• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.1
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• pp.21-27
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• 1999

In this study, stress intensity factors KI, KII, KIII are existing at the same time to a hollow cylindrical bar of three dimension inclination crack. In order to investigate by experimentally the effect of the inclination angle $\psi$ of crack, artificial inclination cracks in the circumferential direction are put in the surface of a hollow cylindrical bar made by the epoxy-resin. Experimentally, stress analysis methods of stress intensity factors were proposed. But, suitable method are the caustic method and the photoelastic stress freezing method. The mixed mode of KI, and KII, were determined by the photoelastic method of the classical approach method and the FORTRAN language program of the used smallest square method.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.346-351
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded components of dissimilar materials has been proposed and discussed.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.10
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• pp.89-101
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• 1995

선형 탄성 등방성 물체 내에 있는 일반적인 복합모드 크랙 문제들을 해석하기 위한 이중 경계적분방정식의 일반식과 계산해법이 제시되었다. 크랙면이 포함된 물체 해석에 있어서 유일한 해를 얻기 위하여, 한 면상의 점에는 변위 경계적분방정식이 적용되었고 마주하고 있는 상대면 상의 점에는 인력 경계적분방정식이 적용되었다. 인력 및 변위 경계적분방정식의 강특이해 및 초특이해 적분항들은 수치해법을 적용하기 전에 정상화되었다. 정상화과정 중 보정되는 강특이적분항이 상대 크랙면 상의 특이해 요소를 따라 직접 적분되는 것을 격리시키기 위하여, 특이해 적분 경로를 완만한 곡면으로 우회시킨 가상의 비특이해 보조경계로 대치하여 적분값을 계산하였다. 제시된 해법의 정확성과 효율성을 예시하기 위하여, 2차원 및 3차원 크랙 문제의 변형 후 모습과 응력강도계수 계산 결과를 보였다.

• Transactions of the Korean Society of Automotive Engineers
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• v.11 no.4
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• pp.110-116
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded dissimilar materials has been proposed and discussed.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.15 no.3
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• pp.389-398
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• 2002

The mixed mode problem (I and II) of a peny-shaped interface cracks in remote tension loading on a bi-material cylinder is studied using finite element method. The energy release rates for the tip of the crack in the interface were calibrated for several different moduli combinations and crack ratios using the modified crack closure integral technique and J-integral method, with numerical results obtained from a commercial finite element program. Numerical results show that non-dimensional value of$\sqrt{G_{II}E^*}/\sqrt[p]{\pi a}$ increases as the crack size or moduli ratio increases. Meanwhile, non-dimensional value of$\sqrt{G_{I}E^*}/\sqrt[p]{\pi a}$ decreases as the moduli ratio increases, but above the moduli ratio of 3 its value decreases then increases again as the crack size increases. Reliability of the numerical analysis in this study was acquired with comparison to an analytical solution for the peny-shaped interface crack in an infinite medium.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.304-310
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• 2001

Cracks at mechanical fastener holes usually nucleate as elliptical comer cracks at the faying surface of the mechanical joints and grow as elliptical arc through cracks after penetrating the opposite surface. In this study mode I, II and III stress intensity factors at two surface points of elliptical arc through cracks at mechanical fastener holes are analyzed by applying weight function method. The weight function method for two dimensional mixed-mode problem is extended to three dimensional one and it is verified.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.9 s.180
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• pp.2344-2352
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• 2000

Mechanical joints such as bolted or riveted joints are widely used in mechanical components. The reliable determination of the stress intensity factors for cracks in bolted joints is needed to evaluate the safety and fatigue life of them. The weight function method is an efficient technique to calculate the stress intensity factors for various loading conditions because only the stress analysis of an uncracked model is required. In this paper the mixed-mode stress intensity factors for cracks in bolted joints are obtained by weight function method, in which the coefficients of weight function are determined by finite element analyses for reference loadings. Critical inclined angle that mode I stress intensity factor becomes maximum is determined and the effects of crack length and the magnitude of clearance on critical inclined angle are investigated.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.32 no.5
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• pp.297-304
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• 2019

In this research, crack propagation in a silicon anode during two-phase lithiation was evaluated using a cohesive zone model. The phase transition from crystalline silicon to lithiated silicon causes compressive yielding due to the high volume expansion rate. Li-ion diffuses from the surface of the silicon to its core, and the complex deformation mechanisms during lithiation cause tensile hoop stress along the surface. The Park-Paulino-Roesler (PPR) potential-based cohesive zone model that guarantees consistent energy dissipation in mixed-mode fracture was adopted to simulate edge crack propagation. It was confirmed that the edge crack propagation characteristics during lithiation from the FEM simulation results coincided with the real experimental results. Crack turning observed from real experiments could also be predicted by evaluating the angles of maximum tensile stress directions.

• The Journal of Engineering Geology
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• v.6 no.2
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• pp.59-64
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• 1996

Acoustic Emission(AE) signals are emitted by a sudden release of strain energy associated with material damage. A multi-channels of LeCroy system and piezoelectric pressure transducers are employed for AE measurement to investigate the roles of AE in the propagation of macro cracks as well as the characteris-tics of AE wave in occurrence, amplitude and dominant frequency with changes in macro loading modes. Deduced crack opening volume of micro cracks varied widely and implies that AE events could be caused by crystal dislocations on a small scale and grain boundary movements on a large scale. Amplitude of first arrival AE wave emitted during mode I test was approximately 3 times higher than those from mixed mode test, while the number of AE count in mode I test was only 25% of mixed mode. It may imply that the total energy required for generation of a given fracture surface is similar regardless in change of macroloading modes.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.