• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.9
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• Journal of Korean Institute of Industrial Engineers
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• v.43 no.3
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• pp.229-237
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• 2017

Presented in this paper is a case study of constructing a smart factory for aircraft parts. The construction procedure involves four phases. First of all, its management goals are set, and layout design and simulation are carried out in the conceptual design phase. In the detail design phase, operating scenarios for each module are written out, and probable risks are analyzed by expert groups, and then requirements for developing equipments and subsystems are determined with consideration for element technologies and their integration schemes into the smart factory. In the fabrication and installation phase, system development, equipment fabrication and installation are proceeded in a separate manner, and then integrated together subsequently. In the operation and improvement phase, the factory is stabilized, sophisticated and improved constantly during real operation.

• Steel and Composite Structures
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• v.9 no.3
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• pp.239-253
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• 2009

This paper reviews the concept of tensegrity structures and proposes a new type of dismountable steel tensegrity grids for possible deployment as light-weight roof structures. It covers the fabrication of the prototype structures followed by their instrumentation, destructive testing and numerical analysis. First, a single module, measuring $1m{\times}1m$ in size, is fabricated based on half-cuboctahedron configuration using galvanised iron (GI) pipes as struts and high tensile stranded cables as tensile elements. Detailed instrumentation of the structure is carried out right at the fabrication stage. The structure is thereafter subjected to destructive test during which the strain and the displacement responses are carefully monitored. The structure is modelled and analyzed using finite element method (FEM) and the model generated is updated with the experimental results. The investigations are then extended to a $2{\times}2$ grid, measuring $2m{\times}2m$ in size, fabricated uniquely by the cohesive integration of four single tensegrity modules. After updating and validating on the $2{\times}2$ grid, the finite element model is extended to a $8{\times}8$ grid (consisting of 64 units and measuring $8m{\times}8m$) whose behaviour is studied in detail for various load combinations expected to act on the structure. The results demonstrate that the proposed tensegrity grid structures are not only dismountable but also exhibit satisfactory behaviour from strength and serviceability point of view.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.362-367
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• 2012

Though a micro pump is a crucial element in miniaturized bio-fluidic systems or drug delivery systems, most of the conventional micro pumps still have some limitations to miniaturize their controller system and to obtain the sufficient back pressure which can rise over the inner pressure of human body or experimental animals. In this paper, to overcome these limitation, a new PZT disc and its controller were designed and fabricated to get the sufficient flowrate and the back pressure with guaranteeing embeddability of the controller into pumping body. The amplitudes of the disc deflections were as large as 40 ${\mu}m$ at 200 V - 100 Hz condition. As results of experiments, the flow rate and the back pressure increase when the frequency increases. The obtainable maximum flow rate and back pressure are 5.2 ml/min at 95 Hz and 13.14 kPa at 90 Hz respectively.

• Transactions of Materials Processing
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• v.19 no.5
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• pp.283-289
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• 2010

Extrusion process in the bulk material for fabrication of miniature helical gears has problems such as a high forming load and short tool life because the cross-section is complex and asymmetry. To overcome these problems, in this study, miniature helical gears were fabricated by Zn-22Al powder hot extrusion. The included die angle for minimum extrusion load and improving die filling was determined by FE-simulation. The Zn-22Al spheroidal powder produced by gasatomization were compacted and sintered for extrusion experiment. The dimension of helical-gear is 0.3mm in module, 3.35mm in pitch diameter, $15^{\circ}$ in helix angle and the number of teeth is 12. All of the extrusion experiments were performed with internal helical gear die which was machined by precision electric discharge machining using the electrode. The experiment was conducted at $190^{\circ}C$ to $310^{\circ}C$ to obtain extrusive and mechanical properties. The extruded helical gears were analyzed through extrusion load, Vickers hardness and SEM images for each extrusion temperature. The powder hot extrusion process was successfully applied to fabricate a miniature helical gear.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05b
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• pp.96-100
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• 2004

This paper shows the design, fabrication and performance of oscillator appled to 5.5GHz RF module for local wireless communication system. Super low noise HJ FET of NE3210S01 is used to obtain a good phase noise Performance. The design Parameters for the optimum operating performance are simulated with ADS simulation. The measured out Power is 10 ㏈m at 5.5GHz, the second harmonic suppression -31 ㏈c, and the phase noise characteristics -98.83 ㏈c at 100KHz offset frequency, respectively. This implemented oscillator is available to local wireless Communication system.

• Proceedings of the KIPE Conference
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• 2012.07a
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• pp.289-290
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• 2012

This paper proposes a new active snubber boost PFC converter to provide a zero-voltage-switching (ZVS) turn-on condition and reduce electromagnetic interference (EMI) noise in home appliances and renewable energy applications, including solar or fuel cell electric systems. The proposed active snubber circuit enables a main boost switch of the boost-type PFC or grid converter to turn on under a ZVS condition and reduce the switching losses of the main boost switch. Moreover, for the purpose of a specialized intelligent power module (IPM) fabrication, the proposed boost circuit is designed to satisfy some design aspects such as space saving, low cost, and easy fabrication. Simulation and experimental results of a 2kW IPM boost-type PFC converter are provided to verify the effectiveness of the proposed active snubber boost circuit.

• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.105-111
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• 2006

A novel image quality evaluation method, which is based on combination of the rigorous grating diffraction theory and the ray-optic method, is proposed. It is applied for design optimization and, tolerance analysis of optical imaging systems implementing diffractive optical elements (DOE). The evaluation method can predict the quality and resolution of the image on the image sensor plane through the optical imaging system. Especially, we can simulate the effect of diffraction efficiencies of DOE in the camera lenses module, which is very effective for predicting different color sense and MTF performance. Using this method, we can effectively determine the fabrication tolerances of diffractive and refractive optical elements such as the variations' in profile thickness, and the shoulder of the DOE, as well as conventional parameters such as decenter and tilt in optical-surface alignments. A DOE-based 2M-resolution camera lens module designed by the optimization process based on the proposed image quality evaluation method shows ${\sim}15%$ MTF improvement compared with a design without such an optimization.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.3
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• pp.12-24
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• 2001

The key advantage of LTCC(low temperature co-fired ceramics) technology is the ability to integrate passive components such as resistors, capacitors, and inductors. More compact circuits with an increased scale of integration are needed with the development for advanced telecommunication system such as IMT-2000. LTCC technology can be obtained by removing these elements from the substrate surface to inside of ceramic body. And it can miniaturize the wireless phone through integration of planar patch antenna, duplexer, band pass filter, bias line, circuit of impedance matching and RF choke etc. Futhermore, with the multilayer chip process and its outstanding electrical material characteristics, LTCC is predestined for highly-integrated, cost effective wide band applications. This paper focuses on the general description of LTCC MCM technologies and the fabrication of the multilayer VCO module.

• Journal of Sensor Science and Technology
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• v.19 no.2
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• pp.149-154
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• 2010

Top of the alumina body which is made according to plan has been printed using a screen printer equipment in order to print an electrode pattern. The electrode is connected with the quartz crystal oscillator of the piezoelectricity method which has a piezoelectric characteristic. The pressure contact department has been experimented using three type of the teflon. The teflon is good for pressure delivery vector but it is bad restitution. So we devised the structure which inserts the metal in the teflon. Bottom of the module is connected with the signal processing department which is planned in advance and then has investigated to characteristic. Therefore we have got the best output-voltage and frequency characteristic follows in the pressure.