• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.05a
• /
• pp.214-218
• /
• 2002

So far, many kinds of researches on the ceramic chip components and MCM-C RF module especially on the 3-dimensional ceramic module using embedded passives have been performed. LTCC system has many kinds of advantages, like low lass, low cost of process, stability of process etc.. But it's so hard to adjust the characteristics of passives in ceramic module after fabrication. So the exact prediction of behavior of components in high frequency region upper than 2 GHz must be made. In this procedure, the exact measurement is need. In this study, many kinds of measurement Jigs are compared and optimized, and measurement methods of each parameter are designed.

• Proceedings of the KIEE Conference
• /
• 2005.07c
• /
• pp.2025-2027
• /
• 2005

Thermal conductive polymer film was adopted to reduce the fracture of module during the fabrication of thermoelectric generator. We investigated the thermoelectric output power of module with the change of thickness of polymer film, direct contact and thermal-conductive grease. It is measured that thermoelectric output power is decreased with the increasing thickness of thermal-conductive polymer film. And

• Journal of Sensor Science and Technology
• /
• v.24 no.2
• /
• pp.88-92
• /
• 2015

In order to study the semi-conductive characteristics of carbon black-filled ethylene-propylene-diene monomer (EPDM) composite film, which is used for measuring occlusal force, composite samples with volume ratios of carbon black to EPDM ranging from 30% to 70% were prepared. The process of making a composite film consists of two steps, which involve the preparation of a slurry composition and the fabrication of a thin film using solution casting and a lamination process. To prepare the slurry composition, we dispersed carbon black nanoparticles into an organic solvent before mixing with an EPDM solution in toluene. The mechanical and electrical properties of the resulting carbon black-filled EPDM film were then investigated, and the results showed that the electrical resistance of a film decreases with the increase in the carbon black content. Furthermore, improved elastic recovery was observed after cross-linking the EPDM.

• Laser Solutions
• /
• v.11 no.2
• /
• pp.33-38
• /
• 2008

Laser micromachining has increasingly been adopted in various advanced industries where the high-precision machining of large-area, high-density and multi-layered components is in a strong demand. To effectively meet the requirements, the laser micromachining process must be carefully monitored. In order to facilitate the development of a new laser micromachining process and/or a new system, we have fabricated a UV laser micromachining platform that is equipped with optical modules for monitoring the process online. They include a laser power stabilizing module, a module for laser-induced breakdown spectroscopy, and an auto-focusing module.

• ETRI Journal
• /
• v.41 no.2
• /
• pp.262-269
• /
• 2019

This paper introduces a low-cost, high-performance mmWave antenna array module at 77 GHz. Conventional waveguide transitions have been replaced by 3D CPW-microstrip transitions which are much simpler to realize. They are compatible with low-cost substrate fabrication processes, allowing easy integration of ICs in 3D multi-chip modules. An antenna array is designed and implemented using multilayer coupled-fed patch antenna technology. The proposed $16{\times}16$ array antenna has a fractional bandwidth of 8.4% (6.5 GHz) and a 23.6-dBi realized gain at 77 GHz.

• Proceedings of the KIEE Conference
• /
• 1999.07d
• /
• pp.1895-1897
• /
• 1999

This paper describes the fabrication and performance characterizations of the CIGS$(CuInGaSe_2)$ solar cells and its prototype module. The CIGS cell and module were fabricated on the sodalime glass$(5\times5cm^2)$ by the well known three stage co-evaporation and series connection followed by patterning process. respectively. The developed minimodule with active area of $14.7cm^2$ showed 6.0% solar efficiency($V_{oc}$=3.2V, $I_{sc}$=79.8mA, FF=34.6%) in AM 1.5 condition.

• Journal of Electrical Engineering and Technology
• /
• v.3 no.2
• /
• pp.271-275
• /
• 2008

The MAM(Megasonic Agitated Module) has been fabricated for improving the characteristics of wet etching. The characteristics of the MAM are investigated during the wet etching with and without megasonic agitation in this paper. The adoption of the MAM has improved the characteristics of wet etching, such as the etch rate, etch uniformity, and surface roughness. Especially, the etching uniformity on the entire wafer was less than ${\pm}1%$ in both cases of Si and glass. Generally, the initial root-mean-square roughness($R_{rms}$) of the single crystal silicon was 0.23nm. Roughnesses of 566nm and 66nm have been achieved with magnetic stirring and ultrasonic agitation, respectively, by some researchers. In this paper, the roughness of the etched Si surface is less than 60 nm. Wet etching of silicon with megasonic agitation can maintain nearly the original surface roughness during etching. The results verified that megasonic agitation is an effective way to improve etching characteristics of the etch rate, etch uniformity, and surface roughness and that the developed micromachining system is suitable for the fabrication of devices with complex structures.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.19 no.3
• /
• pp.209-215
• /
• 2006

This paper was proposed Intelligent and wireless USN/RFID module system that can overcome disadvantage of existing RFID system with no sensing module and wire communication. The proposed USN/RFID system was designed and fabricated. After fabricating new system, we analyzed the characteristics of USN/RFID module. After design VCO block that is point circuit to develop next generation system one chip of RFID system, we were carried out simulation and verified the validity. this paper was showed that VCO system was enough usable in wireless network module. USN/RFID Reader module shows superior result that validity awareness distance corresponds to 30 M in the case of USN and to 5 M in RFID Reader's case and 900 MHz of commercial frequency does practical use enoughly in range of high frequency. The USN/RFID Reader module is considered to act big role to Ubiqitous industry offering computing surrounding of new concept that is intelligence type service and that was associated to real time location system(RTLS), environment improvement/supervision, national defense, traffic administration etc.

• Korean Journal of Construction Engineering and Management
• /
• v.23 no.5
• /
• pp.98-107
• /
• 2022

The purpose of this study is to suggest a model for evaluation of a risk based value index for modular design alternatives in plant construction projects. Accordingly, 1) Setting the basic project cost and the scope to apply the module, 2) Evaluating the importance, easiness, and effectiveness index for Engineering, Procurement, Fabrication, transportation, and construction work, 3) Estimating the total project cost by analyzing the risk reserve Step, 4) Comparing the effectiveness index and total project cost for each modular design alternative, it was composed of the steps of deriving RVI. To verify such a model, Plan-A, which applied a module to one process, and Plan-B, which applied a module to three processes, were composed to evaluate RVI.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.05a
• /
• pp.79-83
• /
• 2007

We have developed a compact and cost-effective camera module on the basis of wafer-scale replication technology. A multiple-layered structure of several aspheric lenses in a mobile camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. We have demonstrated a VGA camera module fabricated by the wafer-scale replication processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 200 um sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile camera modules.