• 한국전기전자재료학회논문지
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• 제22권2호
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• pp.123-127
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• 2009

In order to get more higher integration density of devices, it is getting to be used more and more micro via interconnection lines for interconnecting layers or devices. However, it is very important to enhance the electrical characteristic by reducing the electrical resistivity of micro via interconnection line because it affects the reliability of packaging. In this paper, Micro vias were patterned with a diameter from 10 to 100 um by increasing the step of 10 um and 100 um height and were fabricated by micromachining technology to investigate the electrical characteristic of micro via interconnection lines. These micro vias were filled with copper by electroplating process with appling pulse current mode. And the electrical characteristics of micro via interconnection lines were measured. The measured value of electrical resistivity shows with a range from 20 to $26\;m{\Omega}$. This value from micro via interconnection lines fabricated by pulse current mode electroplating process shows better result than the resistivity from than micro via interconnection lines fabricated by DC mode ($31\;m{\Omega}$).

• 한국정밀공학회지
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• 제26권12호
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• pp.18-22
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• 2009

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.160-163
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• 2002

Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

• 한국생산제조학회지
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• 제25권6호
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• pp.421-425
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• 2016

Micro-EDM is one of the recent fine-machining technologies. Micro-EDM is widely used in precision processes because products manufactured via EDM are free from workpiece hardness. However, the debris produced during the process cause many problems such as reduced precision of the process. The first solution of this problem involves using the milling hole process. Micro-EDM hole process involves an electrode moving rapidly in the vertical direction via a servo system to disperse debris. However, this process can cause reduced work efficiency owing to contact between the electrode and workpiece. In this study, ultrasonic vibration is added to micro-EDM channel machining. Ultrasonic vibration removes the debris during machining and enables precision machining. Consequently, a clean work environment for the subsequent processes is maintained.

• Journal of Welding and Joining
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• 제32권3호
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• pp.19-26
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• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

• Applied Science and Convergence Technology
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• 제23권1호
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• pp.54-59
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• 2014

The roll-to-roll (R2R) fabrication method to make micro-scale pillar arrays for biomimetic functionalization of surfaces is presented. Inspired by the micro-structure of plants in nature, a surface with a synthetic micro-scale pillar array is fabricated via maskless photolithography. After the surface is SAM (self-assembled monolayer) coated with trichlorosilane in a vacuum desiccator, it displays a hydrophobic property even in R2R replicas of original substrate, whose properties are further characterized using various pitches and diameters. In order to perform a comparison between the original micro-pattern and its replicas, surface morphology was analyzed using scanning electron microscopy and wetting characteristics were measured via a contact angle measurement tool with a $10{\mu}L$ water droplet. Efficient roll-to-roll imprinting for a biomimetic functionalized surface has the potential for use in many fields ranging from water repelling and self-cleaning to microfluidic chips.

• 한국기계가공학회지
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• 제16권1호
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• pp.149-156
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• 2017

Graphene nanoplatelet (GNP)-reinforced alumina ($Al_2O_3$) is a promising material for micro-partapplications, particularly micro-nozzle shapes, because of its excellent wearresistance. In this study, a $Al_2O_3$/GNPcomposite with 15 vol% graphene nanoplatelets (GNP) was highly densified and fabricated via spark plasma sintering for micro-electrical discharge drilling (Micro-ED drilling) and the wear resistance property of the composite is evaluated via the ball-on-disk method. In addition, the diameter and shape of the micro-electrodes machined by wire electrical discharge grinding (WEDG), block electrical discharge grinding (BEDG), and new linear block moving electrical discharge grinding (LBMEDG) methods are systematically compared and analyzed to observe the micro-hole machining in the micro-ED drilling of the $Al_2O_3$/15vol% GNP composite.

• 조명전기설비학회논문지
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• 제20권6호
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• pp.104-110
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• 2006

본 논문에서는 인텔사의 StrongARM 프로세서에 내장형 리눅스 운영 시스템을 실장하여 내장형 웹 서버를 구현하고 ARM프로세서에 연결된 병렬포트의 입 출력을 HTTP 프로토콜을 이용하여 범용 웹 브라우저에 의하여 제어하는 초소형 웹 서버 시스템을 구현함을 다루었다. 이를 위하여 리눅스 운영 시스템의 HTTP를 실장하고 CGI에 의한 병렬포트 제어 프로그램을 구현하여 프로세서 보드의 메모리에 실장한다. 프로세서의 병렬포트에 입 출력을 제어하는 하드웨어 기능을 웹 서버와 브라우저를 이용하여 원격에서 제어할 수 있도록 구현하고 실험을 통하여 내장형 웹 서버의 구현을 보였다.

• 소성∙가공
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• 제13권1호
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2002년도 전력전자학술대회 논문집
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• pp.697-700
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• 2002

In this paper, we proposed the micro web-server Implementation on Strong ARM processor with embedded Linux. The parallel port connecting parallel I/O is controlled via HPPT protocol and web browser program. HTTP protocol is ported into Linux and the micro web server program and port control program are installed on-board memory using CGI to be accessed by web browser, such as Internet Explore and Netscape. 8bit LED and DIP switches are connected to the processor port and the switch input status is monitored and the LED output is controlled from remote hosts vie internet. The result of the proposed embedded micro-web server can be used in automation systems, remote distributed control via internet using web browser.