. To optimize chlorine saline soil stabilizing programs, unconfined compressive strength tests were conducted on soil treated with five different stabilizers before and after soaking, followed by field compaction test and unconfined compressive strength test on a trial road embankment. In situ testing were performed with the stabilized soils in an expressway embankment, and the results demonstrated that the stabilized soil with lime and SH agent (an organic stabilizer composed of modified polyvinyl alcohol and water) is suitable for road embankments. The appropriate addition ratio of stabilized soil is 10% lime and 0.9% SH agent. SH agent wrapped soil particles, filled soil pores, and generated a silk-like web to improve the moisture stability, strength, and stress-strain performance of stabilized soil.

Effect of presoaking degree of lightweight aggregate on the properties of lightweight aggregate concrete

  • Tang, Chao-Wei
    • Computers and Concrete
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    • v.19 no.1
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    • pp.69-78
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    • 2017
  • This study aimed at exploring the effect of presoaking degree of lightweight aggregate (LWA) on the fresh and hardened properties of concrete. Two series (i.e., Series A and Series B) of concrete mixes that were made of LWA with different moisture states were prepared. The presoaking degree of LWA was divided into three types: oven dry state, 1 hour prewetted and 24 hours prewetted. For the Series A, the water content of the lightweight aggregate concrete (LWAC) mixes was adjusted in accordance with the moisture condition of the LWA. Whereas the amount of water added in the Series B mixes was deliberately not adjusted for the moisture condition of the LWA. Slump test, mechanical tests, interfacial transition zone microscopical tests and thermal conductivity test were carried out on the specimens of different concretes and compared with control normal-weight aggregate concretes. The test results showed that the effect of mixing water absorption by LWA with different moisture states was reflected in the fresh concrete as the loss of mixture workability, while in the hardened concrete as the increase of its strength. With the use of oven-dried LWA, the effect of reduction of water-cement ratio was more significant, and thus the microstructure of the ITZ was more compact.

A Study on Stress-Strain Characteristics of Compacted Bentonite for High-Level Radioactive Waste Repository (고준위폐기물 차폐용 압축벤토나이트의 응력-변형률 거동 분석)

  • Kim, Do-Hyun;Jeong, Sang-Seom
    • Proceedings of the Korean Geotechical Society Conference
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    • 2009.03a
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    • pp.792-797
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    • 2009
  • The stress-strain characteristics of compacted bentonite are investigated using experimental triaxial compression test by Hoek-cell. Special attention given to various dry density and water absorption ratio. Based on the test results, it is shown that the stress-strain relationship of compacted bentonite is highly influenced by dry density and water absorption ratio. Also, characteristics of Bentonite is similar to the clay rather than sand. Strength of compressed Bentonite increases with higher dry density. It shows maximum strength value, if in a same condition with dry density and constrain pressure. So we determine that value as the optimistic moisture contents for the maximun strength of compressed Bentonite.

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Thermal stabilityof fluorine doped silicon oxide films

  • Lee, Seog-Heong;Yoo, Jae-Yoon;Park, Jong-Wan
    • Journal of Korean Vacuum Science & Technology
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    • v.2 no.1
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    • pp.25-31
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    • 1998
  • The reliability of fluorine doped silicon oxide (SiOF) films for intermetal dielectrics in multilevel interconnections of ultra-large scale integrated circuits (ULSIs) is investigated. SiOF films were deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECRPECVD) using H-free source gases, i.e., SiF4 and O2. The effect of post plasma treatment on the moisture absorption and dielectric properties of SiOF films was carried out I terms of air exposure time, The reliability test of Cu/TiN/SiOF/Fi specimen was carried out in terms of temperature by rapid thermal annealing (RTA) in N2 ambient. After O2 plasma treatment,, no appreciable peak directly related to moisture absorption was detected. The capacitance-voltage (C-V) characteristics of the O2 plasma treated SiOF film showed that the film remained to hold the sound dielectric properties even after boiling treatment. The Cu/TiN/SiOF/Si system was found to be reliable up to $600^{\circ}C$.

SYNERGISTIC SKIN PROPERTY INTERACTIONS BETWEEN ALPHA HYDROXY ACID AND SKIN MOISTURIZER IN A HAND DISHWASHING DETERGENT

  • Brumbaugh, E.H.;Sigler, M.L.;Casterton, P.L.;Dornoff, M.
    • Proceedings of the SCSK Conference
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    • 2003.09a
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    • pp.491-497
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    • 2003
  • The use of both an Alpha Hydroxy Acid, Citric Acid, and a Skin Moisturizer, Glycereth-26, formulated into a hand dishwashing detergent have been shown to be synergistic in their effects on certain skin health parameters. Each ingredient was evaluated alone and together in a hand dishwashing detergent via a 9-week use test. Panelists washed dishes using the sponge method commonly used in Asian markets and a 1:7 dilution of the concentrated dish detergent. Panelist's hands were evaluated initially and at 3-week intervals for nine weeks. After nine weeks panelist's hands showed significant improvements in Moisture Absorption and Transepidermal Water Loss (TEWL). A synergistic effect on TEWL was found between the AHA and the Moisturizer. These effects, showing an improvement in the condition of the panelist's skin are impressive, particularly since they were observed from a dishwashing product that is highly diluted and at near neutral pH during the washing process.

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SYNERGISTIC SKIN PROPERTY INTERACTIONS BETWEEN ALPHA HYDROXY ACID AND SKIN MOISTURIZER IN A HAND DISHWASHING DETERGENT

  • Brumbaugh, E.H.;Sigler, M.L.;Casterton, P.L.;Dornoff, J.M.
    • Proceedings of the SCSK Conference
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    • 2003.09b
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    • pp.417-423
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    • 2003
  • The use of both an Alpha Hydroxy Acid, Citric Acid, and a Skin Moisturizer, Glycereth-26, formulated into a hand dishwashing detergent have been shown to be synergistic in their effects on certain skin health parameters. Each ingredient was evaluated alone and together in a hand dishwashing detergent via a 9-week use test. Panelists washed dishes using the sponge method commonly used in Asian markets and a 1:7 dilution of the concentrated dish detergent. Panelist's hands were evaluated initially and at 3-week intervals for nine weeks. After nine weeks panelist's hands showed significant improvements in Moisture Absorption and Transepidermal Water Loss (TEWL). A synergistic effect on TEWL was found between the AHA and the Moisturizer. These effects, showing an improvement in the condition of the panelist's skin are impressive, particularly since they were observed from a dishwashing product that is highly diluted and at near neutral pH during the washing process.

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Moistureproof Characteristics of Woodboard Types with Surface Thermal Changes (목질 보드류의 표면 열변화에 따른 접촉각(방습) 특성)

  • Shin, Sang-Ho;Liim, Nam-Gi
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2020.11a
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    • pp.161-162
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    • 2020
  • In this study, as part of securing related data, water droplets were dropped on the upper part of the wooden board for flooring in an environment such as floor heating, and the degree of absorption according to the surface temperature change was tested. The test results showed that the contact angle of the surface was low (25℃→40℃) or the droplet was absorbed into the small plate and disappeared. The contact angle of the OSB and MDF was decreased within 30 minutes, but the surface water droplet was maintained longer than the plywood. This is because the surface is coated with hydrophobicity unlike the plywood, but moisture absorption in the cross section after the second processing will not be prevented and it will lead to defect occurrence problem.

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