• Title/Summary/Keyword: miniaturization

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Development of Energy Harvesting Technologies Platform for Self-Power Rechargeable Pacemaker Medical Device. (자가발전 심장박동기를 위한 에너지 수확 플랫폼 개발)

  • Park, Hyun-Moon;Lee, Jung-Chul;Kim, Byunng-Soo
    • The Journal of the Korea institute of electronic communication sciences
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    • v.14 no.3
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    • pp.619-626
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    • 2019
  • The advances of semiconductor and circuitry technology dovetailed with nano processing techniques have further enhanced micro-miniaturization, sensitivity, longevity and reliability in MID(Medical Implant Device). Nevertheless, one of the remaining challenges is whether power can sufficiently and continuously be supplied for the operation of the MID. Self-powered MID that harvest biomechanical energy from human motion, respiratory and muscle movement are part of a paradigm shift. In this paper, we developed a rechargeable pacemaker through self-power generation with the triboelectric nanogenerator. We demonstrate a fully implanted pacemaker based on an implantable triboelectric nanogenerator, which act as a storage as well as active movement on a large-animal(dog) scale. The self-power pacemaker harvested from animal motion is 2.47V, which is higher than the required pacemaker device sensing voltage(1.35V).

Intelligent Sensor Technology Trend for Smart IT Convergence Platform (스마트 IT 융합 플랫폼을 위한 지능형 센서 기술 동향)

  • Kim, H.J.;Jin, H.B.;Youm, W.S.;Kim, Y.G.;Park, K.H.
    • Electronics and Telecommunications Trends
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    • v.34 no.5
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    • pp.14-25
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    • 2019
  • As the Internet of Things, artificial intelligence and big data have received a lot of attention as key growth engines in the era of the fourth industrial revolution, data acquisition and utilization in mobile, automotive, robotics, manufacturing, agriculture, health care and national defense are becoming more important. Due to numerous data-based industrial changes, demand for sensor technologies is exploding, especially for intelligent sensor technologies that combine control, judgement, storage and communication functions with the sensors's own functions. Intelligent sensor technology can be defined as a convergence component technology that combines intelligent sensor units, intelligent algorithms, modules with signal processing circuits, and integrated plaform technologies. Intelligent sensor technology, which can be applied to variety of smart IT convergence services such as smart devices, smart homes, smart cars, smart factory, smart cities, and others, is evolving towards intelligent and convergence technologies that produce new high-value information through recognition, reasoning, and judgement based on artificial intelligence. As a result, development of intelligent sensor units is accelerating with strategies for miniaturization, low-power consumption and convergence, new form factor such as flexible and stretchable form, and integration of high-resolution sensor arrays. In the future, these intelligent sensor technologies will lead explosive sensor industries in the era of data-based artificial intelligence and will greatly contribute to enhancing nation's competitiveness in the global sensor market. In this report, we analyze and summarize the recent trends in intelligent sensor technologies, especially those for four core technologies.

A Study on the Characteristics of Plastic Injection Molding Using Core in Core Cooling Technology (Core in Core 냉각기술을 적용한 플라스틱 사출성형 특성에 관한 연구)

  • Choi, Yun-Seo;Park, In-Seung;Yang, Dong-Ho;Ha, Byeong-Cheol;Heo, Man-Woo;Lee, Jong-Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.3
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    • pp.82-87
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    • 2019
  • Recently, plastic materials have become more diversified, and the development of materials with excellent mechanical properties and plasticity has enabled wider application, miniaturization, and refinement of injection molded products. As a result, the utilization of these products in household goods, electronics, automotive parts, and aircraft parts is increasing in almost all industries. Injection molded parts are often used externally on finished commercial products. This means that the injection mold industry is very important to the value of these products. For this reason, the industry is performing research on the precision and efficiency of the injection molding process. In this study, we investigated the applicability of the core in core cooling method to the problem of product deformation due to temperature variation in existing injection mold designs. We also characterized the cooling performance of an injection mold when using this cooling method.

A study on the high transparent and antistatic thin films on sodalime glass by reactive pulsed DC magnetron sputtering (Pulsed DC 마그네트론 스퍼터링으로 제조한 소다라임 유리의 고투과 및 대전방지 박막특성 연구)

  • Jung, Jong-Gook;Lim, Sil-Mook
    • Journal of the Korean institute of surface engineering
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    • v.55 no.6
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    • pp.353-362
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    • 2022
  • Recently, transmittance of photomasks for ultra-violet (UV) region is getting more important, as the light source wavelength of an exposure process is shortened due to the demand for technologies about high integration and miniaturization of devices. Meanwhile, such problems can occur as damages or the reduction of yield of photomask as electrostatic damage (ESD) occurs in the weak parts due to the accumulation of static electricity and the electric charge on chromium metal layers which are light shielding layers, caused by the repeated contacts and the peeling off between the photomask and the substrate during the exposure process. Accordingly, there have been studies to improve transmittance and antistatic performance through various functional coatings on the photomask surface. In the present study, we manufactured antireflection films of Nb2O5, | SiO2 structure and antistatic films of ITO designed on 100 × 100 × 3 mmt sodalime glass by DC magnetron sputtering system so that photomask can maintain high transmittance at I-line (365 nm). ITO thin film deposited using In/Sn (10 wt.%) on sodalime glass was optimized to be 10 nm-thick, 3.0 × 103 𝛺/☐ sheet resistance, and about 80% transmittance, which was relatively low transmittance because of the absorption properties of ITO thin film. High average transmittance of 91.45% was obtained from a double side antireflection and antistatic thin films structure of Nb2O5 64 nm | SiO2 41 nm | sodalime glass | ITO 10 nm | Nb2O5 64 nm | SiO2 41 nm.

A Study of Certification of Lightning Indirect Effects on Cable Harness in Personal Air Vehicles (PAV 케이블 하네스에 대한 낙뢰 간접 영향성 인증 기법에 관한 연구)

  • Jo, Jae-Hyeon;Kim, Yun-Gon;Park, Se-Woong;Myong, Rho-Shin
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.49 no.3
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    • pp.251-262
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    • 2021
  • The airworthiness certification of lightning indirect effects becomes an important issue in personal air vehicles (PAVs), which are being actively developed around the world. PAVs are very vulnerable to lightning strikes, because of miniaturization, use of the electric engines, composite materials, and application of unmanned navigation systems. In this study, we first examined various steps of certifications for lightning indirect effects shown in AC 20 136B issued by the Federal Aviation Administration (FAA). We then applied certification guidelines for equipment transient design level listed in RTCA DO 160G Section 22 to PAVs and investigated lightning transient environments inside the PAVs. We also analyzed the aircraft level tests specified in SAE ARP 5416A by using electromagnetic computational analysis software EMA3D. Finally, we analyzed the actual transient level for PAVs and derived the data necessary for conformity certification.

Effect of CaF2 Addition on the Crystallinity of Hexagonal Boron Nitride Nanoparticles (육방정 질화붕소 나노입자의 결정성에 미치는 불화칼슘 첨가의 영향)

  • Jung, Jae-Yong;Kim, Yang-Do;Kim, Young-Kuk
    • Korean Journal of Metals and Materials
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    • v.56 no.12
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    • pp.915-920
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    • 2018
  • With the development of modern microelectronics technologies, the power density of electronic devices is rapidly increasing, due to the miniaturization or integration of device elements which operate at high frequency, high power conditions. Resulting thermal problems are known to cause power leakage, device failure and deteriorated performance. To relieve heat accumulation at the interface between chips and heat sinks, thermal interface materials (TIMs) must provide efficient heat transport in the through-plane direction. We report on the enhanced thermal conduction of $Al_2O_3-based$ polymer composites, fabricated by the surface wetting and texturing of thermally conductive hexagonal boron nitride(h-BN) nanoplatelets with large anisotropy in morphology and physical properties. The thermally conductive polymer composites were prepared with hybrid fillers of $Al_2O_3$ macro beads and surface modified h-BN nanoplatelets. Hexagonal boron nitride (h-BN) has high thermal conductivity and is one of the most suitable materials for thermally conductive polymer composites, which protect electronic devices by efficient heat dissipation. In this study, we synthesized hexagonal boron nitride nanoparticles by the pyrolysis of cost effective precursors, boric acid and melamine. Through pyrolysis at $900^{\circ}C$ and subsequent annealing at $1500^{\circ}C$, hexagonal boron nitride nanoparticles with diameters of ca. 50nm were synthesized. We demonstrate that the addition of a small amount of calcium fluoride ($CaF_2$) during the preparation of the melamine borate adduct significantly enhanced the crystallinity of the h-BN and assisted the growth of nanoplatelets up to 100nm in diameters. The addition of a small amount of h-BN enhanced the thermal conductivity of the $Al_2O_3-based$ polymer composites, from 1.45W/mK to 2.33 W/mK.

The Manufacture of Digital X-ray Devices and Implementation of Image Processing Algorithm (디지털 X-ray 장치 제작 및 영상 처리 알고리즘 구현)

  • Kim, So-young;Park, Seung-woo;Lee, Dong-hoon
    • Journal of the Institute of Convergence Signal Processing
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    • v.21 no.4
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    • pp.195-201
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    • 2020
  • This study studied scoliosis, one of the most common modern diseases caused by lifestyle patterns of office workers sitting in front of computers all day and modern people who use smart phones frequently. Scoliosis is a typical complication that takes more than 80% of the nation's total population at least once. X-ray are used to test for these complications. X-ray, a non-destructive testing method that allows scoliosis to be easily performed and filmed in various areas such as the chest, abdomen and bone without contrast agents or other instruments. We uses NI DAQ to miniaturize digital X-ray imaging devices and image intensifier in self-shielding housing with Vision Assistant for drawing lines to the top and the bottom of the spine to acquire angles, i.e. curvature in real-time. In this way, the research was conducted to see scoliosis patients and their condition easily and to help rapid treatment for solving the problem of posture correction in modern people.

Triple Folded Omnidirectional Microstrip Antenna for GBAS (GBAS용 3중 폴디드 무지향성 마이크로스트립 안테나)

  • Ju, Dae-Keun;Woo, Jong-Myung
    • The Journal of The Korea Institute of Intelligent Transport Systems
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    • v.20 no.4
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    • pp.83-94
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    • 2021
  • In this paper, we proposed a microstrip antenna (center frequency 118 MHz) with an omnidirectional radiation pattern that can replace the antennae used in VDB systems in GBAS. First, to obtain an omnidirectional radiation pattern from a microstrip antenna, we constructed a folded antenna. We then designed a miniaturized triple-folded antenna using perturbation effects. Thus we obtained suitable characteristics with a S11 of -13.91dB, -10 dB bandwidth of 1.5 MHz (1.27%) in the center frequency of 118 MHz. Furthermore, in the yz-plane and xy-plane, the component exhibits an omnidirectional radiation pattern, and the size of the antenna achieves miniaturization of 64.2% compared to the reference antenna. Finally, it is suitable as an antenna for VDB systems in GBAS.

Design and Fabrication of Ka-band High Power and Low Loss Waveguide Combiner (Ka 대역 고출력 저손실 도파관 결합기 설계 및 제작)

  • Kim, Hyo-Chul;Cho, Heung-Rae;Lee, Ju-Heun;Lee, Deok-Jae;An, Se-Hwan;Lee, Man-Hee;Joo, Ji-Han;Kwon, Jun-Beom;Jeong, Hae-Chang;Kim, So-Su
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.21 no.3
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    • pp.35-42
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    • 2021
  • The research of amplifier have been actively conducted to replace the Traveling Wave Tube Amplifier (TWTA) in the mmWave. For Solid State Power Amplifiers (SSPA), which combine semiconductor-type devices to obtain high output, Low-loss, high-efficiency combination techniques are required to meet the required output as the output of a single relatively low device is relatively low. In this paper, we design and produce an 8-way waveguide combiner and a reflective loss of more than 20dB and a binding efficiency of 85% or more were identified. Field analysis calculates the critical power inside the combiner. It secured stable Power Ratings and built-in coupler for power monitoring to achieve miniaturization and light weight.

Optimized hardware implementation of CIE1931 color gamut control algorithms for FPGA-based performance improvement (FPGA 기반 성능 개선을 위한 CIE1931 색역 변환 알고리즘의 최적화된 하드웨어 구현)

  • Kim, Dae-Woon;Kang, Bong-Soon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.25 no.6
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    • pp.813-818
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    • 2021
  • This paper proposes an optimized hardware implementation method for existing CIE1931 color gamut control algorithm. Among the post-processing methods of dehazing algorithms, existing algorithm with relatively low computations have the disadvantage of consuming many hardware resources by calculating large bits using Split multiplier in the computation process. The proposed algorithm achieves computational reduction and hardware miniaturization by reducing the predefined two matrix multiplication operations of the existing algorithm to one. And by optimizing the Split multiplier computation, it is implemented more efficient hardware to mount. The hardware was designed in the Verilog HDL language, and the results of logical synthesis using the Xilinx Vivado program were compared to verify real-time processing performance in 4K environments. Furthermore, this paper verifies the performance of the proposed hardware with mounting results on two FPGAs.