• Journal of Korean Institute of Industrial Engineers
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• v.28 no.4
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• pp.415-424
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• 2002

Semiconductor manufacturing has been emerged as a highly competitive but profitable business. Accordingly it becomes very important for semiconductor manufacturing companies to meet customer demands at the right time, in order to keep the leading edge in the world market. However, due-date oriented production is very difficult task because of the complex job flows with highly resource conflicts in fabrication shop called FAB. Due to its cyclic manufacturing feature of products, to be completed, a semiconductor product is processed repeatedly as many times as the number of the product manufacturing cycles in FAB, and FAB processes of individual manufacturing cycles are composed with similar but not identical unit processes. In this paper, we propose a production scheduling and control scheme that is designed specifically for semiconductor scheduling environment (FAB). The proposed scheme consists of three modules: simulation module, cycle due-date estimation module, and dispatching module. The fundamental idea of the scheduler is to introduce the due-date for each cycle of job, with which the complex job flows in FAB can be controlled through a simple scheduling rule such as the minimum slack rule, such that the customer due-dates are maximally satisfied. Through detailed simulation, the performance of a cycle due-date based scheduler has been verified.

• Journal of IKEEE
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• v.7 no.2 s.13
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• pp.230-235
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• 2003

A small and integrated MMIC VCO(Voltage Controlled Oscillator) at Ka-band has been developed. This oscillator was designed as Clapp-Gouriet type scheme, fabricated, and implemented on the carrier. This was connected to an alumna substrate on the carrier providing output port for module, utilizing ribbon and wire bonding technique allowing the loss of 0.2dB. This VCO module showed the excellent performance.

• Current Photovoltaic Research
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• v.7 no.2
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• pp.51-54
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• 2019

The high density module (HDM) has advantages for its larger active area and smaller current density. This new way of making a photovoltaic (PV) module method has benefit for increasing module power with the same installed area. Because HDM consisted with serially connected PV strings, loss of strings during the fabrication process can increase the overall production cost.1-2 This study investigates the rework conditions of the shingled strings with electrically conductive adhesives (ECA). By heating the electrically connected area of a fabricated string, cured area become soft and a string can be detached for the rework process. After rework process, a refabricated string showed 5~10% increased output power compared to before rework process and reached to the 90~95% output power compare to the undamaged strings.

• Journal of IKEEE
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• v.25 no.1
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• pp.69-75
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• 2021

In this work, we consider the fabrication method and electrical characteristics of dye-sensitized solar cells (DSSCs), which use titanium (Ti) metal thin films to replace expensive fluorine tin oxide (FTO) electrodes. The thickness of the Ti thin film was changed by adjusting the deposition time of the Ti, and the surface resistance decreased as the thickness of the Ti thin film became thicker. The thickness of the Ti thin film was shown to be similar to the surface resistance of the FTO thin film at approximately 190nm and the DSSC with a thickness of approximately 250nm showed the highest energy conversion efficiency of 4.24%. Furthermore, the possibility of commercialization was confirmed by fabricating and evaluating the DSSC module.

• Journal of IKEEE
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• v.25 no.4
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• pp.703-709
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• 2021

As drone technology advances, the risks of drones are increasing, then technology to detect drones is becoming important. In this thesis, it was verified that miniaturized and lightweighted active array antenna could be used for radar system to detect drones in reality. The transmit-receive module was designed in the form of tile-type to simplify interconnections between devices. The waveform generation module and the down conversion module were miniaturized to include in one body too. As a result of verifing the detection performance through test, it was confirmed that the detection range was over 3.7Km.

• Current Photovoltaic Research
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• v.11 no.2
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• pp.54-57
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• 2023

Recently, requirements for improving the convenience of constructing BIPV (Building Integrated Photo Voltaic) modules had increased. To solve this problem, we fabricated shingled PV modules integrated with bent steel plates for building integrated photovoltaics. These PV modules could be constructed directly on the roof without the installation structure. We found optimal lamination conditions with supporting structures to fabricate a module on a bent steel plate. Moreover, we applied a shingled design to PV modules integrated with bent steel plates to achieve a high electrical output power. The shingled module with bent steel plates shows 142.80 W of solar-to-power conversion in 0.785 m² area.

• International Journal of Naval Architecture and Ocean Engineering
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• v.1 no.2
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• pp.78-88
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• 2009

In shipbuilding industry, the manufacturing technology has advanced at an unprecedented pace for the last decade. As a result, many automatic systems for cutting, welding, etc. have been developed and employed in the manufacturing process and accordingly the productivity has been increased drastically. Despite such improvement in the manufacturing technology, however, development of an automatic system for fabricating a curved hull plate remains at the beginning stage since hardware and software for the automation of the curved hull fabrication process should be developed differently depending on the dimensions of plates, forming methods and manufacturing processes of each shipyard. To deal with this problem, it is necessary to create a "plug-in" framework, which can adopt various kinds of hardware and software to construct a full automatic fabrication system. In this paper, a framework for automatic fabrication of curved hull plates is proposed, which consists of four components and related software. In particular the software module for computing fabrication information is developed by using the ooCBD development methodology, which can interface with other hardware and software with minimum effort. Examples of the proposed framework applied to medium and large shipyards are presented.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.583-586
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• 2005

In this paper, millimeter-wave monolithic integrated circuit (MIMIC) low noise amplifier (LNA) for V-band, which is applicable to 58 GHz, we designed and fabricated. We fabricated the module using the fabricated LNA chips. The V-band MIMIC LNA was fabricated using the high performance $0.1\;{\mu}\;m$ ${\Gamma}-gate$ pseudomorphic high electron mobility transistor (PHEMT). The MIMIC LNA was designed using active and passive device library, which is composed $0.1\;{\mu}\;m$ ${\Gamma}-gate$ PHEMT and coplanar waveguide (CPW) technology. The designed V-band MIMIC LNA was fabricated using integrated unit processes of active and passive device. Also we fabricated CPW-to-waveguide fin-line transition of WR-15 type for module. The Transmission Line was fabricated using RT Duroid 5880 substrate. The measured results of V-band MIMIC LNA and Module are shown $S_{21}$ gain of 13.1 dB and 8.3 dB at 58 GHz, respectively. The fabricated LNA chip and Module in this work show a good noise figure of 3.6 dB and 5.6 dB at 58 GHz, respectively.

• Current Photovoltaic Research
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• v.7 no.4
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• pp.111-120
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• 2019

The output power of a crystalline silicon (c-Si) photovoltaic (PV) module is not directly the sum of the powers of its unit cells. There are several losses and gain mechanisms that reduce the total output power when solar cells are encapsulated into solar modules. Theses factors are getting high attention as the high cell efficiency achievement become more complex and expensive. More research works are involved to minimize the "cell-to-module" (CTM) loss. Our paper is aimed to focus on electrical losses due to interconnection and mismatch loss at PV modules. Research study shows that among all reasons of PV module failure 40.7% fails at interconnection. The mismatch loss in modern PV modules is very low (nearly 0.1%) but still lacks in the approach that determines all the contributing factors in mismatch loss. This review paper is related to study of interconnection loss technologies and key factors contributing to mismatch loss during module fabrication. Also, the improved interconnection technologies, understanding the approaches to mitigate the mismatch loss factors are precisely described here. This research study will give the approach of mitigating the loss and enable improvement in reliability of PV modules.