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http://dx.doi.org/10.5207/JIEIE.2010.24.12.057

Analysis of Thermal Properties in LED Package by Via hole of FR4 PCB  

Lee, Se-Il (원광대학교 공대 정보통신과)
Lee, Seung-Min (금호전기(주)기술연구소)
Park, Dae-Hee (원광대학교 전기전자 및 정보공학부)
Publication Information
Journal of the Korean Institute of Illuminating and Electrical Installation Engineers / v.24, no.12, 2010 , pp. 57-63 More about this Journal
Abstract
The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes.
Keywords
LED; Thermal Resistance; Junction Temperature; Metal PCB; FR4 PCB; Via-hole;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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