• 한국초전도ㆍ저온공학회논문지
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• 제6권4호
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• pp.22-26
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• 2004

For practical applications, the evaluation of reliability or endurance of HTS conductors is necessary. The mechanical properties and the critical current, Ie, of multifilamentary Bi-2223 superconducting tapes, externally reinforced with stainless steel foils, subjected to high cycle fatigue loading in the longitudinal direction were investigated at 77K. The S-N curves were obtained and its transport property was evaluated with the increase of repeated cycles at different stress amplitudes. The effect of the stress ratio, R, on the Ie degradation behavior under fatigue loading was also examined considering the practical application situation of HTS tapes. Microstructure observation was conducted in order to understand the Ie degradation mechanism in fatigued Bi-2223 tapes.

• 한국전기전자재료학회논문지
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• 제11권2호
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• pp.128-132
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• 1998

2/65/35 PLZT stock solution prepared by Sol-Gel processing was spin-coated on ITO coated glass and annealed by RTA(Rapid Thermal Annealing). The crystal structure of films was reported based on the observation of crystallization process and microstructure of the film fabricated at different fabrication condition. Films were crystallized into rhombohedral structure by annealing at $750^{\circ}C$ for 5 min. As the annealing temperature increased, the size of rosette structure of the films was grown up from $2.4{\mu}m$ to $15{\mu}m$, dielectric constant was increased, coercive field was decreased 33.82 kV/cm, remnant polarization was increased to 39.84 ${\mu}C/cm^2$ and Optical transmittance was decreased.

• 한국안전학회지
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• 제13권1호
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• pp.47-53
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• 1998

Radiant heater tubes with an inside burner are designed to transfer the heat generated from the burner to the outside of the tube by radiation. Hence, tube metal must suffer high temperature of approximately 900-$1000^{\circ}C$. The radiant tube is usually manufactured by centrifugal casting with high Ni-Cr alloys. In this study, failure analysis results of the radiant tube are reported. Failure mechanism of the tube was investigated by visual observation of the foiled tube, metallographic study of the cracked region and chemical analysis of tube metal and oxide scales. It was argued that the main cause of the cracking is repeated oxidation of the tube metal located beneath the thick oxide scale. Oxidation was caused by abnormally high operating temperature which can be verified by aged microstructure and internal void formation.

• 한국주조공학회지
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• 제25권2호
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• pp.80-87
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• 2005

The microstructure and mechanical property of the Ni and Ni-Cr porous metal reinforced AC4C matrix composites fabricated by squeeze casting were investigated. In this study Ni, Ni-Cr porous metals which are estimated to be easy to fabricate by squeeze casting are used as strengtheners for composite materials. As a matrix material, Al-7wt.%Si-0.3wt.%Mg(AC4C) has been used. In case of Ni/AC4C and Ni-Cr/AC4C composite, $750^{\circ}C$ melt temperature and minimum 25MPa squeezing pressure are needed to produce sound composite materials. The observation of interfacial reaction zone at various heat treatment condition shows that atsolutionizing temperature of above $520^{\circ}C$, the interfacial reaction zone increases proportionally with heat treatment time and the reaction products formed by interfacial reactions are mainly composed by $Al_{3}Ni$ and $Al_{3}Ni_{2}$ phases.

• 한국표면공학회지
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• 제28권6호
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• pp.376-385
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• 1995

Copper-chromium multilayers with a nominal bilayer thickness of about 400 $\AA$ (200 $\AA$ each) were prepared by dc magnetron sputtering and the evolution of microstructure during heat treatment was investigated by using x-ray diffractometry(XRD), Auger electron spectroscopy(AES) and transmission electron microscopy(TEM). It was observed that an amorphous phase with a thickness of about 40 $\AA$ was formed at the interfaces of the as-deposited Cu/Cr multilayered film using cross-sectional TEM. At elevated temperatures, the Cu(111) reflection showed increasing intensity and decreasing line-width as a result of copper grain growth. The intermixed amorphous phase disappeared after annealing at $250^{\circ}C$ for 1 h and the multilayer structure was stable up to $400^{\circ}C$ for 1 h annealing. At $600^{\circ}C$ annealing, it was observed that the multilayer structure was completely destroyed and copper and chromium phases were fully intermixed.

• 한국분말재료학회지
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• 제8권3호
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• pp.179-185
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• 2001

Through the observation of wear scar of two ceramic materials, microstructural wear mechanisms was investigated. As for the $Al_2O_3$-5 vol% SiC nanocomposite, the grain boundary fracture was suppressed by the presence of SiC nano-particles. The intragranular SiC particles have inhibited the extension of plastic deformation through the whole grain. Part of plastic deformation was accommodated around SiC particles, which made a cavity at the interface between SiC and matrix alumina. On the other hand, gas-pressure sintered silicon nitride showed extensive grain boundary fracture due to the thermal fatigue. The lamination of wear scar was initiated by the dissolution of grain boundary phase. These two extreme cases showed the importance of microstructures in wear behavior.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.344-345
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• 2015

Various concentration of copper was dopped in Fe-35%Ni thin sheet by electroforming and their electromagnetic, surface properties were determined. Microstructure observation by scanning electron microscopy revealed that the thin sheet had columnar grains with about 150 nm long. Phase analysis by X-ray diffractometry revealed that the alloy thin sheets were fine crystalline. The average surface roughnesses measured by atomic force microscopy (AFM) were about 14.38 nm. Nano hardnesses determined by tribo-nano indenter were 4.13 GPa. The surface resistances were 2.28 ohm/sq. The maximum magnetization, residual magnetization and coercive force depended on the copper concentration.

• 대한의용생체공학회:의공학회지
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• 제20권4호
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• pp.443-449
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• 1999

현재 시판되고 있는 치과용 76.5%Pd-11.6%Cu-7.2^%GarP 합금의 주조상태 및 임상열처리에 따른 미세조직의 변화를 X-선 회절기, 광학현미경, 시차열분석기를 이용하여 관찰하였다. 주조상태, 탈개스 및 세리믹소성처리 후 미세조직은 Pd고용체와 금속간화합물 Pd2Ga으로 구성되어 나타났고, 이들 상들은 열처리에 따라 상당한 변화를 보였다. 또한 Pd은 아르곤 분위기 내의 산소와 반응하여 산화물 형성 및 분해로 인해 질량변화곡선(TG)이 변하였고, 시차열분석(DTA)에서는 약 815$^{\circ}C$ 정도에서 Pd2Ga에 기인하는 흡열피크를 확인하였다. 이러한 실험의 결과들은 Cu가 이원계 Pd-Ga 합금의 Ga의 고용량을 낮추어 공정반응이 저 Ga 쪽으로 이동하기 때문인 것으로 설명하였다. 그러나 앞으로 보다 명확한 상변태 규명을 위해서 TEM등의 분석장비를 사용하여 체계적인 연구가 요구된다.

• 열처리공학회지
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• 제16권2호
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• pp.71-77
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• 2003

We investigate the phase formation in the compound layer of cast irons during the gaseous nitrocarburising of four different cast irons, that contain different types of graphites in the shape and size. We examine the change in the surface roughness with the nitrocarburising time. The observation of cross-sectional microstructure and X-ray diffraction analysis indicate that the compound layer consists of single ${\varepsilon}-Fe_{2-3}(N,C)$ phase and that its thickness increases in a parabolic manner with the treatment time. The surface roughness parameters, Rz and Ra increase with increasing treatment time. In other words, the roughness parameters increase as the thickness of compound layer increases. The parameters also depend on the shape and size of graphite in the individual cast irons.

• Journal of Welding and Joining
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• 제29권5호
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.