• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.228-233
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• 2007

Core technologies for integrating hydrogen gas sensor were investigated. In this study, the thermally isolated micro-hot-plate with areas of $100{\times}100-260{\times}260{\mu}m^2$ was fabricated by utilizing surface micromachining technique that provides better manufacturing yield than bulk micromachining counterpart. The optimum design of the sensor was peformed by analyzing the thermal profile of the structure obtained from a ANSYS simulator. The 400-nm-thick polysilicon films doped with phosphorus, the 300-nm-thick aluminum films, and the 200-nm-thick $SnO_2$(or ZnO)films were used as the micro-heater material, the temperature sensor material, and the gas sensitive material, respectively. The experimental results show that the developed gas sensors can detect $H_2$ concentration as low as 1 ppm.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 심포지엄 논문집 정보 및 제어부문
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

• 한국산학기술학회논문지
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• 제6권1호
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• pp.24-28
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• 2005

3차원 실리콘 챔버를 갖는 $15.8{\times}15.8 mm^2$크기의 칩을 바이오 센서용으로 마이크로머시닝 기술을 이용하여 개발하였다. 비등방성 식각기술을 이용하여 (100)방향의 p형 실리콘 웨이퍼위에 마이크로 챔버를 형성하였다. 마이크로 챔버를 갖는 웨이퍼와 백금전극이 도포된 Pyrex 유리를 DGF-48S 접착제를 이용하여 접합하였다. 백금전극과 Ag/AgCl 기준전극에 의한 전기화학적 특성을 조사하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.45-46
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• 2005

The piezoelectric ZnO thin films were deposited onto Al/Si substrate in order to figure out the crystalline and the residual stress of deposited films. As the $Ar/O_2$ gas ratio is increased, c-axis orientation of deposited films is significantly enhanced and also the residual stresses of ZnO films are all compressive. They are decreased from -1.2 GPa to -950 MPa as the $Ar/O_2$ gas ratio is increased. A diaphragm-based piezoelectric microspeaker fabricated on ONO films shows about 14 mPa output pressure at 1 kHz with $8V_{peak-to-peak}$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.721-725
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• 1996

The microfabricated test structures were used in order to evaluate the stress characteristics in films. The test structures were fabricated using surface micromachining technique, including HF vapor phase etching as an effective release method. The fabricated structures were micro strain gauge, cantilever-type vernier gauge and bridge for stress measurement, and cantilever for stress gradient measurement. The strain was measures by observing the deformation of the structures occurred after release etching and the amount of deformation can be detected by micro vernier gauge, which has gauge resolution of 0.2${\mu}{\textrm}{m}$. The detection principles and the degree of precision for the measured strain were also discussed. The characteristics of residual stress in LPCVD polysilicon films were studied using these test structures. The stress gradient due to the stress variation through the film thickness was calculated by measuring the deflection at the cantilever free end.

• 한국정밀공학회지
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• 제22권7호
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• pp.79-87
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• 2005

This paper summarizes the work on the development of a simulation program for modelling the process of machining quasi-three dimensional shape with the excimer laser beam on a constantly moving polymers. Relatively simple masks of rectangle, triangle and half circle shape are considered. The etching depth is calculated by considering the number of laser pulses irradiated on the specimen surface. It was found that similar shapes as experimental results can be obtained by choosing suitable parameters of moving velocity, moving distance and mask sizes.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.181-184
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• 2002

In these day, fabrication technologies for micro parts become more important with the increase of interest on microsystem and developed through the various approaches in the whole world. Among these technologies; micro mechanical machining is one of the most effective methods for the fabrication of micro parts. In this study, we fabricated micro shafts using micro endmill and micromachining system and measured the cutting force at the process. Also, Based on the data, we simulated the deformation of micro shafts due to the cutting force. Through the simulation results, it was verified that the cutting force at the process is enough to cause dimensional error at the micro shafts.

• 센서학회지
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• 제5권1호
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• pp.71-77
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• 1996

마이크로머시닝의 구조재료인 다결정 Si이 희생산화막의 영향을 받음을 고려하여 다결정 Si을 열산화시킨 다결정-산화막을 새로운 희생산화막의 재료로서 제안하고 평가하였다. 다결정-산화막상에 성장시킨 다결정 Si은 통상의 희생산화막상에 성장시키는 경우보다 grain size가 증가하였고, XRD결과를 통해 (111) texture의 증가와, 부가적인 (220) texture가 형성됨을 관찰하였다. 또한, 다결정-산화막상에 성장시킨 다결정 Si의 경우, 그 응력이 작고 균일한 분포를 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 추계학술대회 논문집
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• pp.334-337
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• 1996

Si anisotropic etching is a key technology for micromachining. The main advantages of tetramethyl ammonium hydroxide (TMAH)-based solution are their full compatibility with IC process. In this work the anisotropic etching of single crystal Si in a TMAH (($CH_3$)$_4$NOH) based solution was studied. The influence of the addition of IPA to TMAH solution on their etching characteristics was also presented. The crystal planes bounding the etch front and their etch rates were determined as a function of temperature, crystal orientation, and etchant concentration. The etch rates of (100) oriented Si crystal planes decreased linearly with increasing the IPA concentration, The etched (100) planes were covered by Pyramidal-shaped hillocks below 15 wt.%, but very smooth surfaces were obtained above 20 wt.%. The addition of IPA to TMAH solution leads to smoother surfaces of sidewalls etched planes.

• 로봇학회논문지
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• 제2권3호
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• pp.249-254
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• 2007

본 논문에서는 웨이퍼 레벨 밀봉 실장된 수직 운동 가속도 신호를 감지할 수 있는 초소형 Z축 가속도 센싱 엘리먼트를 제작하였다. 초소형 Z축 가속도 센싱 엘리먼트는 수직 방향의 정전용량 변화를 필요로 하기 때문에 단일 기판상에 수직 단차의 형성을 가능케 하는 확장된 희생 몸체 미세 가공 기술 (Extended Sacrificial Bulk Micromachining, ESBM) 을 이용하여 제작되었다. 확장된 희생 몸체 미세 가공 기술을 이용하면 정렬오차가 없이 상하부 양쪽에 수직 단차를 갖는 실리콘 구조물의 제작이 가능하다. 또한, MEMS 센싱 엘리먼트의 부유된 실리콘 구조물을 보호하기 위하여 웨이퍼 레벨 밀봉 실장 기술이 적용하여 고신뢰성, 고수율, 고성능의 Z축 가속도 센서를 제작하였다. 신호 처리 회로와 가속도 센서를 결합하여 Z축 가속도 센싱 시스템을 제작하였고 운동가속도 범위 10 g 이상, 정지 드리프트 17.3 mg 그리고 대역폭 60 Hz 이상의 성능을 나타내었다.