• Title/Summary/Keyword: module fabrication

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Transceiver Module for W-band Compact Radar (W-band 초소형 레이다용 송수신모듈)

  • Kim, Young-Gon;An, Se-Hwan;Park, Chang-Hyun;Kwon, Jun-Beom;Song, Sun-Ki;Yong, Myung-Hun
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.18 no.2
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    • pp.27-32
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    • 2018
  • In this paper, W-band transceiver module for compact radar has been designed and fabricated. Utilizing proposed microstrip-to-waveguide transition, the error between design and implementation is reduced. The proposed transition provides less than 1 dB insertion loss per transition and reliability for fabrication. In order to apply compact radar with dual-polarized monopulse directly, W-band transmitter with 28 dBm output power is designed and developed. Also, 6 channels of receiver module with low noise figure 13.5 dB and maximum 17 dBm input P1dB is developed. Proposed W-band transceiver module is expected compact radar application for dual-polarized monopulse signal processing system.

Laser patterning process for a-Si:H single junction module fabrication (레이저 가공에 의한 비정질 실리콘 박막 태양전지 모듈 제조)

  • Lee, Hae-Seok;Eo, Young-Joo;Lee, Heon-Min;Lee, Don-Hee
    • 한국신재생에너지학회:학술대회논문집
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    • 2007.11a
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    • pp.281-284
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    • 2007
  • Recently, we have developed p-i-n a-Si:H single junction thin film solar cells with RF (13.56MHz) plasma enhanced chemical vapor deposition (PECVD) system, and also successfully fabricated the mini modules ($>300cm^2$), using the laser patterning technique to form an integrated series connection. The efficiency of a mini module was 7.4% ($Area=305cm^2$, Isc=0.25A, Voc=14.74V, FF=62%). To fabricate large area modules, it is important to optimise the integrated series connection, without damaging the cell. We have newly installed the laser patterning equipment that consists of two different lasers, $SHG-YVO_4$ (${\lambda}=0.532{\mu}m$) and YAG (${\lambda}=1.064{\mu}m$). The mini-modules are formed through several scribed lines such as pattern-l (front TCO), pattern-2 (PV layers) and pattern-3 (BR/back contact). However, in the case of pattern-3, a high-energy part of laser shot damaged the textured surface of the front TCO, so that the resistance between the each cells decreases due to an incomplete isolation. In this study, the re-deposition of SnOx from the front TCO, Zn (BR layer) and Al (back contact) on the sidewalls of pattern-3 scribed lines was observed. Moreover, re-crystallization of a-Si:H layers due to thermal damage by laser patterning was evaluated. These cause an increase of a leakage current, result in a low efficiency of module. To optimize a-Si:H single junction thin film modules, a laser beam profile was changed, and its effect on isolation of scribed lines is discussed in this paper.

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Characteristics of Embedded R, L, C Fabricated by Using LTCC-M Technology and Development of a PAM for LMR thereby (LTCC-M 기술을 이용한 내부실장 R, L, C 수동소자의 특징 및 LMR용 PAM개발)

  • 김인태;박성대;강현규;공선식;박윤휘;문제도
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.1
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    • pp.13-18
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    • 2000
  • Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.

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A Study on the Fabrication of 1W Power Amplifier for IMT2000 Repeater Using Nonlinear Analysis (비선형 해석법을 이용한 IMT2000 중계기용 1W 전력증폭기 제작 연구)

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    • Journal of the Institute of Electronics Engineers of Korea TE
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    • v.37 no.2
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    • pp.83-90
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    • 2000
  • A simple low-cost and small size 1.88-198 GHz Band RF power amplifier module is developed for IMT2000 repeater. The power amplifier consists of two stage amplifiers that the first stage amplifier is drive amplifier using discrete type P-HEMT (ATF-34143, 800 micron gate width, Agilent Technologies) and the second is power amplifier with 300Bm 1dB gain compression point using GaAs FET(EFA240D-SOT89, 2400 micron gate width, Excelics Semiconductor). this power amplifier module feature a 29.5dBm 1dB gain compression point, 29.5dB gain, 42dBm 3rd order intercept point(OIP3) and -10dB/-l2dB input/output return loss over the 1880-1980 MHz. This PA module is fully integrated using MIC technology into a small size and design by full nonlinear design technologies. The dimensions of this PA module are 42(L) $\times$ 34(W) mm.

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Design and Fabrication of the Ka-Band Receive Module for Millimeter Wave Seeker (밀리미터파 탐색기를 위한 Ka-대역 수신기 모듈의 설계 및 제작)

  • Yang, Seong-Sik;Lim, Ju-Hyun;Song, Sung-Chan
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.49 no.1
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    • pp.78-84
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    • 2012
  • In this paper, we introduced the design technique about a Ka band receive module for millimeter wave seekers. The receiver module consists of a waveguide, circulator and transition for antenna connection, and a limiter and gain control amplifier for receiver protection. This module is comprised of a sum, azimuth and elevation channel for receiving monopules signal, and a SLB channel for the acquisition of jamming signal. In this paper, receiver gain and range of gain control dependent on ADC nonlinear characteristic was analyzed and designed for wide dynamic range receive. In the test result of the fabricated Ka-band receive, the frequency band is 1 GHz, the noise figure is as low as 8.2 dB, the gain is $56{\pm}2dB$, the dynamic range is 135 dB, the gain congtrol is more than 86 dB, the channel isolation is more than 35 dB.

A Study on the Fabrication and Characteristics of Snow Removal PV Module & System using Heating Film (발열 필름을 이용한 제설 기능 PV module & system 제작 및 특성평가)

  • Park, Eun Bee;Cho, Geun Yuoung;Cho, Sung Bae;Kim, Hyun Jun;Yu, Jeong Jae;Park, Chi Hong
    • Current Photovoltaic Research
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    • v.4 no.4
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    • pp.159-163
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    • 2016
  • Piled snow upon PV module interferes with Photoelectric Effect process through photovoltaic directly. As a result of this phenomenon, its generation efficiencies keep decreasing or are stuck at zero power generating status. In addition, PV facilities have been installed on those places such as water surface, roof-top, and other isolated places, dealing with conditions of "Securing high REC weighted value", "Difficulty of securing land" and so forth. Through this study, we are able to actualize the function of heating over PV modules when it snows. We adopted laminating method through heating film and modules, guaranteeing warranty more than for 25 years. Also we are trying remote control systemically, not by hardware control, to run parallel with automatic driving and monitoring system which enable to control operation time, insolation, amount of snowfall automatically. We applied analysis of actual proof to both snow removal PV system and general PV power system, and these led to bear power consumption analysis while snow-removing, and its comparison after finishing the task as "One stone, two birds." In the long run, we could carry out economic analysis against snow removal system, and this helps to verify the most maximized control method for snow removal conditons on a basis of weather information. this study shall let prevent people from negligent accidents, and improve power generation problems as mentioned from the top. Ultimately, we expect to apply this system to heavy snowfall regions in winter season in spite of its limited system installaion in Korean territory, initially.

Fabrication of 365 nm Wavelength High Transmittance Silicone Resin TIR Lens and High Directivity Light Source Module for Exposure System (365 nm 파장대역 고투과율 실리콘 수지 TIR 렌즈 및 고지향성 노광기 광원모듈 제작)

  • Sung, Jun Ho;Yu, Soon Jae;Anil, Kawan;Jung, Mee Suk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.4
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    • pp.267-271
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    • 2018
  • A high directivity TIR (total internal reflection) lens in the UV-A region was designed using a silicone resin, and a UV light source module with a maximum irradiation density of $150mW/cm^2$ was fabricated. The beam angle of the TIR lens was designed to be $8.04^{\circ}$ and the maximum diameter of the TIR lens was Ø13.5. A silicone resin having a UV transmittance of 93% and a refractive index of 1.4 at a wavelength of 365 nm was used, and the lens was manufactured using an aluminum mold, from which silicone could be easily released. The module was fabricated in a metal printed circuit board of COB (chip on board) type using a $0.75{\times}0.75mm^2$ UV chip. A jig was used to adjust the focal length between lens and chip and to fix the position of the lens. The optical characteristics such as illumination distributions of the lens and module were designed using 'LightTools' optical simulation software. The heat dissipation system was designed to use a forced-air cooling method using a heat-sink and fan.

Types & Characteristics of Chemical Substances used in the LCD Panel Manufacturing Process (LCD 제조공정에서 사용되는 화학물질의 종류 및 특성)

  • Park, Seung-Hyun;Park, Hae Dong;Ro, Jiwon
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.29 no.3
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    • pp.310-321
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    • 2019
  • Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.

A Design and Fabrication of the X-Band Transmit/Receive Module for Active Phased Array SAR Antennas (능동 위상 배열 SAR 안테나를 위한 X-대역 송수신 모듈의 설계 및 제작)

  • Chong, Min-Kil;Kim, Sang-Keun;Na, Hyung-Gi;Lee, Jong-Hwan;Yi, Dong-Woo;Baik, Seung-Hun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.10
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    • pp.1050-1060
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    • 2009
  • In this paper, a X-Band T/R-module for SAR(Synthetic Aperture Radar) systems based on active phased array antennas is designed and fabricated. The T/R modules have a and width of more than 800 MHz centered at X-Band and support dual, switched polarizations. The output power of the module is 7 watts over a wide bandwidth. The noise figure is as low as 3.9 dB. Phase and amplitude are controlled by a 6-bit phase shifter and a 6-bit digital attenuator, respectively. Further the fabricated T/R module has est and calibration port with directional coupler and power divider. Highly integrated T/R module is achieved by using LTCC(Low Temperature Co-fired Ceramic) multiple layer substrate. RMS gain error is less than 0.8 dB max. in Rx mode, and RMS phase error is less than $4^{\circ}$ max. in Rx/Tx phase under all operating frequency band, or the T/R module meet the required electrical performance m test. This structure an be applied to active phase array SAR Antennas.

Display 특성 향상을 위한 MLA 광소자 개발 연구

  • Jeong, Han-Uk;Kim, Gwang-Yeol;Lee, Gong-Su;Sin, Seong-Uk;Park, Hong-Jin;Choe, Byeong-Deok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.199-199
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    • 2009
  • Recently, polymeric microlens arrays have become important elements in many applications. Microlens arrays have been used to enhance luminance efficiency and luminance power efficiency of light-emitting diodes (LEDs) and organic LEDs. Many processes for fabrication of microlens array are studied. Though the MLA has been fabricated by electroformed mold, LIGA process and reflow method, these methods were required masks, multiple process steps and post processing. In this paper, we proposed rapid and direct UV laser direct fabrication process using colorless liquid photopolymer, NOA60 for polarization activated microlens. The microlens arrays are formed on the NOA60 on glass, after the focused laser energy was irradiated to the material. The diameter of MLA was varied from 42 to 88 ${\mu}m$, and the height from 0.9 to 1.6 ${\mu}m$. The MLA fabricated using NOA60 shows more then 85% transmittance as well as good hardness for optical module.

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