• 한국항공우주학회지
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• 제31권2호
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• pp.57-62
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• 2003

MEMS(미소전기기계시스템) 박막의 푸와송비 측정을 위한 미소굽힙기법이 제안되었다. 푸와송비 측정에 민감한 쌍원시편(두 개의 원모양)을 설계하고 표면미세가공 공정을 사용하여 제작하였다. 미소압입기로 하중을 가한 쌍원시편의 하중-변위 곡선을 분석하여 푸와송비를 측정할 수 있었다. 제안도니 미소굽힘기법은 표면미세가공에 적합하여 소자제작과정에서의 동시측정이 가능하고(in-situ measurement), 소자가 위치해 있는 작은 영영에서의 물성을 국부적으로 측정할 수 있는 장점이 있다. 제안된 기법을 검증하기 위하여 저압화학기상증착법에 의하여 증착된 2.3㎛ 다결정실리콘(Poly-silicon)의 푸와송비를 측정하였다. 실험에 사용된 다결정실리콘막의 푸와송비는 0.2569 이고 쌍원시편의 강성에 대한 측정표준편차는 2.66% 이었다.

• 한국생산제조학회지
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• 제22권2호
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• pp.263-267
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• 2013

The continuing demand for increasingly slimmer and brighter liquid crystal display (LCD) panels has led to an increased focus on the role of light guide panels (LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit (BLU). The most basic process in the production of such BLU components is the micromachining of V-shaped grooves. Thus, given the current trend, micromachining of V-shaped grooves is expected to play increasingly important roles in today's manufacturing technology. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with V-shaped grooves. High-aspect-ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining limit in microcutting V-shaped grooves on electroless nickel plated die materials when using single-crystal diamond tools with point angles of $20^{\circ}-80^{\circ}$. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools. The experimental results are that V-shaped patterns with angles of $80^{\circ}$ or up can be realized regardless of the machining conditions and equipment. Moreover, the feed rate has little effect on machinability, and it is thought that the fly-cut method is more efficient for shallow patterns.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.246-250
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• 2003

In this study, two new types of micro-grippers in which micro-fingers are actuated by piezoelectric multi-layer benders and stacks are introduced for the manipulation of micrometer-sized objects. First, we constructed a 3-chopstick-mechanism tungsten gripper, which is composed of three chopsticks: two are designed to grip micro-objects, and tile third is used to help grasp and release the objects through overcoming especially electrostatic force among some surface effects including electrostatic, van der Waals forces and surface tension. Second, a 2-chopstick-mechanism silicon micro-gripper that uses an integrated force sensor to control the gripping force was developed. The micro-gripper is composed of a piezoelectric multilayer bender for actuating the gripper fingers, silicon fingertips fabricated by use of silicon-based micromachining, and supplementary supports. The micro-gripper is referred to as a hybrid-type micro-gripper because it is composed of two main components; micro-fingertips fabricated using micromachining technology to integrate a very sensitive force sensor for measuring the gripping force, and piezoelectric gripper finger actuators that are capable of large gripping forces and moving strokes. The gripping force signal was found to have a sensitivity of 667 N/V. To the design of each of components of both of the grippers. a systematic design approach was applied, which made it possible to establish the functional requirements and design parameters of the micro-grippers. The micro-grippers were installed on a manual manipulator to assess its performance in tasks such as moving micro-objects from one position to a desired position. The experiment showed that the micro-grippers function effectively.

• 전자공학회논문지SC
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• 제43권6호
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• pp.16-26
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• 2006

본 논문에서는 평판형 디스플레이 장치의 필수 구성품인 투명한 ITO(Indium-Tin-Oxide) 유리를 가공하기 위한 펨토초(Femto-second) 레이저 미세 가공의 효율을 극대화하기 위해 가공 대상체의 정보를 추출하는 시스템을 제안한다. 제안한 시스템은 레이저 스캐닝 시스템을 활용하여 펨토초 레이저빔의 초점 거리 오차와 각도 오차를 사전에 계측하고 3차원으로 형상을 복원한다. 본 시스템은 라인 스캔 레이저, 고해상도 카메라, 리니어 모션 가이드(Linear Motion Guide), 시스템 제어부로 구성되어있다. 또한 본 시스템의 모델링을 통한 카메라와 레이저의 위치와 측정 결과와의 관계를 나타낼 수 있는 민감도 지수를 정의하고, 이를 활용하여 더욱더 정확한 측정이 가능한 시스템을 설계할 수 있었다. 가공 대상체인 ITO 유리의 높이와 표면 형상을 측정하고 3차원으로 형상을 복원하여 주사 탐침 현미경(SPM)으로 얻은 결과와 비교하여 본 시스템의 성능을 검증하였다.

• 한국전기전자재료학회논문지
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• 제25권1호
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• pp.62-67
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• 2012

Owing to the rapid growth of mobile and electronic equipment miniaturization technology, the supply of micro mobile computing machine has been fast raised. Accordingly they have performed many researches on energy harvesting technology to provide promising power supply equipment to substitute existing batteries. In this paper, in order to have low resonance frequency for piezoelectric energy harvester, we have tried to make it larger than before by adopting nickel that has much higher density than silicon. We have applied it for our energy harvesting actuator instead of the existing silicon based actuator. Through such new concept and approach, we have designed energy harvesting device and made it personally by making with micromachining process. The energy harvester structure has a cantilever type and has a dimension of $10{\times}2.5{\times}0.1\;mm^3$ for length, width and thickness respectively. Its electrode type is formed by using Au/Ti of interdigitate d33 mode. The pattern size and gap size is 50 ${\mu}m$. Based on the measurement of the nickel-based piezoelectric energy harvester, it is found to have 778 Hz for a resonant frequency with no proof mass. In that resonance frequency we could get a maximum output power of 76 ${\mu}W$ at 4.8 $M{\Omega}$ being applied with 1 g acceleration.

• 한국정밀공학회지
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• 제27권10호
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• pp.29-33
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• 2010

UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.

• 센서학회지
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• 제7권2호
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• pp.103-110
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• 1998

강유전체 박막과 마이크로 가공기술을 이용하여 초전형 적외선 센서를 제작하였다. 초전형 적외선 센서는 $Pb_{l-x}La_{x}Ti_{1-x/4}O_{3}$ (x=0.05) (PLT) 강유전체 박막 커패시터를 RF 마그네트론 스퍼터링 방식으로 백감 전극이 증착된 MgO 기판상에 결정 성장시킨 구조를 갖고 있다. 스퍼터링된 PLT 박막은 높은 c-축 결정 구조를 가지므로 센서로 사용하기 위한 분극 처리 과정이 필요 없다. 이는 적외선 이미지 센서를 구현함에 있어서 수율 향상에 필수적인 요소이다. 또한 마이크로 가공 기술을 사용하여 센서의 열용량을 극소화함으로서 센서의 효율을 최대화하였다. 제작된 센서의 상부에 폴리이미드를 코팅하고 MgO 기판을 선택적으로 식각하여 코팅된 폴리이미드와 MgO가 강유전체 박막 커패시터를 지지하고 있는 구조를 구현하였다. 이렇게 제작된 센서의 감도는 상온에서 $8.5{\times}10^{8}cm{\cdot}\sqrt{Hz}/W$로 측정되었으며 이는 마이크로 가공 기술을 사용하지 않은 경우보다 약 100 배의 감도 향상을 가져왔다. 2차원 배열 구조를 갖는 센서를 가지고 인체의 유 무 뿐만 아니라 위치까지 감별할 수 있는 센싱 시스템을 구현하였다.

• Design & Manufacturing
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• 제14권3호
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• pp.44-49
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• 2020

One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

• 한국정보통신학회논문지
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• 제3권3호
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• pp.661-669
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• 1999

프로브 카드는 IC(integrated circuit) 칩을 테스트할 때, 테스트 시스템의 가장 중요한 부분의 하나이다. 본 연구는 다수의 반도체 칩을 동시에 테스트 할 수 있는 범프(bump)형 수직형 프로브 카드에 관한 것이다. 프로브는 범프 팁을 가지는 실리콘 캔틸레버로 구성되어 있다. 캔틸레버의 최적 크기를 결정하기 위하여 캔틸레버의 크기는 유한요소해석에 의하여 결정되었다. 프로브는 SDB웨이퍼를 사용하여 RIE, 등방성 에칭, 그리고 벌크 마이크로머시닝에 의하여 제조되었다. FEM에 의해 결정된 최적 크기로 제작된 프로브 카드는 범프의 높이가 30$\mum$, 캔틸레버의 두께가 $\mum$, 빔의 폭이 100 $\mum$, 길이가 400 $\mum$, 이었다. 제조된 프로브 카드의 접촉 테스트에서 측정된 접촉 저항은 $2 \Omega$ 미만이고, 2만회의 접촉동안 접촉 저항의 변화가 거의 없는 특성을 보였다. 따라서 20,000회 이상의 수명을 가질 수 있음을 알 수 있었다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권5호
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• pp.396-401
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• 1999

In this study, $Ar^+$ ion laser etching process of single/poly-crystalline Si with $CCl_2F_2$ gas is investigated for MEMS applications. In general, laser direct etching process is useful in microelectronic process, fabrication of micro sensors and actuators, rapid prototyping, and complementary processing because of the advantages of 3D micromachining, local etching/deposition process, and maskless process with high resolution. In this study, a pyrolytic method, in which $CCl_2F_2$ gasetches molten Si by the focused laser, was used. In order to analyze the temperature profile of Si by the focused laser, the 3D heat conduction equation was analytically solved. In order to investigate the process parameters dependence of etching characteristics, laser power, $CCl_2F_2$ gas pressure, and scanning speed were varied and the experimental results were observed by SEM. The aspect ratio was measured in multiple scanning and the simple 3D structure was fabricated. In addition, the etching characteristics of $6\mum$ thick poly-crystalline Si on the insulator was investigated to obtain flat bottom and vertical side wall for MEMS applications.