• Korean Chemical Engineering Research
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• v.56 no.4
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• pp.585-591
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• 2018

Characteristics of nano-structured $SiO_2:Zn$ hollow powders prepared in the micro drop fluidized reactor process were investigated with respect to bandgap energy and surface activity. The $SiO_2:Zn$ hollow powders were successfully prepared continuously in the one step process with reasonable production efficiency, with varying the amount of THAM (tris(hydroxymethyl)-aminomethane) additive and concentration of $Zn^{2+}$ ions. The doping of $Zn^{2+}$ ions into $SiO_2$ lattice led to the reduction of bandgap energy by forming the acceptor level of $Zn^{2+}$ below the conduction band of $Si^{4+}$ ions. The hollow shape also contributed to reduce the bandgap energy of $SiO_2:Zn$ powders. The doping of $Zn^{2+}$ ions into $SiO_2$ hollow powders could enhance the surface activity by forming SiO-H stretching and oxygen vacancies at the surface of $SiO_2:Zn$ powders.

• Korean Journal of Cognitive Science
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• v.23 no.1
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• pp.47-71
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• 2012

This study examined how students revised their writing after reciprocal peer review and how their revision activities were influenced by the review. Undergraduates in physics class wrote a laboratory reports, exchanged comments with peers, and revised their reports afterward based on the comments they received from their peers. The comparison between the original and the revised drafts showed that students were mainly concerned with micro-meaning revisions, focusing on making changes on individual words, clauses, and sentences. Revisions that dealt with macro-meaning of the texts were not as frequent. Giving and receiving comments influenced later revision activities. Receiving comments on micro-meaning of the texts led to a significant increase in both micro- and macro-meaning revisions. Receiving comments on macro-meaning of the texts, however, did not prompt relevant revision activities. Even when students engaged in macro revision, it was negatively related to writing performance gains in one subgroup, suggesting that even after peers point out macro-problems in their writing, students are not competent to solve the problems yet. The results of the study suggest that more efforts are needed to help them to understand and manipulate the macro-meaning structure of the texts.

• Journal of dental hygiene science
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• v.15 no.4
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• pp.419-423
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• 2015

Recently, energy drink consumption is rising. The purpose of this study was to examine the effect of energy drink on enamel erosion by measuring pH and titratable acidity in energy drink on the market. pH and titrable acidity in drink were measured by selecting 3 kinds of energy drinks with high sales volume among energy drinks on the domestic market. To evaluate the erosion level of normal enamel, the erosion level was measured by using a surface micro-hardness after soaking it in drink for 1 minute, for 3 minutes, for 5 minutes, for 10 minutes, and for 30 minutes while using 10 pieces of bovine specimens per each group. All the energy drinks were containing citric acid. As for pH in drinks, pH of Burn intense was the lowest with $2.51{\pm}0.01$. Hotsix stood at $3.16{\pm}0.01$. Redbull stood at $3.37{\pm}0.00$. In pH 5.5, the titrable acidity of Burn intense was 3.59 ml. Redbull was 3.43 ml. Hotsix was 1.92 ml. All the energy drinks were reduced the surface micro-hardness according to a rise in time of immersion. Following the 30-minute treatment in drinks, the surface micro-hardness value was indicated to be the lowest in Redbull with $119.72{\pm}15.16$ VHN. It was shown to be in order of Hotsix $208.75{\pm}10.99$ and Burn intense $210.47{\pm}8.01$. Hotsix and Burn intense had no statistically significant difference (p>0.05). Accordingly, all the energy drinks, which were used in the experiment, caused the tooth enamel erosion. Among them, Redbull led to the largest enamel erosion. Thus, energy drink containing citric acid and low pH can cause the enamel erosion. However, it is thought to be necessarily progressed by considering factors of influencing etching a little more diversely by additionally analyzing intraoral factors, acid kinds, and even the content in calcium, phosphate and fluoride.

• Journal of the Korean Vacuum Society
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• v.17 no.1
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• pp.51-57
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• 2008

we have demonstrated structural evolution and optical properties of Si-nanowires (NWs) synthesized on Si (111) substrates with nanoscale Au-Si islands by rapid thermal chemical vapor deposition (RTCVD). The Au-Si nano-islands (10-50nm in diameter) were employed as a liquid-droplet catalysis to grow Si-NWs via vapor-liquid-solid mechanism. The Si-NWs were grown by a mixture gas of SiH4 and H2 at a pressure of 1.0 Torr and temperatures of $500{\sim}600^{\circ}C$. Scanning electron microscopy measurements showed that the Si-NWs are uniformly sized and vertically well-aligned along <111> direction on Si (111) surfaces. The resulting NWs are ${\sim}60nm$ in average diameter and ${\sim}5um$ in average length. High resolution transmission microscopy measurements indicated that the NWs are single crystals covered with amorphous SiOx layers of ${\sim}3nm$ thickness. In addition, the optical properties of the NWs were investigated by micro-Raman spectroscopy. The downshift and asymmetric broadening of the Si main optical phonon peak were observed in Raman spectra of Si-NWs, which indicates a minute stress effects on Raman spectra due to a slight lattice distortion led by lattice expansion of Si-NW structures.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.69-77
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• 2024

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process. In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

• Design & Manufacturing
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• v.2 no.5
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• pp.1-4
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• 2008

LCD-BLU (Liquid Crystal Display - Back Light Unit) is one of kernel parts of LCD unit and it consists of several optical sheets(such as prism, diffuser and protector sheets), LCP (Light Guide Plate), light source (CCFL or LED) and mold frame. The LGP of LCD-BLU is usually manufactured by forming numerous dots with $50-200{\mu}m$ in diameter on it by erosion method. But the surface of the erosion dots of LGP is very rough due to the characteristics of the erosion process during the mold fabrication, so that its light loss is high along with the dispersion of light into the surface. Accordingly, there is a limit in raising the luminance of LCD-BLU. Especially, the negative and positive micro-lens pattern fabricated by modified LiGA with thermal reflow process was applied to the optical design of LGP.

• Carbon letters
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• v.26
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• pp.51-60
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• 2018

An electroless deposition method was used to modify the surface properties of rice husk ceramic particles (RHC) by depositing nano-nickel on the surface of the RHC (Ni-RHC). The dry tribological performances of aluminum matrix composite adobes containing different contents of RHC and Ni-RHC particles have been investigated using a micro-tribometer. Results showed that the Ni-RHC particles substantially improved both the friction and wear properties of the Ni-RHC/aluminum matrix adobes. The optimal concentration was determined to be 15 wt% for both the RHC and Ni-RHC particles. The improvements in the tribological properties of aluminum adobes including the Ni-RHC were ascribed to friction-induced peeling off of Ni coating and formation of protection layer on the wear zone, both of which led to low friction and wear volume.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.24-24
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• 2003

Research activity in the III-V nitrides materials system has increased markedly in the past several years ever since high-brightness blue light-emitting diodes (LEDs) became commercially available. Despite of excellent optical properties of the GaN, however, inherently poor thermal property of the sapphire used as a substrate material n these devices may lead to thermal degradation of devices, especially during their high power operation. Therefore, dependable thermal analysis and packaging schemes of GaN-based LEDs are necessary for solid lighting applications under high power operation. In this paper, emphasis will be placed upon thermal design of GaN-based LEDs. Thermal measurements of LEDs on chip and packaging scale were performed using the liquid crystal thermographic technology and micro thermocouples for different bias conditions. By a series of optical arrangement, hot spots with specific transition temperatures were obtained with increasing input power. Thermal design of LEDS was made using the finite element method and analytical unit temperature profile approach with optimal boundary conditions. The experimental results were compared to the simulated data and the results agree well enough for the establishment of dependable prediction of thermal behavior in these devices. The paper will present a more detailed understanding of the thermal analysis of the GaN-based blue and white LEDs for high power applications.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.11
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• pp.92-97
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• 2010

The object of this study is to investigate the definite method for pitting damaged surfaces. Pitting is a sort of fatigue damages and it is made by a repetitive load. For a judgment between damages or not, sensing vibrations of test equipment is simple. However, it is not only difficult to observe a growth of pitting but also impossible to detect the juncture of initial pitting. Therefore, a method for the pitting damaged area measuring technique was effectively implemented by Two Roller Machine. The change of surface damaged area was measured by an optical microscope in regular time and calculated by the use of dark and bright ratio of test specimens' pictures taken by optical microscope. In conclusion, S - N Curves gained by Failure rate - Cycle graph was led and the curves are able to be chosen as occasion demands for a failure area percentage.