• 센서학회지
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• 제14권6호
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• pp.374-380
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• 2005

Vibration sensors have a wide scope of applications in the field of monitoring systems that needs to perceive an undesirable physical vibration before a critical failure occurs in a system, and then costly unplanned repairs can be avoided. The conventional vibration sensors developed so far have many disadvantages, such as complex manufacturing process, bulkiness, high cost, less reliability and so on. This paper reports a simple-structured vibration sensor, which has been developed using a commercialized conductive ball and silicon bulk-micromachining technology. The sensor consists of a conductive ball placed in $600{\mu}m$-deep micromachined silicon groove, in which Au thin film has been patterned using a shadow mask technique. Prior to the formation of the Au thin film, the sharp convex corner was rounded for smooth meatl deposition on the non-planar surface at the edge of the groove. The measurement results of the fabricated vibration sensor demonstrate a stable response characteristic to low-frequency vibration range ($1{\sim}30{\;}Hz$).

• 대한기계학회논문집B
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• 제26권7호
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• pp.991-996
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• 2002

This paper presents the fabrication method of a micro-riblet film (MRF) using MEMS technology and the experimental results of the drag reduction of an airfoil with MRFs. Riblets having grooved surface in the streamwise direction has been proven as an effective passive control technique of the drag reduction. A V-grooved pattern on (100) silicon wafer is etched with anisotropic bulk micromachining. The MRF is completed by replicating the V-grooved pattern with polydimethylsiloxane (PDMS). Experiments were performed by measuring a velocity field behind the trailing edge of a NACA 0012 airfoil with and without MRFs in a closed-type subsonic wind tunnel using particle image velocimetry (PlV) technique. The MRF provides about 3.8 % drag reduction compared to the drag on a smooth airfoil when the freestream velocity of wind tunnel is 3.3 m/s.

• 한국레이저가공학회지
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• 제12권1호
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• pp.7-13
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• 2009

Engineering ceramics as sapphire are widely used in industry owing to their superior mechanical and corrosion properties. However, micromachining of sapphire is a considerable challenge due to its transparency. Recently, direct ablation of sapphire has been demonstrated with a visible laser pulse at sufficiently high laser intensity. In this work, the theoretical model for pulsed laser ablation of sapphire is suggested and numerical analysis is carried out using the model. Sapphire ablation begins with plasma generation by the laser interaction with surface defects, impurities and contaminations in the initial stage of machining. Subsequent absorption of the visible laser beam can be explained by three mechanisms: metalization of sapphire surface due to the EUV radiation from the hot plasma, increments of surface roughness and temperature-dependent absorption coefficient. Comparison of the computation results with experimental observation indicates that the proposed model of sapphire is reasonable.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권2호
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• pp.140-148
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• 2000

In this paper, using surface micromachining technology with thick photoresist and aluminum, an SLM(Spatial Light Modulator), which is applied to the fields of adaptive optics and pattern recognition system, was fabricated and the electromechanical properties of the fabricated micro SLM are measured. In order to maximize fill-factor and remove mechanical coupling between micro SLM actuators, the micro SLM is composed of three aluminum layers so that spring structure and upper electrode are placed beneath the mirror plate, and $10\times10$ each mirror plate is individually actuated. Also, the micro SLM was designed to be able to modulate phase and amplitude of incoming light in order to have a continuity of phase modulation of incoming light. In the case of amplitude and phase modulation, maximum vertical displacement is 4$\mum$, and maximum angular displacement is $\pm4.6^{\corc}$ respectively. The height difference of the fabricated mirror plate was able to be reduced to 1100A with mirror plate planarization method using negative photoresist(AZ5214). The electromechanical properties of the fabricated micro SLM were measured with the optical measurement system using He-Ne laser and PSD(position sensitive device).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1524-1525
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• 2007

A flexible tactile sensor module based on polyimide matrix integrated with sensing elements and pluggable terminals connector was fabricated by polymer micromachining technology for robotic applications. The tactile sensor arrays are composed of $4{\times}4$, $8{\times}8$ and $16{\times}16$ sensing elements connected with pluggable terminals connector, respectively. Especially, both the tactile sensor array and the pluggable terminals are formed in the sensor module during the fabrication process. The fabricated tactile sensor module is measured continuously in the normal force range of $0{\sim}1N$ with tactile sensor auto-evaluation system. The value of resistance is relatively increased linearly with normal force in the overall range. The variation rate of resistance is about 2.0%/N in the range of $0{\sim}0.6N$ and 1.5%/N in the range of $0.6{\sim}1N$. Also, the flexibility of the sensing module is adequate to be placed on any curved surface as cylinder because the matrix consists of polymer and metal thin film.

• 한국광학회지
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• 제27권5호
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• pp.188-188
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• 2016

• 센서학회지
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• 제9권3호
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• pp.233-241
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• 2000

본 연구에서는 동일한 테스트 구조물을 사용하여 현재 다결정실리콘 표면 미세가공 기술에서 널리 사용되고 있는 여러 가지 점착 방지법들의 성능을 비교하였다. 테스트 구조물로는 다양한 폭과 길이를 갖는 일반적인 cantilever와 dimple, antistiction tip, plate를 가지는 cantilever를 사용하였으며 구조물 형태에 따른 점착 방지 결과를 관찰하였다. 희생층 제거 후 구조물과 기판의 점착을 결정하는 건조과정에서는 증발법과 승화건조법을 사용하였다. 증발법에서는 methanol, IPA, DI water 등을 여러 최종 세척액으로 사용하여 표면장력과 세척 온도에 따른 점착 방지 결과를 비교하였다. 승화건조법에서는 중간 세척액으로 methanol을 사용하였다. 그리고 동일한 실험조건으로 stress gradient가 있는 동일한 구조물을 사용하여 stress gradient에 의한 점착 방지 결과를 관찰하였다. 결론적으로 승화건조법이 여러 가지 증발법보다 우수한 결과를 보여주었고 다결정 실리콘 표면 미세가공 기술로 미세 구조물을 부양시킬 때 승화건조법이 가장 우수한 방법이라고 사료된다.

• 대한전자공학회논문지SD
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• 제40권8호
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• pp.543-548
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• 2003

본 논문에서는 큰 회전각을 갖는 2축 자유도 마이크로 미러를 제안하고 제작하였다. 이러한 마이크로 미러는 N×N 대용량 광 크로스 커넥트 스위치(optical cross-connect switch)를 구현하는 데 필수적인 요소이다. 스위치의 용량을 증가시키기 위해서는 각각의 마이크로 미러의 회전각을 크게 해야 한다. 이 미러가 큰 각도로 회전하기 위해서는 상부 전극인 미러 판과 하부전극 사이에 충분한 공간이 확보 되어야 한다. 제안된 구조는 기판미세 가공법 (bulk micromachining)을 이용하여 상부전극인 미러와 하부전극을 각각 다른 기판에 제작한 후, 두 기판을 접합함으로써 쉽게 미러의 회전 공간을 확보하였다. 따라서 미러의 회전공간 확보를 위한 별도의 구동기(actuator)를 도입할 필요가 없었다. 제작된 마이크로 미러의 성능을 측정한 결과를 살펴보면, x축과 y축 방향으로의 회전각은 각각 ±5.5°와 ±8.4°였으며, 이 때의 풀인 (pull-in)전압은 각각 380 V와 275 V였다. 이러한 회전각의 성능은 전 세계적으로 지금까지 보고된 연구결과 중에서 가장 우수한 결과이다.

• 대한전자공학회논문지SD
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• 제41권8호
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• pp.37-44
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• 2004

본 논문에서는 RF 부품 수동소자 중 가장 기본적인 요소가 되는 전송선로를 DAML(Dtelectric-supported Airbridge Microstrip Line) 형태의 새로운 구조로 제안하였으며, DAMS(Micro Electro Mechanical System) 기술 중 표면 마이크로머싱닝(surface micromachining) 기법을 이용하여 구현하였다. 제안된 구조는 마이크로스트립 라인(microstrip line)의 응용 형태로서 기존의 신호선(signal line)과 ground 사이에 유전체 지지대(dielectric post)를 사용하였고, 신호선을 공중으로 띄우면서 넓은 범위의 임피던스에서 유전체 손실(dielectric loss)을 최소화하였다. 본 논문에서 제작된 전송선로는 10 ㎛의 신호선의 높이와 10 ㎛ × 10 ㎛의 지지대(Post) 면적과 9 ㎛의 지지대(post)의 높이와 5 mm의 길이로 제작되었다. 50 GHz에서 일반적인 마이크로스티립(microstrip) 전송선의 손실이 약 7.5 dB/cm 이상 되는 것과 비교하여 본 논문에서 제안한 구조에서는 50 GHz에서 전송선의 손실이 약 1.1 dB/cm가 되는 것을 얻었다.

• 센서학회지
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• 제27권5호
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• pp.311-316
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• 2018

An antenna-coupled bolometer-type terahertz sensor was designed, fabricated, evaluated, and utilized to obtain terahertz transmission images. The sensor consists of a thin film bowtie antenna that resonates accordingly in response to an incident terahertz beam, a heater that converts the applied current in the antenna into heat, and a microbolometer that converts the rise in temperature into a change in resistance. The device is fabricated by a bulk micromachining process on a 4-inch silicon wafer. The fabricated sensor chip has a size of $2{\times}2mm$ and an active area of $0.1{\times}0.1mm^2$. The temperature coefficient of resistance (TCR) of the bolometer film (VOx) is 2.0%, which is acceptable for bolometer applications. The output sensor signal is proportional to the power of the incident terahertz beam. Transmission images were obtained with a 2-axis scanning imaging system that contained the sensor. The small active area of the sensor will enable the development of highly sensitive focal plane array sensors in terahertz imaging cameras in the future.