• International Journal of Precision Engineering and Manufacturing
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• v.7 no.3
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• pp.56-59
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• 2006

UV laser micromachining is generally used to create microstructures for micro-products through a sequence of lithography-based photo-patterning steps. However, the micromachining process is not suitable for rapid realization of complex 3D micro-products because it depends on worker experience. In addition, the cost and time required to make many masks are excessive. In this paper, a more effective and rapid micro-manufacturing process, which was developed based on laser micromachining, is proposed for fabricating micro-products directly using UV laser ablation and phase-change filling. The filling process is useful for holding the micro-products during the ablation step. The proposed rapid micro-manufacturing process was demonstrated experimentally by fabricating 3D micro-products from functional UV-sensitive polymers using 3D CAD data.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.1076-1079
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• 1997

A new 3D micromachining method, called Hole Area Modulation(HAM), has been introduced and experimentally confirmed its feasibility. In this method, information on the depth of machining is converted to the sizes of small holes in the mask. The machining is carried out with a simple 2D movement of the workpiece. This method can be applied for machining various kinds of microcavities in various materials. In this paper, a mathematical model for excimer laser micromachining based on HAM and also determination of the optimal laser ablation conditions(width, Hole radius, step size, path, etc.) is completed by employing using Genetic Algorithm(GA).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.26-29
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• 2003

UV laser micromachining are generally used to create microstructures for micro product through a sequence of lithography-based photopatterning steps. However, the micromachining process is not suitable for the rapid realization of complex microscale 3D product because it depends on worker experiences, excessive cost and time to make many masks. In this paper, the more effective micro rapid manufacturing process, which is developed upon the base of laser micromachining. is proposed to fabricate micro products directly using UV laser ablation and phase change filling. The filling process is useful to hold the micro product during the next ablation step. The proposed micro rapid manufacturing process is also proven experimentally that enables to fabricate the 3D microscale products of UV sensitive polymer from 3D CAD data to functional micro parts.

• Laser Solutions
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• v.10 no.3
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• pp.15-24
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• 2007

In this paper laser micromachining system design process for commercialization is suggested. The constructed system design process is properly adjusted for laser micromachining area after tailoring engine process of system engineering process such as requirement analysis, functional analysis and allocation, system synthesis and system optimization process. In the current laser machining system design, system components and specifications are determined on the basis of experimental experience which a laser is being used in machining some materials as well as the current machining and research trend. In this paper, however, systematic process is suggested in addition to experimental experience, which the laser and system components and their specifications are decided in the process of definition of functional requirements and engine design variables of system to satisfy the customer's requirements.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.196-201
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• 2005

UV laser micromachining are generally used to create microstructures for micro product through a sequence of lithography-based photopatterning steps. However, the micromachining process is not suitable for the rapid realization of complex 3D micro product because it depends on worker experiences, excessive cost and time to make many masks. In this paper, the more effective micro rapid manufacturing process, which is developed upon the base of laser micromachining, is proposed to fabricate micro products directly using UV laser ablation and phase change filling. The filling process is useful to hold the micro product during the next ablation step. The proposed micro rapid manufacturing process is also proven experimentally that enables to fabricate the 3D micro products of UV sensitive polymer from 3D CAD data to functional micro parts.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.725-730
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• 1996

The key process in silicon surface micromachining is the selective etching of a sacrificial layer to release the silicon microstructure. The newly developed anhydrous HF/$CH_3$OH gas phase etching of TEOS (teraethylorthosilicate) sacrificial layers onto the polysilicon and the nitride substrates was employed to release the polysilicon microstructures. A residual product after TEOS etching onto the nitride substrate was observed on the surface, since a SiOxNy layer is formed on the TEOS/nitride interface. The polysilicon microstructures are stuck to the underlying substrate because SiOxNy layer does not vaporize. We found that the only sacrificial etching without any residual product and stiction is TEOS etching onto the polysilicon substrate.

• Laser Solutions
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• v.9 no.2
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• pp.11-15
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• 2006

We report experimental results on the high-speed micromachining using a femtosecond laser (800 nm, 130 fs, 1kHz) and galvanometer scanner system (Raylase, Germany). Periodic hole drilling of silicon and glass with the scan speed of 1-20 mm/s is demonstrated. Finally, we demonstrate the utility of the femtosecond laser application to ITO patterning by using a high-speed femtosecond laser scanner system.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.175-181
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• 2005

SiOB is an essential part of slim optical pickup, where the silicon mirror, LD stand, silicon PD are integrated and LD is flip chip bonded. SiOB is fabricated with bulk micromachining. Especially the fabrication of silicon wafer with stepped concave areas has many extraordinary difficulties. As a matter of fact, experiences and knowledges are rare in the fabrication of the highly stepped silicon wafer. The difficulties occurring in the integration of PD and SiOB, and highly stepped patterning, and silicon mirror roughness and how-to-solve will be discussed.

• Journal of the Optical Society of Korea
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• v.8 no.3
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• pp.127-131
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• 2004

This paper investigates applications of femtosecond lasers for the micromachining of transparent materials and fabrication of optical devices. We show commercial micromachining examples of transparent materials which have been fabricated for various applications. Near infrared femtosecond laser processing is an attractive method to fabricate three-dimensional optical waveguides into various transparent materials. Focused femtosecond laser pulses induce a permanent refractive-index change only near the focal point. We also demonstrate a Y coupler with the splitting ratio of 1:1 written by femtosecond laser pulses into a fused silica glass. The minimum propagation loss of 0.8 ㏈/㎝ awl the refractive-index change of 0.006-0.01 at the wavelength of 1550 ㎚ were achieved by optimization of the laser fluence.

• Transactions of Materials Processing
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• v.11 no.7
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• pp.601-607
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• 2002

Optically transparent materials such as fused silica, quartz and crystal have become important in the filed of optics and optoelectronics. Laser ablation continues to grow as an important technique for micromachining and surface modification of various materials, because many problems caused by direct contact between tools and workpiece can be avoided. Especially, laser ablation with excimer lasers enables fine micromachining of transparent materials such as fused silica, quartz and crystal, etc. In this study, laser-induced wet etching of fused silica in organic solution was conducted. KrF excimer laser was used as a light source and acetone solution of pyrene was used as etchant. Changing the number of laser pulses, micro holes of various depths are fabricated.