• 조명전기설비학회논문지
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• 제24권12호
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• pp.57-63
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• 2010

The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes.

• Journal of Applied Biological Chemistry
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• 제62권2호
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• pp.181-186
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• 2019

본 연구에서는 460 nm 파장의 청색 가시광선을 압출 떡의 표면에 조사하기 위하여 장치의 최적 디자인을 시뮬레이션을 통하여 확인하고 청색광이 압출 떡의 표면에서 식품 위해균인 B. cereus group에 미치는 영향을 확인하였다. LED 장치에서 광원모듈의 세 가지 배열(centered, cross, evenly spaced) 및 광원과 샘플 표면 사이의 거리(22, 32, 42 mm)에 따른 조사 면적에서 빛의 세기 패턴을 시뮬레이션을 통하여 계산하고, Petri factor를 통하여 균일도를 확인하였다. LED 배열의 균일도는 evenly spaced 배열에서 가장 균일한 패턴을 보였으며, 광원과의 거리가 32 및 42 mm일 경우 Petri factor가 0.9 이상으로 높은 균일도를 나타내었다. 떡볶이 떡에 LED 청색광을 조사한 경우 24 h 후 균 수가 초기 균 수에 비하여 감소하였으며, LED를 조사하지 않은 대조군에서는 초기 균 수가 증가하여 1.21 log CFU/g의 차이를 보였다. LED 조사 시 광원과 샘플의 거리가 증가할수록 Petri factor는 증가하나 감균 효과가 낮아지는 결과를 나타내었다. 따라서 Petri factor가 0.9 이상임을 만족하는 evenly spaced 배열의 32 mm 거리가 떡의 유통기한 연장을 위한 LED 장치의 디자인에 적합함을 확인하였다.

• Transactions on Electrical and Electronic Materials
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• 제9권3호
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• pp.110-115
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• 2008

In this paper, we have designated a 42-inch RGB LED BLU, 80 % above illuminance. A desirable brightness performance was attained, by doing anti-parallel configuration, a fitting of LED's strip distance and a height of the top of LED to the back of the LCD. We get the 85.81 % of the brightness uniformity which has 12.8 mm away from LED's top and LCD's back and 51.41 mm of the same spacing between LED's strip in simulation and 82.24 % in experiment.

• 한국진공학회지
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• 제21권4호
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• pp.185-192
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• 2012

Light Emitting Diode (LED) 칩의 크기는 전도를 통한 열의 방출에 있어 면적의 확대로 인한 열 밀도의 감소와 칩의 외부양자효율 변화로 인하여 LED 칩의 p-n 정션 온도와 패키지의 열 저항에 영향을 미친다. 본 연구에서는 16칩 LED 패키지에서 칩의 크기가 0.6 mm와 1 mm인 두 가지 경우에 대하여 순전압(forward voltage)을 측정하였고, 순간열분석법(thermal transient analysis)을 이용하여 정션 온도와 열 저항을 평가하였으며, 이를 LED 칩의 전기적인 특성과 LED 패키지의 구조적인 특성과 연관하여 해석하였다.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.91-101
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• 2017

최근 레이저를 이용하여 전자 소자 및 모듈을 절단하기 위한 많은 연구가 진행되고 있다. 본 연구에서는 레이저를 이용하여 LED 모듈을 초고속 절단하기 위한 기초 연구를 수행하였다. 특히 기존의 다이싱(dicing) saw의 절단 속도를 훨씬 능가하는 100 mm/s의 초고속 레이저 절단의 가능성을 검토하였다. 이를 위하여 LED 모듈의 구성 재료인 copper/ceramic 및 silicone/ceramic 이종 복합 기판을 제작하여 레이저 절단 후, 절단면의 표면 특성, 표면조도, 굽힘 강도를 다이싱 saw를 이용하여 절단한 샘플과 비교하였다. 복합 기판에 대한 최적의 레이저 절단 조건을 찾기 위하여, 세라믹 및 구리 단일 기판의 레이저 절단을 통하여 다양한 레이저 공정 조건들에 대한 영향 검토하였다. 절단면의 표면 특성이 가장 좋은 최적의 레이저 절단 조건은 Ar 보조 가스의 사용, 높은 레이저 파워 및 높은 보조 가스의 압력이었다. Copper/ceramic 및 silicone/ceramic 이종 복합 기판에 대하여 레이저 절단과 다이싱 saw로 절단한 기판의 절단면을 비교한 결과, 레이저로 절단된 기판이 다이싱 saw 절단에 비하여 표면이 거칠고 표면 특성이 약간 나쁘다. 레이저 절단면의 평균 표면조도는 약 $9{\mu}m$ 이며, 다이싱 saw로 절단된 절단면의 표면조도는 약 $4{\mu}m$ 이었다. 그러나 다이싱 절단의 절단 속도(3 mm/s)를 고려하면 레이저 절단면의 표면 morphology가 비교적 균일하고, 표면조도도 다이싱 절단의 경우와 큰 차이가 없기 때문에 어느 정도 만족할 만한 결과를 얻었다고 판단된다. 또한 레이저 절단된 기판의 굽힘 강도가 다이싱으로 절단된 기판의 굽힘 강도보다 동등하거나 약간 열세이었다. 그러나 향후 레이저의 절단 조건이 좀 더 최적화된다면 LED 모듈의 초고속 레이저 절단이 가능할 것으로 판단된다.

• 한국생산제조학회지
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• 제24권2호
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• pp.217-223
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• 2015

In this paper, the performance of a system was analyzed according to the design parameters of a LED secondary lens that can be applied at a very close range, e.g., for direct lighting or display systems. We designed the secondary lens of the very-close-range LED using an aspheric equation and analyzed its performance-particularly the angle of the beam spread, central luminous intensity, and light uniformity-with respect to the thickness of lens, radius, conic constant, and asphericity (4th). Our analysis shows that four parameters affect the performance. The simulation results indicate an optimal thickness of 1 mm and show that a larger radius yields higher performance. The optimal range for the conic constant was determined as -1.21 to -1.25, the optimal range for the asphericity was determined as 0.0047xx to 0.0049xx (4th).

• 한국전기전자재료학회논문지
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• 제28권3호
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• Design & Manufacturing
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• 제11권2호
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• pp.29-36
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• 2017

In this study, the non-contact type bicycle generator system considering the recharge is developed to use the eco-friendly energy source when the bicycle is operating. The following three main factors are considered in this study. One of factors is that the intensity of the rotating magnet is in the range of 2,700~4,300 [Gause]. The next factor is that the separation distance of rotating magnet and bicycle rim is in the range of 1.5-3.0 mm. The last factor is that the pedaling speed is in the range of 55 RPM [Wheel speed 5.6Km]~150 RPM [Wheel speed 15.25Km] consirering with the 5 staged gear transmission. The obtained results are as followed. (1) The generator output voltage gradually increases from 3V to 10V with the pedaling speed increases, at the separation distance is less than 2.5 mm and the operating voltage of the LED lamp is generated at a pedaling speed of 60 RPM or more. (2) The output current of the generator increases from 20mA to 40mA with the pedaling speed increases, at a separation distance is less than 2.0 mm and the operating current of the LED lamp is generated at a pedaling speed of 60 RPM or more. (3) When the separation distance was 3.0 mm, the output voltage and current are significantly lower than those of the bicycle LED lamp is generated. (4) The charging time is expected to be 12.24 ~ 17.65 hours when the magnitude of the magnet is 3,400[Gauss] at a pedaling speed of 55 RPM or more. (5) As a result of this study, it is thought that the non-contact type bicycle generator system considering the recharge can replace the conventional friction power generation system.

• 한국자원식물학회:학술대회논문집
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• 한국자원식물학회 2020년도 추계국제학술대회
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• pp.61-61
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• 2020

This experiment was carried out using artificial bed soil and LED in the plastic film house(irradiation time: 07:00-17:00/day). Seedlings(n=63 per 3.3 m²) of ginseng was planted on May 17, 2018. LED was combined with red and blue light in a 3:1 ratio and irradiated with different light intensity(40-160 µmol/m²/s). Average air temperature from April to September according to the light intensity test was 20.4℃-20.9℃. Average artificial bed soil temperature was 20.1℃-21.7℃. The test area where fluorescent lamp was irradiated tended to be somewhat lower than the LED irradiation area. The chemical properties of the test soil was as follows. pH levels was 6.6-6.7, EC levels 0.9-1.3 dS/m and OM levels 30.6-32.0%. The available P₂O₅ contents was 73.3-302.3 mg/kg. Exchangeable cations K and Ca contents were higher than the allowable ranges and mg content was high in the fluorescent lamp treatment. The photometric characteristics of LED light intensity are as follows. The greater the light intensity, the higher the PPFD(Photosynthetic Photon Flux Density) value, illuminance and solar irradiation. Fluorescent lamp treatment had high illuminance value, but PPFD and solar irradiation were lower than LED intensity 40 µmol/m²/s treatment. The photosynthetic rate increased(2.0-3.8 µmolCO²/m²/s) as the amount of light intensity increased, peaking at 120 µmol/m²/s, and then decreasing. The SPAD (chlorophyll content) value decreased as the amount of light intensity increased, and was the highest at 36.1 in fluorescent lamp treatment. Ginseng germination started on April 5 and took 14-17 days to germinate. The overall germination rate was 68.8-73.6%. The growth of aerial parts(plant height etc.) were generally excellent in the treatment of light intensity of 120-160 µmol/m²/s. The plant height was 41.9 cm, stem length was 24.1 cm, leaf length was 9.8 cm and stem diameter was 5.6 mm. The growth of underground part (root length etc.) was the best in the treatment with 120 µmol/m²/s of light intensity. Due to the root length was long(24.8 cm) and diameter of taproot was thick(18.7 mm), the fresh root weight was the heaviest at 24.8 g. There were no disease incidence such as Alternaria blight, Gray mold and Anthracnose. Disease of Damping-off caused by Rhizoctonia solani occurred 0.6-1.5% and incidence ratio of rusty root ginseng was 30.8-62.3%. It is believed that the reason for the high incidence of rusty root ginseng is that the amount of field moisture capacity of artificial bed soil is larger than the soil. Leaf discoloration rate was 13.7-32.3%.

• 한국전기전자재료학회논문지
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• 제24권3호
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• pp.234-239
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• 2011

In this study, the heat transfer capability have been improved by using via-holes in FR4 PCB, when the LED lighting is designed to solve the thermal problem. The thermal resistance and junction temperature were measured by changing the dimension of FR4 PCB and size of via hole. As a result, when the dimension was increased initially, the thermal resistance and junction temperature was decreased rapidly, the ones was stabilized after the dimension of 200 $[mm^2]$. Also, the light output was improved up to maximum 17% by formation of via-hole and expansion of dimension in FR4 PCB. Therefore, the thermal resistance and junction temperature could be improved by expansion of PCB dimension and configuration of via-hole ability.