• Journal of Korea Foundry Society
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• v.42 no.5
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• pp.273-281
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• 2022

In order to understand the solidification behavior and microstructural evolution of the Al-Cu-Si ternary eutectic alloy system, changes of the microstructure of the Al-Cu-Si ternary eutectic alloy with different cooling rates were investigated. When the mold preheating temperature is 500℃, primary Si and Al2Cu dendrites are observed, with (α-Al+Al2Cu) binary eutectic and needle-shaped Si subsequently observed. In addition, even when the mold preheating temperature is 300℃, primary Si and Al2Cu dendrites can be observed, and both (α-Al+Al2Cu+Si) areas observed and areas not observed earlier appear. When the mold preheating temperature is 150℃, bimodal structures of the binary eutectic (α-Al+Al2Cu) and ternary eutectic (α-Al+Al2Cu+Si) are observed. When the preheating temperature of the mold is changed to 500℃, 300℃, and 150℃, the greatest change is in the Si phase, and upon reaching the critical cooling rate, the ternary eutectic of (α-Al+Al2Cu+Si) forms. If the growth of the Si phase is suppressed upon the formation of (α-Al+Al2Cu+Si), the growth of both Al and Cu is also suppressed by a cooperative growth mechanism. As a result of analyzing the Al-27wt%Cu-5wt%Si ternary eutectic alloy with a different alloy design simulation programs, it was confirmed that different results arose depending on the program. A computer simulation of the alloy design is a useful tool to reduce the trial and error process in alloy design, but this effort must be accompanied by a task that increases reliability and allows a comparison to microstructural results derived through actual casting.

• Journal of Powder Materials
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• v.10 no.6
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• pp.406-414
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• 2003

In order to produce good wear resistance powder metallurgy Al-Si alloys with high strength, addition of glass forming elements of Ni and Ce in $Al_{81}$Si$_{19}$ alloy was examined using SEM, TEM, tensile strength and wear testing. The solubility of Si in aluminum increased with increasing Ni and Ce contents for rapidly solidified powders. These bulk alloys consist of a mixed structure in which fine Si particles with a particle size below 500 nm and very fine A1$_3$Ni, A1$_3$Ce compounds with a particle size below 200 nm are homogeneously dispersed in aluminum matrix with a grain size below 600 nm. The tensile strength at room temperature for $Al_{81}$Si$_{19}$, $Al_{78}$Si$_{19}$Ni$_2$Ce$_{0.5}$, and $Al_{76}$Si$_{19}$Ni$_4$Ce$_1$ bulk alloys extruded at 674 K and ratio of 10 : 1 is 281,521, and 668 ㎫ respectively. Especially, $Al_{73}$Si$_{19}$Ni$_{7}$Ce$_1$ bulk alloy had a high tensile strength of 730 ㎫. These bulk alloys are good wear-resistance bel ter than commercial I/M 390-T6. Specially, attactability for counterpart is very little, about 15 times less than that of the I/M 390-T6. The structural refinement by adding glass forming elements such as Ni and Ce to hyper eutectic $Al_{81}$Si$_{19}$ alloy is concluded to be effective as a structural modification method.d.tion method.