• 제목/요약/키워드: micro printing

검색결과 220건 처리시간 0.03초

적층 방식 3차원 프린팅에 의한 미세유로 칩 제작 공정에서 프린팅 방향 및 적층 두께의 영향에 관한 연구 (Study on Effect of the printing direction and layer thickness for micro-fluidic chip fabrication via SLA 3D printing)

  • 진재호;권다인;오재환;강도현;김관오;윤재성;유영은
    • Design & Manufacturing
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    • 제16권3호
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    • pp.58-65
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    • 2022
  • Micro-fluidic chip has been fabricated by lithography process on silicon or glass wafer, casting using PDMS, injection molding of thermoplastics or 3D printing, etc. Among these processes, 3D printing can fabricate micro-fluidic chip directly from the design without master or template for fluidic channel fabricated previously. Due to this direct printing, 3D printing provides very fast and economical method for prototyping micro-fluidic chip comparing to conventional fabrication process such as lithography, PDMS casting or injection molding. Although 3D printing is now used more extensively due to this fast and cheap process done automatically by single printing machine, there are some issues on accuracy or surface characteristics, etc. The accuracy of the shape and size of the micro-channel is limited by the resolution of the printing and printing direction or layering direction in case of SLM type of 3D printing using UV curable resin. In this study, the printing direction and thickness of each printing layer are investigated to see the effect on the size, shape and surface of the micro-channel. A set of micro-channels with different size was designed and arrayed orthogonal. Micro-fluidic chips are 3D printed in different directions to the micro-channel, orthogonal, parallel, or skewed. The shape of the cross-section of the micro-channel and the surface of the micro-channel are photographed using optical microscopy. From a series of experiments, an optimal printing direction and process conditions are investigated for 3D printing of micro-fluidic chip.

미세접촉인쇄기법의 설계와 다중스케일해석 (Design and Multi-scale Analysis of Micro Contact Printing)

  • 김정엽;김재현;최병익
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2003년도 추계학술대회
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    • pp.1927-1931
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    • 2003
  • Nanometer-sized structures are being applied to many fields including micro/nano electronics, optoelectronics, quantum computing, biosensors, etc. Micro contact printing is one of the most promising methods for manufacturing the nanometer-sized structures. The crucial element for the micro contact printing is the nano-resolution printing technique using polymeric stamps. In this study, a multi-scale analysis scheme for simulating the micro contact printing process is proposed and some useful analysis results are presented. Using the slip-link model [1], the dependency of viscoelasticity on molecular weight of polymer stamp is predicted. Deformation behaviors of polymeric stamps are analyzed using finite element method based upon the predicted viscoelastic properties.

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Surface energy control of ITO substrate for Inkjet printing of PEDOT/PSS

  • Kim, M.K.;Lee, S.H.;Hwang, J.Y.;Kang, K.T.;Kang, H.S.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.523-525
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    • 2008
  • Inkjet printing is being considered as an alternative to the conventional lithography in the electronic industry. Surface energy control of substrate is a critical issue in controlling the dimension of microstructures by the inkjet printing. This study introduces the surface energy control of ITO substrate for in/q'et printing of PEDOT/PSS.

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스크린 인쇄용 미세 범프 금속마스크의 변형특성 해석 (Deformation Analysis of a Metal Mask for the Screen Printing of Micro Bumps)

  • 이기연;이혜진;김종봉;박근
    • 한국생산제조학회지
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    • 제21권3호
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    • pp.408-414
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    • 2012
  • Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

나노 금속잉크의 미세 액적 토출을 이용한 마이크로 패터닝 (Micro Patterning of Conductive Line by Micro Droplet Ejection of Nano Metal Ink)

  • 서상훈;박성준;정현철;정재우
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.689-693
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    • 2005
  • Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. For the application of inkjet printing to electronic field, one of the key factors is exact realization of designed images into printed patterns. In this work, micro patterning for conducting line has been studied using the piezoelectric print head and silver nano ink. Dimensions of printed images have been predicted in terms of print resolution and diameter of a single dot. The predicted and the measured values showed consistent results. Using the results, the design capability for industrial inkjet printing could be achieved.

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스텐실 프린팅 공정에서 미세범프의 성형성 향상을 위한 연구 (Improvement of Filling Characteristics of Micro-Bumps in the Stencil Printing Process)

  • 서원상;민병욱;박근;이혜진;김종봉
    • 한국생산제조학회지
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    • 제21권1호
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    • pp.26-32
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    • 2012
  • In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.

Fabrication of Micro Wall with High Aspect Ratio using Iterative Screen Printing

  • Yoon, Seong-Man;Jo, Jeong-Dai;Yu, Jong-Su;Yu, Ha-Il;Kim, Dong-Soo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1486-1489
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    • 2009
  • Micro wall is fabricated using iterative screen printing that it is able to fabricate the pattern as low cost, simple process, formation of pattern at large area on the various substrates. In the process of micro wall fabrication using screen printing, the printing result with pressure change in process and improvement of surface roughness using hydrophillic plasma treatment are included. Height of micro wall increase linearly and precision of iteration is very high. Error rate of printed pattern width is very high, but change rate of width is under 10 %. Fabricated micro pattern have minimum width $48.75{\mu}m$ and maximum height $75.45{\mu}m$ with aspect ratio 1.55.

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잉크젯 인쇄 기술을 이용한 인쇄회로기판용 나노구리배선 개발 (Cu Line Fabricated with Inkjet Printing Technology for Printed Circuit Board)

  • 서상훈;이로운;윤관수;정재우;이희조;육종관
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1806-1809
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    • 2008
  • Study that form micro pattern by direct ink jet printing method is getting attention recently. Direct ink jet printing spout fine droplet including nano metal particle by force or air pressure. There is reason which ink jet printing method is profitable especially in a various micro-patterning technology. It can embody patterns directly without complex process such as mask manufacture or screen-printing for existent lithography. In this study, research of a technology that ejects fine droplet form of Pico liter and forms metal micro pattern was carried with inkjet head of piezoelectricity drive system. Droplet established pattern while ejecting consecutively and move on the surface at the fixed speed. Patterns formed in ink are mixed with organic solvent and polymer that act as binder. So added thermal hardening process after evaporate organic solvent at isothermal after printing. I executed high frequency special quality estimation of CPW transmission line to confirm electrical property of manufactured circuit board. We tried a large area printing to confirm application possibility of an ink jet technology.

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