• Journal of the Korean Society for Precision Engineering
• /
• v.21 no.7
• /
• pp.22-29
• /
• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Journal of the Korean Society for Heat Treatment
• /
• v.4 no.2
• /
• pp.27-37
• /
• 1991

The adhesion strength of TiN films to substrate(STC 3) steel has been studied using the scratch adhesion test. Before deposition, the substrates were mechanically polished and TiN films were deposited at different substrate temperature($480^{\circ}C-540^{\circ}C$). The chemical properties of TiN films were investigated by RBS, and EDS, and the physical properties were investigated by micro-hardness tester, SEM, and X-ray diffractometer. According to results of this study, the adhesion strength of TiN films increase with increasing the deposition temperature. The roughness of the polished substrates surface were measured with a profilometer. It was observed that, as a general rule, the adhesion strength of deposited TiN films increase with decreasing the substrates surface roughness.

• Proceedings of the Polymer Society of Korea Conference
• /
• 2006.10a
• /
• pp.142-143
• /
• 2006

Combinatorial methods are being used increasingly to develop the next generation of polymers, coatings and adhesive formulations. Allied to this approach, a new genre of measurement and characterization methods are emerging. These characterization techniques are required to handle and take measurements from small samples. This has led to a number of uses for this technology which usefully fall between convention test specimen and micro- or nano-scale test methods. A versatile measurement platform will be presented which can offer useful indentation, puncture, compression, adhesion and scratch resistance data for a wide variety of material types and that continues to develop and evolve in capability.

• Journal of the Korean institute of surface engineering
• /
• v.47 no.1
• /
• pp.13-19
• /
• 2014

The various surface treated conditions of Fe-3.0%Ni-0.7%Cr-1.4%Mn-X steel such as as-received, ion nitriding, DLC coated, DLC coated after nitriding for 3 hrs and 6 hrs were investigated to evaluate the beneficial effect for plastic mold steel. Micro Vickers hardness tester was used to estimate nitriding depth from the hardness profile and to measure hardness on the surface. Elastic modulus and residual stress were measured by a nanoindentator. Scratch test and SP (small ball punch test) were utilized to assess the adhesive strength of DLC coating. The depth of nitriding layer was measured as $50{\mu}m$ for the condition of 3 hrs nitriding and $90{\mu}m$ for that of 6 hrs nitriding. Hardness, elastic modulus, residual stress of DLC coating were 20.37 GPa, 162.78 GPa and -1456 MPa respectively. Residual stress on the surface of DLC coating after nitriding could increase to -3914 MPa by introducing nitriding before DLC coating. During the 'Ball-On-Disc' test ${\gamma}^{\prime}$ particles pulled out from the surface of nitrized layer tend to enhance abrasive wear mode since the fraction of ${\gamma}^{\prime}$ (Fe4N) in ion-nitrized layer is known to increases with nitriding time. Thus the specific wear rate of the nitriding layer increased. Comparing with nitriding the specific wear rate in work piece disc as well as ball decreased prominently in DLC coating due to the remarkable reduction in friction coefficient.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.47-52
• /
• 2018

In this study, the effects of the heat treatment and multi-scale hierarchical structures on the durability of the nano-patterned functional PMMA(Poly(methyl-methacrylate)) film was evaluated. The heat treatments that consisted of high-pressure/high-temperature flat pressing and rapid cooling process were employed to improve mechanical property of the PMMA films. Multi-scale hierarchical structures were fabricated by thermal nanoimprint to protect nano-scale structures from the scratch. Examination on surface structures and functionalities such as wetting angle and transmittance revealed that the preopposed heat treatment and multi-scale hierarchical structures are effective to minimize surface damages.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1398-1401
• /
• 2005

The nano/microstructure, the aging response (in T5 heat treatment), and the mechanical/tribological properties of the eutectic regions in squeeze-cast A356 alloy were investigated using nano/micro-indentation and mechanical scratching, combined wit optical microscopy and atomic force microscope(AFM). Most eutectic Si crystals in the A356 alloy showed a modified morphology as fine-fibers. The loading curve for the eutectic region was more irregular than that of the primary Al region due to the presence of various particles of varying strength. In addition, the eutectic region showed lower pile-up and higher elastic recovery than the primary Al region. The aging responses of the eutectic regions in the squeeze-cast A356 alloys aged at $150^{\circ}C$ for different times(0, 2, 4, 8, 10, 16, 24, 36 and 72 h) were investigated. As the aging time increased, acicular Si particles in the eutectic regions gradually came to a fine structure. Both Vickers hardness ($H_V$) and indentation ($H_{IT}$) test results showed almost the same trend of aging curves, and the peak was obtained at the same aging time of 10 h. A remarkable size-dependence of the tests was found. The friction coefficient for the eutectic region was lower than that for the primary Al region.

• Journal of the Korean institute of surface engineering
• /
• v.42 no.4
• /
• pp.179-185
• /
• 2009

Diamond-like carbon(DLC) films were deposited by linear ion source(LIS)-physical vapor deposition method changing the anode voltages from 800 V to 1800 V, and characteristics of the films were investigated using residual stress tester, nano-indentation, micro raman spectroscopy, scratch tester and Field Emission Scanning Electron Microscope(FE-SEM). The results showed that the residual stress and hardness increased with increasing the ion energy up to anode voltage of 1400 V. It was also found that the content of $SP^3$ carbon increased with increasing the anode voltage $SP^3/SP^2$ ratio through investigation of $SP^3/SP^2$ ratio by the micro-raman analysis. From these results, it can be concluded that the physical properties of DLC films such as residual stress and hardness are increased with increasing the anode voltage. These results can be explained that 3-dimensional cross-links between carbon atoms and Dangling bond are enhanced and the internal compressive stress also increased with increasing the anode voltage. The optimal anode voltage is considered to be around 1400 V in these experimental conditions.

• Tribology and Lubricants
• /
• v.35 no.5
• /
• pp.274-285
• /
• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2016.02a
• /
• pp.166.1-166.1
• /
• 2016

각종 부품의 내마모성 및 내식성을 개선하기 위해서 금속물질에 나노두께의 보호막층을 입혀 경도를 높이는 표면처리 기술이 개발되고 있다. TiN막은 기계적 경도, 내마모성 및 내식성이 우수하여 수없이 연구되어 왔으며 박막의 두께에 따라 다양한 색상표현이 가능하다는 연구도 진행되고 있다. 이러한 TiN 박막의 연구결과로 높은 경도와 강도를 요하는 절삭공구에 하드 코팅을 이용하여 높은 절삭력으로 고효율적인 작업환경을 조성할 수 있다. 기존에 연구되어 온 TiN박막은 Ar과 N2의 혼합가스 분위기에서 증착된 반면 본 실험에서는 영구자석을 이용한 고밀도 플라즈마로 높은 점착성과 균일한 박막 및 대면적 공정이 가능한 RF-magnetron sputtering방법을 이용하여 N2 분위기에서 TiN박막을 $100^{\circ}C{\sim}400^{\circ}C$의 온도범위에서 $100^{\circ}C$간격으로 열처리 후 증착하여 비교실험을 하였다. 이와 같이 제작된 TiN박막을 XRD(X-ray Diffraction)를 사용하여 결정성을 확인한 결과 온도가 높을수록 (111)방향의 결정성장이 뚜렷하게 나타났으며 그 외 Scratch Test와 HM-220(Micro-vicker's tester)를 사용하여 경도특성을 확인하고 SEM(Scanning Electron Microscope), AFM(Atomic Force Microscope)를 이용하여 박막의 표면형상을 측정하였다. 이러한 측정 결과로 향후에는 높은 내마모성 및 초경도가 요구되는 절삭공구 및 경질표면코팅이 필요한 금속산업분야에 적용이 가능 할 것이라 사료된다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.47-47
• /
• 1999

2.45 GHz 마이크로웨이브를 이용하는 electron cyclotron resonance plasma enhanced chemical vapor deposition(ECR-PECVD)방법으로 다이아몬드성 탄소박막(diamond-like carbon, DLC)을 증착하였다. DLC 박막의 산업 응용을 위해서는 높은 경도와 밀착력이 필요하다. 그래서 본 실험에서는 DLC 박막의 산업 응용을 위하여 ECR-PECVD 방법으로 증착된 DLC 박막의 분석결과로부터 DLC 박막의 물성과 증착조건의 관계를 조사하였다. 기판으로는 실리콘 웨이퍼와 실험용 SUS 판을 사용하였다. 아르곤 가스를 주입하여 ECR 마이크로 웨이브 플라즈마와 negative DC bias로 기판을 플라즈마 세척한 후, 수소와 메탄가스를 반응기체로 하여 DLC 박막을 증착하였다. 박막 증착시에 13.56MHz RF 전원 공급장치로 기판에 전원을 공급하였다. DLC 박막 증착의 변수는 반응기체의 호합율, 마이크로웨이브 파워, 프로세스 압력 및 RF 전원공급장치에서 유도되는 negative self DC bias 등이다. 이때 사용된 반응기체의 혼합율(메탄/수소)은 10~50%이고, 수소 가스 흐름율은 100sccm, 메탄은 10~50sccm이다. 마이크로웨이브의 크기는 360~900W, negative self DC bias는 -500~-10 V였다. 그리고 본 실험에서는 높은 증착율을 고려하여 프로세스 압력을 10~30mTorr까지 조절하였다. ER-PECVD 방법으로 증착된 DLC 박막은 SEM으로 단면, $\alpha$-Step으로 두께, Raman 분광계로 탄소 결합구조, FTIR 분광계로 탄소와 수소 결합구조, Micro-Hardness로 경도 그리고 Scratch Tester로 밀착력 등을 분석하였다.