• Title/Summary/Keyword: micro-lithography

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Nano-mold fabrication for imprinting lithography (나도 Imprinting 을 위한 몰드 제작에 관한 연구)

  • Lee, Jin-Hyung;Lim, Hyun-Uoo;Kim, Tae-Gon;Lee, Seung-Seoup;Park, Jin-Goo;Lee, Eun-Kyu;Kim, Yang-Sun;Han, Chang-Su
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1073-1077
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    • 2003
  • This study aims to investigate the fabrication process of nano silicon mold using electron beam lithography (EBL) to generate the nanometer level patterns by nano-imprinting technology. the nano-patterned mold including 100mm pattern size has been fabricated by EBL with different doses ranged from 22 to 38 ${\mu}C/cm^2$ on silicon using the conventional polymethylmetharcylate(PMMA) resist. The silicon mold is fabricated with various patterns such as circles, rectangles, crosses, oblique lines and mixed forms, The effect of dosage on pattern density in EBL is discussed based on SEM (Scannning Electron Microscopy) analysis of fabricated molds. The mold surface is modified by hydrophobic fluorocarbon (FC) thin films to avoid the stiction during nano-imprinting process.

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Dynamic Analysis of the Piezo-Actuator for a New Generation Lithography System (차세대 리소그라피 시스템을 위한 압전구동기의 동적 해석)

  • Park, Jae-Hak;Jung, Jong-Chul;Huh, Kun-Soo;Chung, Chung-Choo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.3
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    • pp.472-477
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    • 2003
  • A piezo-actuator is an important component for an E-beam lithography system. But it is very difficult to model its characteristics due to nonlinearities such as hysteresis and creep, to the input voltage. In this paper, one-axis micro stage with a piezo-actuator is modeled including the nonlinear properties. Hysteresis and creep are modeled as the first order differential equation and a time-dependent logarithmic function, respectively. The dynamic motion of the stage is also modeled as a mass-spring-damper system and the parameters are determined by utilizing the system identification technique. The simulation tool for a micro stage is constructed using the commercial software and its simulation results are compared with the experimental data.

Optical CAD and Analyses of Four Spherical Mirror System for Micro-Lithography (Micro-Lithography를 위한 4 구면경계의 설계 및 수차해석)

  • 조영민
    • Proceedings of the Optical Society of Korea Conference
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    • 1991.06a
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    • pp.88-89
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    • 1991
  • For the micro-lithography using a KrF excimer laser beam(λ=0.248${\mu}{\textrm}{m}$) a mirror system consisting of four spherical surfaces with reduction magnification 5$\times$ is designed. Initially the aplanat condition of the mirror system is considered. And for the further improved performance of the system the distortion free condition and flat field condition within Seidel 3rd order aberrations are added to the above condition. During the process of designing the computer-aided optimization technique is extensively employed. The spherical aberration, coma, field curvature and distortion of the optimized four-spherical mirror system are removed to the diffraction limit, and residual astigmatism and off-axial vignetting are not corrected enough.

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Four Spherical Mirror Stepper Optics for Deep UV Micro-Lithography (Deep UV 마이크로 리소그라피용 Stepper를 위한 4구면 반사경계)

  • 조영민;이상수;박성찬
    • Korean Journal of Optics and Photonics
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    • v.2 no.4
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    • pp.186-192
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    • 1991
  • For the micro-lithography using a excimer laser beam $(\lambda\leq0.248$\mu\textrm{m})$. a mirror system consisting of four spherical surfaces with reductlon magnification 5X is designed. Initially the aplanat, flat field and the distortion free condition of the system are analytically investigated within Seidel 3rd order aberrations. And the computer-aided optimization technique has been employed for the further improved performance of the system. The final system has N.A. of 0.15 and image field diameter 3.3 mm, and has the diffraction-limited performance for KrF eximer laser beam.

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X-ray grayscale lithography for sub-micron lines with cross sectional hemisphere for Bio-MEMS application (엑스선 그레이 스케일 리소그래피를 활용한 반원형 단면의 서브 마이크로 선 패턴의 바이오멤스 플랫폼 응용)

  • Kim, Kanghyun;Kim, Jong Hyun;Nam, Hyoryung;Kim, Suhyeon;Lim, Geunbae
    • Journal of Sensor Science and Technology
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    • v.30 no.3
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    • pp.170-174
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    • 2021
  • As the rising attention to the medical and healthcare issue, Bio-MEMS (Micro electro mechanical systems) platform such as bio sensor, cell culture system, and microfluidics device has been studied extensively. Bio-MEMS platform mostly has high resolution structure made by biocompatible material such as polydimethylsiloxane (PDMS). In addition, three dimension structure has been applied to the bio-MEMS. Lithography can be used to fabricate complex structure by multiple process, however, non-rectangular cross section can be implemented by introducing optical apparatus to lithography technic. X-ray lithography can be used even for sub-micron scale. Here in, we demonstrated lines with round shape cross section using the tilted gold absorber which was deposited on the oblique structure as the X-ray mask. This structure was used as a mold for PDMS. Molded PDMS was applied to the cell culture platform. Moreover, molded PDMS was bonded to flat PDMS to utilize to the sub-micro channel. This work has potential to the large area bio-MEMS.

A study on processing characteristics of plasma etching using photo lithography (Photo lithography을 이용한 플라즈마 에칭 가공특성에 관한 연구)

  • Baek, Seung-Yub
    • Design & Manufacturing
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    • v.12 no.1
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    • pp.47-51
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    • 2018
  • As the IT industry rapidly progresses, the functions of electronic devices and display devices are integrated with high density, and the model is changed in a short period of time. To implement the integration technology, a uniform micro-pattern implementation technique to drive and control the product is required. The most important technology for the micro pattern generation is the exposure processing technology. Failure to implement the basic pattern in this process cannot satisfy the demands in the manufacturing field. In addition, the conventional exposure method of the mask method cannot cope with the small-scale production of various types of products, and it is not possible to implement a micro-pattern, so an alternative technology must be secured. In this study, the technology to implement the required micro-pattern in semiconductor processing is presented through the photolithography process and plasma etching.