• Title/Summary/Keyword: micromachining

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Development of Core Technologies for Integrating Combustible Hydrogen Gas Sensor (수소가스 감지용 가연성 가스센서 제작을 위한 요소기술 개발)

  • Yun, Eui-Jung;Park, Hyeong-Sik;Lee, Seok-Tae;Park, Nho-Kyung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.3
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    • pp.228-233
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    • 2007
  • Core technologies for integrating hydrogen gas sensor were investigated. In this study, the thermally isolated micro-hot-plate with areas of $100{\times}100-260{\times}260{\mu}m^2$ was fabricated by utilizing surface micromachining technique that provides better manufacturing yield than bulk micromachining counterpart. The optimum design of the sensor was peformed by analyzing the thermal profile of the structure obtained from a ANSYS simulator. The 400-nm-thick polysilicon films doped with phosphorus, the 300-nm-thick aluminum films, and the 200-nm-thick $SnO_2$(or ZnO)films were used as the micro-heater material, the temperature sensor material, and the gas sensitive material, respectively. The experimental results show that the developed gas sensors can detect $H_2$ concentration as low as 1 ppm.

Analysis of die strength for laser dicing (레이저 다이싱에 의한 die strength 분석)

  • Lee, Young-Hyun;Choi, Kyung-Jin;Bae, Sung-Chang
    • Proceedings of the KIEE Conference
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    • 2006.04a
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    • pp.327-329
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    • 2006
  • In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

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Development of Three-dimensional Chamber-type Glucose Sensor Using Micromachining Technology (마이크로머시닝 기술을 이용한 3차원 마이크로 챔버형 글루코스 센서의 개발)

  • Kim Sung Ho;Kim Chang Kyo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.6 no.1
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    • pp.24-28
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    • 2005
  • A micromachined biochip with a three dimensional silicon chamber was developed for the construction of biosensors. Anisotropic etching was used fur the formation of the chamber on the p-type silicon wafer(100) and then was glued to the Pyrex glass bottom-substrate with pre-deposited platinum electrode. The electrochemical characterization of its Pt electrode and Ag/AgCl reference electrode was investigated.

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Piezoelectric Microspeaker by Using Micromachining Technique (마이크로머시닝 기술을 이용한 압전형 마이크로스피커)

  • Suh, Kyong-Won;Yi, Seung-Hwan;Ryu, Kum-Pyo;Min, Nam-Ki
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.45-46
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    • 2005
  • The piezoelectric ZnO thin films were deposited onto Al/Si substrate in order to figure out the crystalline and the residual stress of deposited films. As the $Ar/O_2$ gas ratio is increased, c-axis orientation of deposited films is significantly enhanced and also the residual stresses of ZnO films are all compressive. They are decreased from -1.2 GPa to -950 MPa as the $Ar/O_2$ gas ratio is increased. A diaphragm-based piezoelectric microspeaker fabricated on ONO films shows about 14 mPa output pressure at 1 kHz with $8V_{peak-to-peak}$.

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Stress Measurement of films using surface micromachined test structures (표면 미세 가공된 구조체를 이용한 박막의 응력 측정)

  • 이창승;정회환;노광수;이종현;유형준
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.721-725
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    • 1996
  • The microfabricated test structures were used in order to evaluate the stress characteristics in films. The test structures were fabricated using surface micromachining technique, including HF vapor phase etching as an effective release method. The fabricated structures were micro strain gauge, cantilever-type vernier gauge and bridge for stress measurement, and cantilever for stress gradient measurement. The strain was measures by observing the deformation of the structures occurred after release etching and the amount of deformation can be detected by micro vernier gauge, which has gauge resolution of 0.2${\mu}{\textrm}{m}$. The detection principles and the degree of precision for the measured strain were also discussed. The characteristics of residual stress in LPCVD polysilicon films were studied using these test structures. The stress gradient due to the stress variation through the film thickness was calculated by measuring the deflection at the cantilever free end.

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Modeling of Laser Micromachining of Quasi-three-dimensional Shapes (레이저를 이용한 준삼차원 미소형상 가공 모델링)

  • Shin Kui Sung;Yoon Kyung Koo;Whang Kyung Hyun;Bang Se Yoon
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.7 s.172
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    • pp.79-87
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    • 2005
  • This paper summarizes the work on the development of a simulation program for modelling the process of machining quasi-three dimensional shape with the excimer laser beam on a constantly moving polymers. Relatively simple masks of rectangle, triangle and half circle shape are considered. The etching depth is calculated by considering the number of laser pulses irradiated on the specimen surface. It was found that similar shapes as experimental results can be obtained by choosing suitable parameters of moving velocity, moving distance and mask sizes.

Study on Micro Machining for Micro Shafts using micro endmill (미세 엔드밀에 의한 마이크로 샤프트 가공기술 연구)

  • Je, T.J.;Lee, E.S.;Lee, J.C.;Choi, H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.181-184
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    • 2002
  • In these day, fabrication technologies for micro parts become more important with the increase of interest on microsystem and developed through the various approaches in the whole world. Among these technologies; micro mechanical machining is one of the most effective methods for the fabrication of micro parts. In this study, we fabricated micro shafts using micro endmill and micromachining system and measured the cutting force at the process. Also, Based on the data, we simulated the deformation of micro shafts due to the cutting force. Through the simulation results, it was verified that the cutting force at the process is enough to cause dimensional error at the micro shafts.

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Characteristics of Poly-Oxide of New Sacrificial Layer for Micromachining (마이크로머시닝을 위한 새로운 희생층인 다결정-산화막의 특성)

  • Hong, Soon-Kwan;Kim, Chul-Ju
    • Journal of Sensor Science and Technology
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    • v.5 no.1
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    • pp.71-77
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    • 1996
  • Considering that polycrystalline silicon, a structural material of the micromachining, is affected by a sacrificial oxide layer, the poly-oxide obtained by the thermal oxidation of polycrystalline silicon is newly proposed and estimated as the sacrificial oxide layer. The grain size of the polycrystalline silicon grown on the poly-oxide is larger than that of poly crystalline silicon grown on the conventional sacrificial oxide layer. As a result of XRD, increase of (111) textures and formation of additional (220) textures are observed on the polycrystaIline silicon deposited on the poly-oxide. Also, the polycrystalline silicon grown on the poly-oxide represents small and uniform stress.

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Anisotropic Etching of Silicon in Aqueous TMAH/IPA Solutions (수용성 TMAH/IPA 용액의 실리콘 이방성 식각)

  • 박진성;송승환;정귀상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.11a
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    • pp.334-337
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    • 1996
  • Si anisotropic etching is a key technology for micromachining. The main advantages of tetramethyl ammonium hydroxide (TMAH)-based solution are their full compatibility with IC process. In this work the anisotropic etching of single crystal Si in a TMAH (($CH_3$)$_4$NOH) based solution was studied. The influence of the addition of IPA to TMAH solution on their etching characteristics was also presented. The crystal planes bounding the etch front and their etch rates were determined as a function of temperature, crystal orientation, and etchant concentration. The etch rates of (100) oriented Si crystal planes decreased linearly with increasing the IPA concentration, The etched (100) planes were covered by Pyramidal-shaped hillocks below 15 wt.%, but very smooth surfaces were obtained above 20 wt.%. The addition of IPA to TMAH solution leads to smoother surfaces of sidewalls etched planes.

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A MEMS Z-axis Microaccelerometer for Vertical Motion Sensing of Mobile Robot (이동 로봇의 수직 운동 감지를 위한 초소형 MEMS Z축 가속도계)

  • Lee, Sang-Min;Cho, Dong-Il Dan
    • The Journal of Korea Robotics Society
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    • v.2 no.3
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    • pp.249-254
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    • 2007
  • 본 논문에서는 웨이퍼 레벨 밀봉 실장된 수직 운동 가속도 신호를 감지할 수 있는 초소형 Z축 가속도 센싱 엘리먼트를 제작하였다. 초소형 Z축 가속도 센싱 엘리먼트는 수직 방향의 정전용량 변화를 필요로 하기 때문에 단일 기판상에 수직 단차의 형성을 가능케 하는 확장된 희생 몸체 미세 가공 기술 (Extended Sacrificial Bulk Micromachining, ESBM) 을 이용하여 제작되었다. 확장된 희생 몸체 미세 가공 기술을 이용하면 정렬오차가 없이 상하부 양쪽에 수직 단차를 갖는 실리콘 구조물의 제작이 가능하다. 또한, MEMS 센싱 엘리먼트의 부유된 실리콘 구조물을 보호하기 위하여 웨이퍼 레벨 밀봉 실장 기술이 적용하여 고신뢰성, 고수율, 고성능의 Z축 가속도 센서를 제작하였다. 신호 처리 회로와 가속도 센서를 결합하여 Z축 가속도 센싱 시스템을 제작하였고 운동가속도 범위 10 g 이상, 정지 드리프트 17.3 mg 그리고 대역폭 60 Hz 이상의 성능을 나타내었다.

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