• 제목/요약/키워드: micromachining

검색결과 493건 처리시간 0.034초

Rapid Manufacturing of 3D Micro-products using UV Laser Ablation and Phase-change Filling

  • Shin Bo-Sung;Kim Jae-Gu;Chang Won-Suk;Whang Kyung-Hyun
    • International Journal of Precision Engineering and Manufacturing
    • /
    • 제7권3호
    • /
    • pp.56-59
    • /
    • 2006
  • UV laser micromachining is generally used to create microstructures for micro-products through a sequence of lithography-based photo-patterning steps. However, the micromachining process is not suitable for rapid realization of complex 3D micro-products because it depends on worker experience. In addition, the cost and time required to make many masks are excessive. In this paper, a more effective and rapid micro-manufacturing process, which was developed based on laser micromachining, is proposed for fabricating micro-products directly using UV laser ablation and phase-change filling. The filling process is useful for holding the micro-products during the ablation step. The proposed rapid micro-manufacturing process was demonstrated experimentally by fabricating 3D micro-products from functional UV-sensitive polymers using 3D CAD data.

엑시머 레이저를 이용한 3차원 마이크로가공 (Three Dimensional Micromachining using Excimer laser)

  • 최경현;배창현;이석희
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 1997년도 추계학술대회 논문집
    • /
    • pp.1076-1079
    • /
    • 1997
  • A new 3D micromachining method, called Hole Area Modulation(HAM), has been introduced and experimentally confirmed its feasibility. In this method, information on the depth of machining is converted to the sizes of small holes in the mask. The machining is carried out with a simple 2D movement of the workpiece. This method can be applied for machining various kinds of microcavities in various materials. In this paper, a mathematical model for excimer laser micromachining based on HAM and also determination of the optimal laser ablation conditions(width, Hole radius, step size, path, etc.) is completed by employing using Genetic Algorithm(GA).

  • PDF

UV 레이저 어블레이션과 상변화 충진을 이용한 3차원 마이크로 부품의 쾌속 제작 (Rapid Manufacturing of 3D Micro Products by UV Laser Ablation and Phase Change Filling)

  • 신보성;김재구;장원석;황경현
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2003년도 춘계학술대회 논문집
    • /
    • pp.26-29
    • /
    • 2003
  • UV laser micromachining are generally used to create microstructures for micro product through a sequence of lithography-based photopatterning steps. However, the micromachining process is not suitable for the rapid realization of complex microscale 3D product because it depends on worker experiences, excessive cost and time to make many masks. In this paper, the more effective micro rapid manufacturing process, which is developed upon the base of laser micromachining. is proposed to fabricate micro products directly using UV laser ablation and phase change filling. The filling process is useful to hold the micro product during the next ablation step. The proposed micro rapid manufacturing process is also proven experimentally that enables to fabricate the 3D microscale products of UV sensitive polymer from 3D CAD data to functional micro parts.

  • PDF

시스템적 접근을 통한 레이저 미세가공 설계 프로세스 개발에 관한 연구 (A Study on Application of Systems Approach for Laser Micro Machining Design Process)

  • 문성욱;박영원;남기중
    • 한국레이저가공학회지
    • /
    • 제10권3호
    • /
    • pp.15-24
    • /
    • 2007
  • In this paper laser micromachining system design process for commercialization is suggested. The constructed system design process is properly adjusted for laser micromachining area after tailoring engine process of system engineering process such as requirement analysis, functional analysis and allocation, system synthesis and system optimization process. In the current laser machining system design, system components and specifications are determined on the basis of experimental experience which a laser is being used in machining some materials as well as the current machining and research trend. In this paper, however, systematic process is suggested in addition to experimental experience, which the laser and system components and their specifications are decided in the process of definition of functional requirements and engine design variables of system to satisfy the customer's requirements.

  • PDF

UV 레이저 어블레이션과 상변화 충진을 이용한 3차원 마이크로 부품의 쾌속 제작 (Rapid Manufacturing of 3D Micro Products by UV Laser Ablation and Phase Change Filling)

  • 신보성;김재구;장원석;황경현
    • 한국정밀공학회지
    • /
    • 제22권11호
    • /
    • pp.196-201
    • /
    • 2005
  • UV laser micromachining are generally used to create microstructures for micro product through a sequence of lithography-based photopatterning steps. However, the micromachining process is not suitable for the rapid realization of complex 3D micro product because it depends on worker experiences, excessive cost and time to make many masks. In this paper, the more effective micro rapid manufacturing process, which is developed upon the base of laser micromachining, is proposed to fabricate micro products directly using UV laser ablation and phase change filling. The filling process is useful to hold the micro product during the next ablation step. The proposed micro rapid manufacturing process is also proven experimentally that enables to fabricate the 3D micro products of UV sensitive polymer from 3D CAD data to functional micro parts.

HF 기상식각에 의한 TEOS 희생층의 표면 미세가공 (Surface Micromachining of TEOS Sacrificial Layers by HF Gas Phase Etching)

  • 장원익;이창승;이종현;유형준
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 1996년도 추계학술대회 논문집
    • /
    • pp.725-730
    • /
    • 1996
  • The key process in silicon surface micromachining is the selective etching of a sacrificial layer to release the silicon microstructure. The newly developed anhydrous HF/$CH_3$OH gas phase etching of TEOS (teraethylorthosilicate) sacrificial layers onto the polysilicon and the nitride substrates was employed to release the polysilicon microstructures. A residual product after TEOS etching onto the nitride substrate was observed on the surface, since a SiOxNy layer is formed on the TEOS/nitride interface. The polysilicon microstructures are stuck to the underlying substrate because SiOxNy layer does not vaporize. We found that the only sacrificial etching without any residual product and stiction is TEOS etching onto the polysilicon substrate.

  • PDF

스캐너를 이용한 고속 펨토초 레이저 가공 기술 (High-Speed Femtosecond Laser Micromachining with a Scanner)

  • 손익부;최성철;노영철;고도경;이종민
    • 한국레이저가공학회지
    • /
    • 제9권2호
    • /
    • pp.11-15
    • /
    • 2006
  • We report experimental results on the high-speed micromachining using a femtosecond laser (800 nm, 130 fs, 1kHz) and galvanometer scanner system (Raylase, Germany). Periodic hole drilling of silicon and glass with the scan speed of 1-20 mm/s is demonstrated. Finally, we demonstrate the utility of the femtosecond laser application to ITO patterning by using a high-speed femtosecond laser scanner system.

  • PDF

벌크 마이크로머시닝 기술을 이용한 박형 광픽업용 SiOB 제작 (The Fabrication of SiOB by using Bulk Micromachining Process for the Application of Slim Pickup)

  • 최석문;박성준;황웅린
    • 정보저장시스템학회논문집
    • /
    • 제1권2호
    • /
    • pp.175-181
    • /
    • 2005
  • SiOB is an essential part of slim optical pickup, where the silicon mirror, LD stand, silicon PD are integrated and LD is flip chip bonded. SiOB is fabricated with bulk micromachining. Especially the fabrication of silicon wafer with stepped concave areas has many extraordinary difficulties. As a matter of fact, experiences and knowledges are rare in the fabrication of the highly stepped silicon wafer. The difficulties occurring in the integration of PD and SiOB, and highly stepped patterning, and silicon mirror roughness and how-to-solve will be discussed.

  • PDF

Femtosecond Micromachining Applications for Optical Devices

  • Sohn, Ik-Bu;Lee, Man-Seop;Woo, Jeong-Sik
    • Journal of the Optical Society of Korea
    • /
    • 제8권3호
    • /
    • pp.127-131
    • /
    • 2004
  • This paper investigates applications of femtosecond lasers for the micromachining of transparent materials and fabrication of optical devices. We show commercial micromachining examples of transparent materials which have been fabricated for various applications. Near infrared femtosecond laser processing is an attractive method to fabricate three-dimensional optical waveguides into various transparent materials. Focused femtosecond laser pulses induce a permanent refractive-index change only near the focal point. We also demonstrate a Y coupler with the splitting ratio of 1:1 written by femtosecond laser pulses into a fused silica glass. The minimum propagation loss of 0.8 ㏈/㎝ awl the refractive-index change of 0.006-0.01 at the wavelength of 1550 ㎚ were achieved by optimization of the laser fluence.

KrF 엑시머 레이저를 이용한 용융실리카의 미세 습식 식각가공 (Micromachining of Fused Silica by KrF Excimer Laser Induced Wet Etching)

  • 백병선;이종길;전병희;김헌영
    • 소성∙가공
    • /
    • 제11권7호
    • /
    • pp.601-607
    • /
    • 2002
  • Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.