• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.2
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• pp.57-62
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• 2003

Nano-bending method is presented to measure the Poisson's ratio of thinfilms for MEMS (Micro-Electro-Mechanical Systems) applicaiton. The douvle-ring specimen is designed and fabricated based on the surface micromachining process to facilitate the measurement of the Poisson's ratio. The Poisson's ratio can be obtained through analyzing the linear load-displacement relationship of the double ring specimen subjected to nano-indenter loading. The Present nano-bending mehod is an in-situ measurement approach due to the compatibility to the surface micromachining process. The Poisson's ratio is locally obtained at the location of the double ring specimen with micro dimension. To validate the nano-bending method, the Poisson's ratio of LPCVD (Low Pressure Chemical Vapor Deposition) poly-silicon with thickness of 2.3㎛ is investigated. Experimental results reveal that the Poisson's ratio of the poly-silicon film is 0.2569. The standard deviation of the nano-bending measurement for the stiffness of double ring specimens is 2.66%.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.263-267
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• 2013

The continuing demand for increasingly slimmer and brighter liquid crystal display (LCD) panels has led to an increased focus on the role of light guide panels (LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit (BLU). The most basic process in the production of such BLU components is the micromachining of V-shaped grooves. Thus, given the current trend, micromachining of V-shaped grooves is expected to play increasingly important roles in today's manufacturing technology. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with V-shaped grooves. High-aspect-ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining limit in microcutting V-shaped grooves on electroless nickel plated die materials when using single-crystal diamond tools with point angles of $20^{\circ}-80^{\circ}$. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools. The experimental results are that V-shaped patterns with angles of $80^{\circ}$ or up can be realized regardless of the machining conditions and equipment. Moreover, the feed rate has little effect on machinability, and it is thought that the fly-cut method is more efficient for shallow patterns.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.246-250
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• 2003

In this study, two new types of micro-grippers in which micro-fingers are actuated by piezoelectric multi-layer benders and stacks are introduced for the manipulation of micrometer-sized objects. First, we constructed a 3-chopstick-mechanism tungsten gripper, which is composed of three chopsticks: two are designed to grip micro-objects, and tile third is used to help grasp and release the objects through overcoming especially electrostatic force among some surface effects including electrostatic, van der Waals forces and surface tension. Second, a 2-chopstick-mechanism silicon micro-gripper that uses an integrated force sensor to control the gripping force was developed. The micro-gripper is composed of a piezoelectric multilayer bender for actuating the gripper fingers, silicon fingertips fabricated by use of silicon-based micromachining, and supplementary supports. The micro-gripper is referred to as a hybrid-type micro-gripper because it is composed of two main components; micro-fingertips fabricated using micromachining technology to integrate a very sensitive force sensor for measuring the gripping force, and piezoelectric gripper finger actuators that are capable of large gripping forces and moving strokes. The gripping force signal was found to have a sensitivity of 667 N/V. To the design of each of components of both of the grippers. a systematic design approach was applied, which made it possible to establish the functional requirements and design parameters of the micro-grippers. The micro-grippers were installed on a manual manipulator to assess its performance in tasks such as moving micro-objects from one position to a desired position. The experiment showed that the micro-grippers function effectively.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.6 s.312
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• pp.16-26
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• 2006

In this paper, we propose a 3D shape restoration system which measures height and surface shape of transparent ITO glass and delivers errors in focal length and incident angle of laser beam to femto-second laser micromachining. The proposed system is composed of a line scan laser, a high resolution camera, a linear motion guide synchronized to image capturing, and a control station. Also, we define the sensitivity indices that represent a relation between measurement error and a position of a camera and scan laser, and utilize it for optimum design. The results of the proposed system are compared with results of SPM(Scanning Probe Microscope) and prove the usefulness of the system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.1
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• pp.62-67
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• 2012

Owing to the rapid growth of mobile and electronic equipment miniaturization technology, the supply of micro mobile computing machine has been fast raised. Accordingly they have performed many researches on energy harvesting technology to provide promising power supply equipment to substitute existing batteries. In this paper, in order to have low resonance frequency for piezoelectric energy harvester, we have tried to make it larger than before by adopting nickel that has much higher density than silicon. We have applied it for our energy harvesting actuator instead of the existing silicon based actuator. Through such new concept and approach, we have designed energy harvesting device and made it personally by making with micromachining process. The energy harvester structure has a cantilever type and has a dimension of $10{\times}2.5{\times}0.1\;mm^3$ for length, width and thickness respectively. Its electrode type is formed by using Au/Ti of interdigitate d33 mode. The pattern size and gap size is 50 ${\mu}m$. Based on the measurement of the nickel-based piezoelectric energy harvester, it is found to have 778 Hz for a resonant frequency with no proof mass. In that resonance frequency we could get a maximum output power of 76 ${\mu}W$ at 4.8 $M{\Omega}$ being applied with 1 g acceleration.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.29-33
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• 2010

UV laser micromachining of metallic materials has been used in microelectronic and other industries. This paper shows on experimental investigation of micromachining of copper using a 355nm UV laser with 50ns pulse duration. A finite element model with high strain rate effect is especially suggested to investigate the phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. In order to consider the strain rate effect, Cowper-Symonds model was used. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, a commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computational simulation of the UV laser micro machining behavior for thin copper material. From these computational results, depth of the dent (from one to six pulsed) were observed and compared with previous experimental results. This will help us to understand interaction between UV laser beam and material.

• Journal of Sensor Science and Technology
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• v.7 no.2
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• pp.103-110
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• 1998

Pyroelectric infrared detectors based on La-modified $PbTiO_{3}$ (PLT) thin films have been fabricated by RF magnetron sputtering and rnicrornachining technology. The detectors form $Pb_{l-x}La_{x}Ti_{1-x/4}O_{3}$ (x=0.05) thin film ferroelectric capacitors epitaxially grown by RF magnetron sputtering on Pt/MgO (100) substrate. The sputtered PLT thin film exhibits highly c-axis oriented crystal structure that no poling treatment for sensing applications is required. This is an essential factor to increase the yield for realization of an infrared image sensor. Micromachining technology is used to lower the thermal mass of the detector by giving maximum sensor efficiency. Polymide is coated on top of the sensing elements to support the fragile structure and the backside of the MgO substrate is selectively etched to reduce the heat loss. The sensing element exhibited a very high detectivity D* of $8.5{\times}10^{8}cm{\cdot}\sqrt{Hz}/W$ at room temperature and it is about 100 times higher than the case of micromachining technology is not used. A sensing system that detects the position as well as the existence of a human body is realized using the array sensor.

• Design & Manufacturing
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• v.14 no.3
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• pp.44-49
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• 2020

One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.3
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• pp.661-669
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• 1999

A probe card is one of the most important pan of test systems as testing IC(integrated circuit) chips. This work was related to bump-type silicon vertical probe card which enabled simultaneous tests for multiple semiconductor chips. The probe consists of silicon cantilever with bump tip. In order to obtain optimum size of the cantilever, the dimensions were determined by FEM(finite element method) analysis. The probe was fabricated by RIE(reactive ion etching), isotropic etching, and bulk-micromachining using SDB(silicon direct bonding) wafer. The optimum height of the bump of the probe detemimed by FEM simulation was 30um. The optimum thickness, width, and length of the cantilever were 20 $\mum$, 100 $\mum$,and 400 $\mum$,respectively. Contact resistance of the fabricated probe card measured at contact resistance testing was less than $2\Omega$. It was also confirmed that its life time was more than 20,000 contacts because there was no change of contact resistance after 20,000 contacts.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.5
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• pp.396-401
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• 1999

In this study, $Ar^+$ ion laser etching process of single/poly-crystalline Si with $CCl_2F_2$ gas is investigated for MEMS applications. In general, laser direct etching process is useful in microelectronic process, fabrication of micro sensors and actuators, rapid prototyping, and complementary processing because of the advantages of 3D micromachining, local etching/deposition process, and maskless process with high resolution. In this study, a pyrolytic method, in which $CCl_2F_2$ gasetches molten Si by the focused laser, was used. In order to analyze the temperature profile of Si by the focused laser, the 3D heat conduction equation was analytically solved. In order to investigate the process parameters dependence of etching characteristics, laser power, $CCl_2F_2$ gas pressure, and scanning speed were varied and the experimental results were observed by SEM. The aspect ratio was measured in multiple scanning and the simple 3D structure was fabricated. In addition, the etching characteristics of $6\mum$ thick poly-crystalline Si on the insulator was investigated to obtain flat bottom and vertical side wall for MEMS applications.