• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• Structural Monitoring and Maintenance
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• 제6권3호
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• pp.173-190
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• 2019

Steel-confined reinforced concrete (SCRC) columns feature highly complex and invisible mechanisms that make damage evaluation and pattern recognition difficult. In the present article, the prevailing acoustic emission (AE) technique was applied to monitor and evaluate the damage process of steel-confined RC columns in a quasi-static test. AE energy-based indicators, such as index of damage and relax ratio, were proposed to trace the damage progress and quantitatively evaluate the damage state. The fuzzy C-means algorithm successfully discriminated the AE data of different patterns, validity analysis guaranteed cluster accuracy, and principal component analysis simplified the datasets. A detailed statistical investigation on typical AE features was conducted to relate the clustered AE signals to micro mechanisms and the observed damage patterns, and differences between steel-confined and unconfined RC columns were compared and illustrated.

• 한국진공학회지
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• 제20권3호
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• pp.217-224
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• 2011

최근, 결정질 실리콘 태양전지 분야에서 저가격화와 공정의 단순화가 가장 중요한 부분으로 대두되고 있다. 특히 태양전지 가격의 대부분을 차지하고 있는 웨이퍼의 저가격화가 가장 큰 이슈로 떠오르면서, 웨이퍼의 저가격화를 실현하기 위한 최선의 방안으로 마이크로 블라스터를 이용한 재생웨이퍼 제작 방법이 대두되고 있다. 마이크로 블라스터를 이용하여 재생웨이퍼를 제작 할 경우, 표면의 요철이 형성되어 반사율이 감소되어 태양전지 내부로 입사하는 빛의 양을 증가시키는 긍정적인 효과가 있다. 또한, 공정비용이 저렴하여 태양전지 저가격화를 실현할 수 있다. 그러나, 마이크로 블라스터를 이용한 공정은 웨이퍼에 물리적인 충격을 주기 때문에 표면에 크랙이 형성되며 식각 잔여물들이 표면에 재흡착되는 단점이 있다. 본 연구에서는 이러한 단점들을 보완하기 위하여 DRE (Damage Remove Etching)를 수행하였다. DRE 공정 후 반사율과 소수 반송자 수명을 측정하여 미세 파티클과 마이크로 크랙의 제거를 확인하였고, 태양전지를 제작하여 효율에 미치는 영향을 분석하였다. 마이크로 블라스터 공정 후 웨이퍼의 소수 반송자 수명은 Bare 웨이퍼에 비해 80% 정도 감소하였으나, DRE 공정 수행 후에는 50% 까지 증가하였음을 확인할 수 있었다. 태양전지 효율을 비교해보면, DRE 공정을 수행한 웨이퍼의 경우 Bare 웨이퍼보다 약 1~2%, DRE 공정을 수행하지 않은 웨이퍼보다 약 3∼5% 증가했음을 확인하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.251-255
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• 2003

This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate super-elastic alloy based micro gripper. It is tested to present improvement of mechanical performance. For integration of force sensor on the micro gripper, the sensor design based on the piezoelectric polymer PVDF film and fabrication process are presented. The calibration and performance test of force sensor integrated micro gripper are experimentally carried out. The force sensor integrated micro gripper is applied to perform fine alignment tasks of micro opto-electrical components. It successfully supplies force feedback to the operator through the haptic device and plays a main role in preventing damage of assembly parts by adjusting the teaching command.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 추계 학술발표회 논문집
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• pp.253-256
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• 2006

The HPFRCCs show the multiple crack and damage tolerance capacity due to the interfacial bonding of the fibers to the cement matrix. For practical application, it is needed to investigate the fractural behavior and of HPFRCCs and understand the micro-mechanism of cement matrix with reinforcing fiber. The objectives of this paper are to examine the compressive behavior, fracture and damage process of HPFRCC by acoustic emission technique. Total four series were tested, and the main variables were the hybrid type, polyethylene (PE) and steel cord (SC), and fiber volume fraction. The damage progress by compressive behavior of the HPFRCCs is characteristic for the hybrid fiber type and volume fraction. And from acoustic emission (AE) parameter value, it is found that the second and third compressive load cycles resulted in successive decrease of the ring-down count rate as compared with the first compressive load cycle.

• 센서학회지
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• 제19권4호
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• pp.291-296
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• 2010

Recently, recycling method of waste wafer has been an area of solar cell to cut costs. Micro_blasting is one of the promising candidates for recycling of waste wafer due to their extremely simple and cost-effective process. In this paper, we attempt to explore the effect of micro_blasting and DRE(damage removal etching) process for solar cell. The optimal process conditions of micro_blasting are as follows: $10{\mu}m$ sized $Al_2O_3$ powder, jetting pressure of 400 kPa, and scan_speed of 30 cm/s. And the particles formed on micro_blasted wafer were removed by DRE precess which was performed by using HNA(HF/$HNO_3$/$CH_3COOH$) and TMAH(tetramethyl ammonium hydroxide). Structural analysis was done using a-step and the XRD patterns.

• Transactions on Electrical and Electronic Materials
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• 제6권3호
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• pp.87-90
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• 2005

$SiO_2$ via-hole etching with a high aspect ratio is a key process in fabricating ULSI devices; however, accumulated charge during plasma etching can cause etching stop, micro-loading effects, and charge build-up damage. To alleviate this concern, charge-up damage sensor was fabricated for the ultimate goal of real-time monitoring of accumulated charge. As an effort to reach the ultimate goal, fabricated sensor was used for electrical potential measurements of via holes between two poly-Si electrodes and roughly characterized under various plasma conditions using statistical design of experiment (DOE). The successful identification of potential difference under various plasma conditions not only supports the evidence of potential charge-up damage, but also leads the direction of future study.

• 한국군사과학기술학회지
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• 제17권1호
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• pp.82-89
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• 2014

The damage in germanium (Ge) optical window irradiated by a near-infrared continuous wave (CW) laser was studied. Laser-induced heating and melting process were surveyed, and the specific laser power and the irradiance time to melt were estimated by numerical simulation. The experiments were also carried out to investigate the macro and micro structure change on Ge window. Results showed that the surface deformation was formed by melting and resolidification process, the damaged surface had a polycrystalline phase, and the transmittance as an optical performance factor in mid-infrared region was decreased. We confirmed that an abnormal polycrystalline phase and surface deformation effect such as hillock formation and roughness increase reduced the transmittance of Ge window and were the damage mechanism of CW laser induced damage on Ge window.

• 대한조선학회논문집
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• 제29권4호
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• pp.179-192
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• 1992

연속해 손상역학 분야의 열역학적 정식화 과정에 따라 연성재료의 탄소성-손상 구성방정식을 유도하였다. 이때, 재료 내부의 비가역적인 열역학적 상태변화를 표현하는 소성변형, 손상진전 등의 물리적현상을 내부상태변수로 간주하였다. 이 새로운 구성방정식 모형을 실제 문제에 적용함으로써 연성재료의 탄소성 거동 뿐만 아니라 재료의 자체가 손상을 입어 약화되는 과정 까지도 합리적으로 예측 가능함을 확인할 수 있었다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 제5회 압연심포지엄 신 시장 개척을 위한 압연기술
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• pp.184-196
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• 2004

An Eulerian finite element analysis for the steady state rolling process is addressed. This analysis combines the crystal plasticity theory fur texture development as well as the continuum damage mechanics for growth of micro voids. Although an Eulerian analysis for steady state rolling has many advantages, it needs an initial assumption about the shape of control volume. However, the assumed control volume does not match the final shapes. To effectively predict the correct shape in an assumed control volume, a free surface correction algorithm and a streamline technique are introduced. Applications to plate rolling, clad rolling, and shape rolling will be given and the results will be discussed in detail.